| Patent | Date |
|---|
RF front end module including hybrid filter and active circuits in a single package
Grant 11,456,721 - Eid , et al. September 27, 2 | 2022-09-27 |
Mmwave waveguides featuring power-over-waveguide technology for automotive applications
Grant 11,437,693 - Dogiamis , et al. September 6, 2 | 2022-09-06 |
Package with side-radiating wave launcher and waveguide
Grant 11,437,706 - Dogiamis , et al. September 6, 2 | 2022-09-06 |
Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications
Grant 11,430,751 - Aleksov , et al. August 30, 2 | 2022-08-30 |
Microelectronic Devices Designed With Compound Semiconductor Devices And Integrated On An Inter Die Fabric
App 20220246554 - KAMGAING; Telesphor ; et al. | 2022-08-04 |
Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements
Grant 11,394,094 - Kamgaing , et al. July 19, 2 | 2022-07-19 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric
Grant 11,387,200 - Dogiamis , et al. July 12, 2 | 2022-07-12 |
Stiffener And Socket Embedded Metal Insert Architectures For Power Delivery
App 20220199551 - JAIN; Amit Kumar ; et al. | 2022-06-23 |
Microelectronic Package With Substrate-integrated Components
App 20220201843 - Dogiamis; Georgios ; et al. | 2022-06-23 |
Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric
Grant 11,367,708 - Nair , et al. June 21, 2 | 2022-06-21 |
Waveguides with active or passive repeaters for range extension
Grant 11,367,937 - Dogiamis , et al. June 21, 2 | 2022-06-21 |
Multi-filter Die
App 20220190806 - Dogiamis; Georgios ; et al. | 2022-06-16 |
Dielectric Waveguide Including A Dielectric Material With Cavities Therein Surrounded By A Conductive Coating Forming A Wall For The Cavities
App 20220173489 - Dogiamis; Georgios ; et al. | 2022-06-02 |
Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric
Grant 11,335,651 - Kamgaing , et al. May 17, 2 | 2022-05-17 |
Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities
Grant 11,329,359 - Dogiamis , et al. May 10, 2 | 2022-05-10 |
Capacitor-wirebond pad structures for integrated circuit packages
Grant 11,328,986 - Aleksov , et al. May 10, 2 | 2022-05-10 |
Multi-filter die
Grant 11,316,497 - Dogiamis , et al. April 26, 2 | 2022-04-26 |
Waveguide coupling systems and methods
Grant 11,309,619 - Oster , et al. April 19, 2 | 2022-04-19 |
Microelectronic package with substrate-integrated components
Grant 11,310,907 - Dogiamis , et al. April 19, 2 | 2022-04-19 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20220102261 - ELSHERBINI; Adel A. ; et al. | 2022-03-31 |
Hybrid filters and packages therefor
Grant 11,283,427 - Kamgaing , et al. March 22, 2 | 2022-03-22 |
Radio Frequency Antennas And Waveguides For Communication Between Integrated Circuit Devices
App 20220084962 - Aleksov; Aleksandar ; et al. | 2022-03-17 |
In-package Rf Waveguides As High Bandwidth Chip-to-chip Interconnects And Methods For Using The Same
App 20220084965 - ALEKSOV; Aleksandar ; et al. | 2022-03-17 |
Pluggable MM-wave module for rack scale architecture (RSA) servers and high performance computers (HPCS)
Grant 11,251,512 - Dogiamis , et al. February 15, 2 | 2022-02-15 |
Semiconductor package having a coaxial first layer interconnect
Grant 11,244,912 - Vadlamani , et al. February 8, 2 | 2022-02-08 |
High performance integrated RF passives using dual lithography process
Grant 11,227,825 - Elsherbini , et al. January 18, 2 | 2022-01-18 |
Components For Millimeter-wave Communication
App 20210408657 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408656 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408653 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408652 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408654 - Correas-Serrano; Diego ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210407934 - Prabhu Gaunkar; Neelam ; et al. | 2021-12-30 |
Components For Millimeter-wave Communication
App 20210408655 - Prabhu Gaunkar; Neelam ; et al. | 2021-12-30 |
In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same
Grant 11,211,345 - Aleksov , et al. December 28, 2 | 2021-12-28 |
Patch On Interposer Package With Wireless Communication Interface
App 20210400740 - KAMGAING; Telesphor | 2021-12-23 |
Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies
Grant 11,206,008 - Dogiamis , et al. December 21, 2 | 2021-12-21 |
Methods For Conductively Coating Millimeter Waveguides
App 20210376437 - Aleksov; Aleksandar ; et al. | 2021-12-02 |
Rfic Having Coaxial Interconnect And Molded Layer
App 20210358872 - PIETAMBARAM; Srinivas V. ; et al. | 2021-11-18 |
Dispersion reduced dielectric waveguide comprising dielectric materials having respective dispersion responses
Grant 11,165,129 - Dogiamis , et al. November 2, 2 | 2021-11-02 |
Dual-substrate waveguide filter
Grant 11,158,917 - Aleksov , et al. October 26, 2 | 2021-10-26 |
Patch on interposer package with wireless communication interface
Grant 11,140,723 - Kamgaing October 5, 2 | 2021-10-05 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210296175 - Aleksov; Aleksandar ; et al. | 2021-09-23 |
RFIC having coaxial interconnect and molded layer
Grant 11,107,781 - Pietambaram , et al. August 31, 2 | 2021-08-31 |
Blade computing system with wireless communication between blades within a blade enclosure
Grant 11,109,428 - Kamgaing , et al. August 31, 2 | 2021-08-31 |
Single side band transmission over a waveguide
Grant 11,108,433 - Braunisch , et al. August 31, 2 | 2021-08-31 |
Microelectronic Devices Designed With Mold Patterning To Create Package-level Components For High Frequency Communication Systems
App 20210265732 - EID; Feras ; et al. | 2021-08-26 |
Semiconductor Package Including A Modular Side Radiating Waveguide Launcher
App 20210265288 - DOGIAMIS; GEORGIOS ; et al. | 2021-08-26 |
Methods for conductively coating millimeter waveguides
Grant 11,095,012 - Aleksov , et al. August 17, 2 | 2021-08-17 |
Microelectronic Package With Mold-integrated Components
App 20210233856 - Dogiamis; Georgios ; et al. | 2021-07-29 |
Inorganic dies with organic interconnect layers and related structures
Grant 11,062,947 - Aleksov , et al. July 13, 2 | 2021-07-13 |
Microelectronic devices designed with foldable flexible substrates for high frequency communication modules
Grant 11,056,765 - Kamgaing , et al. July 6, 2 | 2021-07-06 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems
Grant 11,050,155 - Eid , et al. June 29, 2 | 2021-06-29 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210193518 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210193519 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Low-weight Single Mm-wave Dielectric Waveguide Interconnect Architecture In Autonomous Cars
App 20210194966 - DOGIAMIS; Georgios C. ; et al. | 2021-06-24 |
Broadband Acoustic Wave Resonator (awr) Filters
App 20210194459 - Alavi; Hossein ; et al. | 2021-06-24 |
Multiplexer And Combiner Structures Embedded In A Mmwave Connector Interface
App 20210194106 - KAMGAING; Telesphor ; et al. | 2021-06-24 |
Substrate dielectric waveguides in semiconductor packages
Grant 11,037,892 - Nair , et al. June 15, 2 | 2021-06-15 |
Multi-filter Die
App 20210175873 - Dogiamis; Georgios ; et al. | 2021-06-10 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric
Grant 11,031,666 - Elsherbini , et al. June 8, 2 | 2021-06-08 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer
Grant 11,024,933 - Rawlings , et al. June 1, 2 | 2021-06-01 |
Microelectronic Package With Substrate-integrated Components
App 20210160999 - Dogiamis; Georgios ; et al. | 2021-05-27 |
Microelectronic package with mold-integrated components
Grant 11,011,470 - Dogiamis , et al. May 18, 2 | 2021-05-18 |
Monolithic die with acoustic wave resonators and active circuitry
Grant 10,998,879 - Kamgaing , et al. May 4, 2 | 2021-05-04 |
Microelectronic Package With Mold-integrated Components
App 20210125931 - Dogiamis; Georgios ; et al. | 2021-04-29 |
Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom
Grant 10,992,017 - Kamgaing , et al. April 27, 2 | 2021-04-27 |
Multiplexer and combiner structures embedded in a mmwave connector interface
Grant 10,992,016 - Kamgaing , et al. April 27, 2 | 2021-04-27 |
Cross talk and interference reduction for high frequency wireless interconnects
Grant 10,992,021 - Elsherbini , et al. April 27, 2 | 2021-04-27 |
Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide
Grant 10,964,992 - Dogiamis , et al. March 30, 2 | 2021-03-30 |
Dual-substrate Waveguide Filter
App 20210091443 - Aleksov; Aleksandar ; et al. | 2021-03-25 |
Radio frequency (RF) module with shared inductor
Grant 10,951,248 - Kamgaing , et al. March 16, 2 | 2021-03-16 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections
Grant 10,950,919 - Kamgaing , et al. March 16, 2 | 2021-03-16 |
Monolithic Die With Acoustic Wave Resonators And Active Circuitry
App 20210067132A1 - | 2021-03-04 |
Capacitor-wirebond Pad Structures For Integrated Circuit Packages
App 20210066184 - Aleksov; Aleksandar ; et al. | 2021-03-04 |
Tunable Capacitor Arrangements In Integrated Circuit Package Substrates
App 20210066265 - Eid; Feras ; et al. | 2021-03-04 |
Crimped mm-wave waveguide tap connector
Grant 10,921,524 - Elsherbini , et al. February 16, 2 | 2021-02-16 |
Thermal Management In Integrated Circuit Packages
App 20210043544 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210041182 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043543 - Eid; Feras ; et al. | 2021-02-11 |
Microelectronic Package Communication Using Radio Interfaces Connected Through Wiring
App 20210041647 - LIFF; Shawna ; et al. | 2021-02-11 |
Bridge For Radio Frequency (rf) Multi-chip Modules
App 20210044030 - Aleksov; Aleksandar ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043541 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043573 - Eid; Feras ; et al. | 2021-02-11 |
Integrated Filter Stack For A Radio Frequency (rf) Front-end Module (fem)
App 20210036685 - Kamgaing; Telesphor ; et al. | 2021-02-04 |
Integrated Radio Frequency (rf) Front-end Module (fem)
App 20210036682 - Kamgaing; Telesphor ; et al. | 2021-02-04 |
Microelectronic devices designed with capacitive and enhanced inductive bumps
Grant 10,910,305 - Kamgaing , et al. February 2, 2 | 2021-02-02 |
Piezoelectric package-integrated film bulk acoustic resonator devices
Grant 10,903,818 - Nair , et al. January 26, 2 | 2021-01-26 |
Piezoelectric package-integrated contour mode filter devices
Grant 10,897,238 - Eid , et al. January 19, 2 | 2021-01-19 |
Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems
Grant 10,886,606 - Kamgaing , et al. January 5, 2 | 2021-01-05 |
Microelectronic devices designed with integrated antennas on a substrate
Grant 10,887,439 - Kamgaing , et al. January 5, 2 | 2021-01-05 |
Microelectronic Devices Designed With Integrated Antennas On A Substrate
App 20200412858 - Dogiamis; Georgios ; et al. | 2020-12-31 |
Massive antenna array architecture for base stations designed for high frequency communications
Grant 10,868,357 - Dogiamis , et al. December 15, 2 | 2020-12-15 |
Mmwave Waveguides Featuring Power-over-waveguide Technology For Automotive Applications
App 20200388898 - DOGIAMIS; Georgios C. ; et al. | 2020-12-10 |
Microelectronic package communication using radio interfaces connected through wiring
Grant 10,852,495 - Liff , et al. December 1, 2 | 2020-12-01 |
Patch antenna with isolated feeds
Grant 10,847,889 - Oladeinde , et al. November 24, 2 | 2020-11-24 |
Disaggregated Die Interconnection With On-silicon Cavity Bridge
App 20200357744 - YONG; Khang Choong ; et al. | 2020-11-12 |
Waveguide and transceiver interference mitigation
Grant 10,819,445 - Kamgaing , et al. October 27, 2 | 2020-10-27 |
Semiconductor packages with antennas
Grant 10,804,227 - Kamgaing , et al. October 13, 2 | 2020-10-13 |
Impedance Cushion To Suppress Power Plane Resonance
App 20200314998 - YONG; Khang Choong ; et al. | 2020-10-01 |
Stacked Platforms With Waveguide Interconnects
App 20200315052 - Kamgaing; Telesphor ; et al. | 2020-10-01 |
Distributed On-package Millimeter-wave Radio
App 20200313306 - Kamgaing; Telesphor ; et al. | 2020-10-01 |
Dispersion Compensation For Electromagnetic Waveguides
App 20200304215 - Correas-Serrano; Diego ; et al. | 2020-09-24 |
Dispersive Waveguide Crosstalk Mitigation
App 20200304171 - Braunisch; Henning ; et al. | 2020-09-24 |
Microelectronic Package With Radio Frequency (rf) Chiplet
App 20200303329 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Waveguide Fan-out
App 20200303327 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Contactless High-frequency Interconnect
App 20200303328 - Braunisch; Henning ; et al. | 2020-09-24 |
Through-substrate Waveguide
App 20200294939 - Aleksov; Aleksandar ; et al. | 2020-09-17 |
Multi-package On-board Waveguide Interconnects
App 20200296823 - Kamgaing; Telesphor ; et al. | 2020-09-17 |
Waveguide Interconnect For Packages
App 20200294940 - Dogiamis; Georgios ; et al. | 2020-09-17 |
System on package architecture including structures on die back side
Grant 10,777,538 - Hua , et al. Sept | 2020-09-15 |
Hybrid Filters And Packages Therefor
App 20200287520 - KAMGAING; Telesphor ; et al. | 2020-09-10 |
On-package Vertical Inductors And Transformers For Compact 5g Modules
App 20200286660 - KAMGAING; Telesphor | 2020-09-10 |
Semiconductor Packages With Antennas
App 20200286841 - Kamgaing; Telesphor ; et al. | 2020-09-10 |
Package With Side-radiating Wave Launcher And Waveguide
App 20200280121 - Dogiamis; Georgios ; et al. | 2020-09-03 |
Transceiver Die Interconnect Interfaces
App 20200273824 - Kamgaing; Telesphor ; et al. | 2020-08-27 |
Hybrid Filter Architecture With Integrated Passives, Acoustic Wave Resonators And Hermetically Sealed Cavities Between Two Reson
App 20200259478 - A1 | 2020-08-13 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,734,236 - Oster , et al. | 2020-08-04 |
Distributed on-package millimeter-wave radio
Grant 10,734,735 - Kamgaing , et al. | 2020-08-04 |
Microelectronic Devices Designed With Integrated Antenna On A Substrate
App 20200236205 - Kamgaing; Telesphor ; et al. | 2020-07-23 |
Rf Front End Module Including Hybrid Filter And Active Circuits In A Single Package
App 20200235716 - EID; Feras ; et al. | 2020-07-23 |
Microelectronic Devices With High Frequency Communication Modules Having Compound Semiconductor Devices Integrated On A Package
App 20200227366 - DOGIAMIS; Georgios C. ; et al. | 2020-07-16 |
Front End System Having An Acoustic Wave Resonator (awr) On An Interposer Substrate
App 20200219861 - KAMGAING; Telesphor ; et al. | 2020-07-09 |
Microelectronic Devices Designed With Efficient Partitioning Of High Frequency Communication Devices Integrated On A Package Fab
App 20200219830 - NAIR; Vijay K. ; et al. | 2020-07-09 |
Integration Of Iii-v Transistors In A Silicon Cmos Stack
App 20200194427 - DEWEY; Gilbert ; et al. | 2020-06-18 |
Waveguide communication with increased link data rate
Grant 10,680,788 - Dogiamis , et al. | 2020-06-09 |
Mmwave Dielectric Waveguide Interconnect Topology For Automotive Applications
App 20200168972 - DOGIAMIS; Georgios ; et al. | 2020-05-28 |
Semiconductor Package Having A Coaxial First Layer Interconnect
App 20200168569 - VADLAMANI; Sai ; et al. | 2020-05-28 |
Embedded millimeter-wave phased array module
Grant 10,658,312 - Kamgaing , et al. | 2020-05-19 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric
Grant 10,629,551 - Dogiamis , et al. | 2020-04-21 |
In-package Rf Waveguides As High Bandwidth Chip-to-chip Interconnects And Methods For Using The Same
App 20200118951 - ALEKSOV; Aleksandar ; et al. | 2020-04-16 |
Orthogonal frequency division multiplexing single sideband transmission over a waveguide
Grant 10,623,106 - Lee , et al. | 2020-04-14 |
Die package with superposer substrate for passive components
Grant 10,615,133 - Kamgaing , et al. | 2020-04-07 |
Substrate Dielectric Waveguides In Semiconductor Packages
App 20200098710 - NAIR; VIYAY K. ; et al. | 2020-03-26 |
Non-planar on-package via capacitor
Grant 10,595,410 - Hua , et al. | 2020-03-17 |
Platform with thermally stable wireless interconnects
Grant 10,593,636 - Dogiamis , et al. | 2020-03-17 |
Piezoelectric package-integrated delay lines
Grant 10,594,294 - Elsherbini , et al. | 2020-03-17 |
Mmwave Waveguide To Waveguide Connectors For Automotive Applications
App 20200076040 - DOGIAMIS; Georgios ; et al. | 2020-03-05 |
Microelectronic Package Communication Using Radio Interfaces Connected Through Wiring
App 20200065263 - LIFF; Shawna ; et al. | 2020-02-27 |
Microelectronic Devices Designed With 3d Stacked Ultra Thin Package Modules For High Frequency Communications
App 20200066663 - ALEKSOV; Aleksandar ; et al. | 2020-02-27 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package
Grant 10,573,608 - Dogiamis , et al. Feb | 2020-02-25 |
Waveguide connector with tapered slot launcher
Grant 10,566,672 - Elsherbini , et al. Feb | 2020-02-18 |
Microelectronic Devices Designed With Mold Patterning To Create Package-level Components For High Frequency Communication System
App 20200052404 - EID; Feras ; et al. | 2020-02-13 |
Blade Computing System With Wireless Communication Between Blades Within A Blade Enclosure
App 20200045754 - KAMGAING; Telesphor ; et al. | 2020-02-06 |
Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric
Grant 10,546,835 - Nair , et al. Ja | 2020-01-28 |
Rfic Having Coaxial Interconnect And Molded Layer
App 20190393172 - PIETAMBARAM; Srinivas V. ; et al. | 2019-12-26 |
Waveguide Design Techniques To Enhance Channel Characteristics
App 20190379097 - DOGIAMIS; Georgios ; et al. | 2019-12-12 |
Wireless interconnects on flexible cables between computing platforms
Grant 10,498,379 - Kamgaing , et al. De | 2019-12-03 |
Reduced Dispersion Dielectric Waveguides
App 20190356033 - Dogiamis; Georgios ; et al. | 2019-11-21 |
Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle
Grant 10,484,120 - Oster , et al. Nov | 2019-11-19 |
Pluggable Mm-wave Module For Rack Scale Architecture (rsa) Servers And High Performance Computers (hpcs)
App 20190348737 - DOGIAMIS; Georgios ; et al. | 2019-11-14 |
Multiplexer And Combiner Structures Embedded In A Mmwave Connector Interface
App 20190348738 - KAMGAING; Telesphor ; et al. | 2019-11-14 |
Blade computing system with wireless communication between blades within a blade enclosure
Grant 10,477,596 - Kamgaing , et al. Nov | 2019-11-12 |
Communication between integrated circuit packages using a millimeter-wave wireless radio fabric
Grant 10,476,545 - Elsherbini , et al. Nov | 2019-11-12 |
Assembly and manufacturing friendly waveguide launchers
Grant 10,468,737 - Dogiamis , et al. No | 2019-11-05 |
Semiconductor Packages With Antennas
App 20190333882 - KAMGAING; Telesphor ; et al. | 2019-10-31 |
Massive Antenna Array Architecture For Base Stations Designed For High Frequency Communications
App 20190334227 - DOGIAMIS; Georgios C. ; et al. | 2019-10-31 |
Millimeter wave fabric network over dielectric waveguides
Grant 10,461,388 - Kamgaing , et al. Oc | 2019-10-29 |
System On Package Architecture Including Structures On Die Back Side
App 20190326258 - HUA; Fay ; et al. | 2019-10-24 |
Microelectronic Devices Designed With Capacitive And Enhanced Inductive Bumps
App 20190326213 - KAMGAING; Telesphor ; et al. | 2019-10-24 |
Radio die package with backside conductive plate
Grant 10,453,804 - Kamgaing , et al. Oc | 2019-10-22 |
Microelectronic package communication using radio interfaces connected through waveguides
Grant 10,452,571 - Oster , et al. Oc | 2019-10-22 |
Waveguides With Active Or Passive Repeaters For Range Extension
App 20190319328 - DOGIAMIS; Georgios ; et al. | 2019-10-17 |
Microelectronic devices designed with high frequency communication modules having steerable beamforming capability
Grant 10,439,671 - Kamgaing , et al. O | 2019-10-08 |
Piezoelectric package-integrated crystal devices
Grant 10,432,167 - Elsherbini , et al. O | 2019-10-01 |
Microelectronic Devices Designed With Foldable Flexible Substrates For High Frequency Communication Modules
App 20190288371 - KAMGAING; Telesphor ; et al. | 2019-09-19 |
Microelectronic Devices Designed With Flexible Package Substrates With Distributed Stacked Antennas For High Frequency Communica
App 20190288382 - KAMGAING; Telesphor ; et al. | 2019-09-19 |
Distributed On-package Millimeter-wave Radio
App 20190288404 - Kamgaing; Telesphor ; et al. | 2019-09-19 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package
Grant 10,410,983 - Kamgaing , et al. Sept | 2019-09-10 |
Dispersion compensation for waveguide communication channels
Grant 10,404,499 - Dogiamis , et al. Sep | 2019-09-03 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20190259622 - OSTER; Sasha N. ; et al. | 2019-08-22 |
Patch Antenna With Isolated Feeds
App 20190207314 - Oladeinde; Adewale K ; et al. | 2019-07-04 |
Co-extrusion Of Multi-material Sets For Millimeter-wave Waveguide Fabrication
App 20190207290 - Rawlings; Brandon M. ; et al. | 2019-07-04 |
Crimped Mm-wave Waveguide Tap Connector
App 20190204508 - ELSHERBINI; Adel A. ; et al. | 2019-07-04 |
Assembly And Manufacturing Friendly Waveguide Launchers
App 20190207287 - DOGIAMIS; Georgios C. ; et al. | 2019-07-04 |
Waveguide Topologies For Rack Scale Architecture Servers
App 20190198965 - Kamgaing; Telesphor ; et al. | 2019-06-27 |
Angle Mount Mm-wave Semiconductor Package
App 20190200451 - OSTER; SASHA ; et al. | 2019-06-27 |
Methods For Conductively Coating Millimeter Waveguides
App 20190198961 - Aleksov; Aleksandar ; et al. | 2019-06-27 |
Millimeter Wave Waveguide Connector With Integrated Waveguide Structuring
App 20190190106 - KAMGAING; TELESPHOR ; et al. | 2019-06-20 |
Waveguide Coupling Systems And Methods
App 20190190119 - OSTER; SASHA ; et al. | 2019-06-20 |
Microelectronic package with wireless interconnect
Grant 10,327,268 - Kamgaing , et al. | 2019-06-18 |
Distributed on-package millimeter-wave radio
Grant 10,326,211 - Kamgaing , et al. | 2019-06-18 |
Millimeter-wave Holey Waveguides And Multi-material Waveguides
App 20190173149 - Elsherbini; Adel A. ; et al. | 2019-06-06 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,304,686 - Oster , et al. | 2019-05-28 |
System on package architecture including structures on die back side
Grant 10,304,804 - Hua , et al. | 2019-05-28 |
Orthogonal Frequency Division Multiplexing Single Sideband Transmission Over A Waveguide
App 20190149243 - Lee; Hyung-Jin ; et al. | 2019-05-16 |
Tunable radio frequency systems using piezoelectric package-integrated switching devices
Grant 10,291,283 - Kamgaing , et al. | 2019-05-14 |
Channelization for dispersion limited waveguide communication channels
Grant 10,277,322 - Dogiamis , et al. | 2019-04-30 |
Single Side Band Transmission Over A Waveguide
App 20190115951 - Braunisch; Henning ; et al. | 2019-04-18 |
Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards
Grant 10,263,312 - Oster , et al. | 2019-04-16 |
Single-package phased array module with interleaved sub-arrays
Grant 10,263,346 - Kamgaing , et al. | 2019-04-16 |
Integrated inductor for integrated circuit devices
Grant 10,256,286 - Duevel , et al. | 2019-04-09 |
Waveguide connector with slot launcher
Grant 10,256,521 - Elsherbini , et al. | 2019-04-09 |
Waveguide Couplers And Junctions To Enable Frequency Division Multiplexed Sensor Systems In Autonomous Vehicle
App 20190103932 - Oster; Sasha N. ; et al. | 2019-04-04 |
Dielectric waveguide bundle including a supporting feature for connecting first and second server boards
Grant 10,249,925 - Dogiamis , et al. | 2019-04-02 |
Multiband Waveguide Interconnect
App 20190097293 - Dogiamis; Georgios ; et al. | 2019-03-28 |
On-chip Waveguide Networks
App 20190089036 - Kamgaing; Telesphor ; et al. | 2019-03-21 |
Waveguide And Transceiver Interference Mitigation
App 20190089409 - Kamgaing; Telesphor ; et al. | 2019-03-21 |
Multimode Waveguide
App 20190081705 - Braunisch; Henning ; et al. | 2019-03-14 |
Millimeter wave CMOS engines for waveguide fabrics
Grant 10,211,970 - Kamgaing , et al. Feb | 2019-02-19 |
Waveguide Communication With Increased Link Data Rate
App 20190013924 - Dogiamis; Georgios C. ; et al. | 2019-01-10 |
Platform With Thermally Stable Wireless Interconnects
App 20190006298 - DOGIAMIS; Georgios C. ; et al. | 2019-01-03 |
Microelectronic Devices Designed With Efficient Partitioning Of High Frequency Communication Devices Integrated On A Package Fabric
App 20180350772 - NAIR; Vijay K. ; et al. | 2018-12-06 |
Integration of millimeter wave antennas on microelectronic substrates
Grant 10,147,997 - Kamgaing De | 2018-12-04 |
Microelectronic Devices With High Frequency Communication Modules Having Compound Semiconductor Devices Integrated On A Package Fabric
App 20180342472 - DOGIAMIS; Georgios C. ; et al. | 2018-11-29 |
Microelectronic Devices Designed With High Frequency Communication Devices Including Compound Semiconductor Devices Integrated On A Die Fabric On Package
App 20180331051 - DOGIAMIS; Georgios C. ; et al. | 2018-11-15 |
Microelectronic Devices Designed With Integrated Antennas On A Substrate
App 20180332151 - KAMGAING; Telesphor ; et al. | 2018-11-15 |
Multi-layer package with integrated antenna
Grant 10,128,177 - Kamgaing , et al. November 13, 2 | 2018-11-13 |
Microelectronic Devices Designed With High Frequency Communication Devices Including Compound Semiconductor Devices Integrated On An Inter Die Fabric On Package
App 20180323159 - KAMGAING; Telesphor ; et al. | 2018-11-08 |
Wireless Interconnects On Flexible Cables Between Computing Platforms
App 20180316375 - KAMGAING; Telesphor ; et al. | 2018-11-01 |
Microelectronic Devices Designed With High Frequency Communication Modules Having Steerable Beamforming Capability
App 20180316383 - KAMGAING; Telesphor ; et al. | 2018-11-01 |
Channelization For Dispersion Limited Waveguide Communication Channels
App 20180316434 - Dogiamis; Georgios C. ; et al. | 2018-11-01 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20180315690 - ELSHERBINI; Adel A. ; et al. | 2018-11-01 |
Microelectronic Devices With Embedded Substrate Cavities For Device To Device Communications
App 20180310399 - NAIR; Vijay K. ; et al. | 2018-10-25 |
System On Package Architecture Including Structures On Die Back Side
App 20180286834 - HUA; Fay ; et al. | 2018-10-04 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20180286687 - OSTER; Sasha N. ; et al. | 2018-10-04 |
Millimeter Wave Cmos Engines For Waveguide Fabrics
App 20180287773 - KAMGAING; TELESPHOR ; et al. | 2018-10-04 |
Platform with thermally stable wireless interconnects
Grant 10,083,923 - Dogiamis , et al. September 25, 2 | 2018-09-25 |
Waveguide communication with increased link data rate
Grant 10,079,668 - Dogiamis , et al. September 18, 2 | 2018-09-18 |
Flexible Electronic Assembly Method
App 20180263117 - Oster; Sasha N. ; et al. | 2018-09-13 |
Microelectronic Devices Designed With Compound Semiconductor Devices And Integrated On An Inter Die Fabric
App 20180240762 - KAMGAING; Telesphor ; et al. | 2018-08-23 |
Dual polarized antenna array
Grant 10,057,796 - Elsherbini , et al. August 21, 2 | 2018-08-21 |
Communication Between Integrated Circuit Packages Using A Millimeter-wave Wireless Radio Fabric
App 20180234128 - ELSHERBINI; Adel A. ; et al. | 2018-08-16 |
Blade Computing System With Wireless Communication Between Blades Within A Blade Enclosure
App 20180227963 - KAMGAING; Telesphor ; et al. | 2018-08-09 |
Patch On Interposer Package With Wireless Communication Interface
App 20180218986 - KAMGAING; Telesphor | 2018-08-02 |
Microelectronic Package Communication Using Radio Interfaces Connected Through Waveguides
App 20180217949 - OSTER; Sasha N. ; et al. | 2018-08-02 |
Cross Talk And Interference Reduction For High Frequency Wireless Interconnects
App 20180212322 - ELSHERBINI; Adel A. ; et al. | 2018-07-26 |
Microelectronic Package With Wireless Interconnect
App 20180212645 - KAMGAING; Telesphor ; et al. | 2018-07-26 |
Antennas For Platform Level Wireless Interconnects
App 20180212306 - ELSHERBINI; Adel A. ; et al. | 2018-07-26 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 10,032,052 - Elsherbini , et al. July 24, 2 | 2018-07-24 |
mmWave antennas and transmission lines on standard substrate materials
Grant 10,033,093 - Elsherbini , et al. July 24, 2 | 2018-07-24 |
Millimeter Wave Fabric Network Over Dielectric Waveguides
App 20180191049 - Kamgaing; Telesphor ; et al. | 2018-07-05 |
Waveguide Communication With Increased Link Data Rate
App 20180183561 - Dogiamis; Georgios C. ; et al. | 2018-06-28 |
Dispersion Compensation For Waveguide Communication Channels
App 20180183522 - Dogiamis; Georgios C. ; et al. | 2018-06-28 |
Channelization for dispersion limited waveguide communication channels
Grant 9,960,849 - Dogiamis , et al. May 1, 2 | 2018-05-01 |
Non-planar On-package Via Capacitor
App 20180098428 - HUA; Fay ; et al. | 2018-04-05 |
Waveguide Bundle Fabrication In Suspended Media Targeting Bend-induced Strain Relief
App 20180097269 - Dogiamis; Georgios C. ; et al. | 2018-04-05 |
Waveguide Connector With Slot Launcher
App 20180090803 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Waveguide Connector With Tapered Slot Launcher
App 20180090848 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Integrated voltage regulators with magnetically enhanced inductors
Grant 9,921,640 - Zillmann , et al. March 20, 2 | 2018-03-20 |
Integrated inductor for integrated circuit devices
Grant 9,881,990 - Duevel , et al. January 30, 2 | 2018-01-30 |
Embedded Millimeter-wave Phased Array Module
App 20180012852 - Kamgaing; Telesphor ; et al. | 2018-01-11 |
Antenna integrated in a package substrate
Grant 9,853,359 - Elsherbini , et al. December 26, 2 | 2017-12-26 |
Flexible electronic assembly method
Grant 9,820,384 - Oster , et al. November 14, 2 | 2017-11-14 |
Integrated Inductor For Integrated Circuit Devices
App 20170309700 - DUEVEL; Andreas ; et al. | 2017-10-26 |
Through-silicon via (TSV)-based devices and associated techniques and configurations
Grant 9,786,581 - Kamgaing October 10, 2 | 2017-10-10 |
Tunable Radio Frequency Systems Using Piezoelectric Package-integrated Switching Devices
App 20170288724 - KAMGAING; Telesphor ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines
App 20170288639 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Contour Mode Filter Devices
App 20170288642 - EID; Feras ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines For Radio Frequency Identification Tags
App 20170286731 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Switching Devices
App 20170283249 - DOGIAMIS; Georgios C. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Film Bulk Acoustic Resonator Devices
App 20170285695 - NAIR; Vijay K. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Crystal Devices
App 20170288635 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Embedded millimeter-wave phased array module
Grant 9,773,742 - Kamgaing , et al. September 26, 2 | 2017-09-26 |
Distributed On-package Millimeter-wave Radio
App 20170179612 - Kamgaing; Telesphor ; et al. | 2017-06-22 |
Integration Of Millimeter Wave Antennas On Microelectronic Substrates
App 20170170544 - Kamgaing; Telesphor | 2017-06-15 |
Integrated inductor for integrated circuit devices
Grant 9,673,268 - Duevel , et al. June 6, 2 | 2017-06-06 |
Distributed on-package millimeter-wave radio
Grant 9,659,904 - Kamgaing , et al. May 23, 2 | 2017-05-23 |
Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates
Grant 9,653,805 - Kamgaing , et al. May 16, 2 | 2017-05-16 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 9,647,636 - Elsherbini , et al. May 9, 2 | 2017-05-09 |
Integration of millimeter wave antennas on microelectronic substrates
Grant 9,620,847 - Kamgaing April 11, 2 | 2017-04-11 |
Platform With Thermally Stable Wireless Interconnects
App 20170084554 - Dogiamis; Georgios C. ; et al. | 2017-03-23 |
Hybrid package transmission line circuits
Grant 9,543,244 - Kong , et al. January 10, 2 | 2017-01-10 |
Device, system and method for providing MEMS structures of a semiconductor package
Grant 9,505,610 - Teh , et al. November 29, 2 | 2016-11-29 |
Single-package Phased Array Module With Interleaved Sub-arrays
App 20160308287 - Kamgaing; Telesphor ; et al. | 2016-10-20 |
Integrated Inductor For Integrated Circuit Devices
App 20160276424 - DUEVEL; Andreas ; et al. | 2016-09-22 |
Package structures including discrete antennas assembled on a device
Grant 9,419,339 - Kamgaing , et al. August 16, 2 | 2016-08-16 |
Single-package phased array module with interleaved sub-arrays
Grant 9,413,079 - Kamgaing , et al. August 9, 2 | 2016-08-09 |
Transformer devices
Grant 9,406,427 - Kamgaing August 2, 2 | 2016-08-02 |
Die Package With Superposer Substrate For Passive Components
App 20160181211 - KAMGAING; TELESPHOR ; et al. | 2016-06-23 |
Dual Polarized Antenna Array
App 20160149315 - ELSHERBINI; ADEL A. ; et al. | 2016-05-26 |
Series and parallel hybrid switched capacitor networks for IC power delivery
Grant 9,318,952 - Oraw , et al. April 19, 2 | 2016-04-19 |
Package Structures Including Discrete Antennas Assembled On A Device
App 20160043471 - Kamgaing; Telesphor ; et al. | 2016-02-11 |
Multi-layer Package With Integrated Antenna
App 20160020165 - Kamgaing; Telesphor ; et al. | 2016-01-21 |
Fully integrated voltage regulators for multi-stack integrated circuit architectures
Grant 9,229,466 - Saraswat , et al. January 5, 2 | 2016-01-05 |
Package structures including discrete antennas assembled on a device
Grant 9,166,284 - Kamgaing , et al. October 20, 2 | 2015-10-20 |
Through-silicon Via (tsv)-based Devices And Associated Techniques And Configurations
App 20150255372 - Kamgaing; Telesphor | 2015-09-10 |
Mmwave Antennas And Transmission Lines On Standard Substrate Materials
App 20150188218 - ELSHERBINI; Adel A. ; et al. | 2015-07-02 |
Antenna Integrated In A Package Substrate
App 20150084830 - Elsherbini; Adel ; et al. | 2015-03-26 |
Device, System And Method For Providing Mems Structures Of A Semiconductor Package
App 20150084139 - Teh; Weng Hong ; et al. | 2015-03-26 |
Hybrid Package Transmission Line Circuits
App 20150069629 - KONG; Chung Peng Jackson ; et al. | 2015-03-12 |
High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same
Grant 8,901,688 - Kamgaing December 2, 2 | 2014-12-02 |
Hybrid package transmission line circuits
Grant 8,890,302 - Kong , et al. November 18, 2 | 2014-11-18 |
Chip Packages Including Through-silicon Via Dice With Vertically Inegrated Phased-array Antennas And Low-frequency And Power Delivery Substrates
App 20140333480 - Kamgaing; Telesphor ; et al. | 2014-11-13 |
Single-package Phased Array Module With Interleaved Sub-arrays
App 20140266902 - Kamgaing; Telesphor ; et al. | 2014-09-18 |
Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates
Grant 8,816,906 - Kamgaing , et al. August 26, 2 | 2014-08-26 |
Package-based filtering and matching solutions
Grant 8,804,366 - Kamgaing , et al. August 12, 2 | 2014-08-12 |
Integration Of Millimeter Wave Antennas On Microelectronic Substrates
App 20140191905 - Kamgaing; Telesphor | 2014-07-10 |
Package Structures Including Discrete Antennas Assembled On A Device
App 20140176368 - Kamgaing; Telesphor ; et al. | 2014-06-26 |
Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same
Grant 8,759,950 - Kamgaing , et al. June 24, 2 | 2014-06-24 |
Series And Parallel Hybrid Switched Capacitor Networks For Ic Power Delivery
App 20140159681 - Oraw; Bradley S. ; et al. | 2014-06-12 |
Drive and startup for a switched capacitor divider
Grant 8,710,903 - Oraw , et al. April 29, 2 | 2014-04-29 |
Integrated Voltage Regulators With Magnetically Enhanced Inductors
App 20140092574 - ZILLMANN; Uwe ; et al. | 2014-04-03 |
Integrated Inductor For Integrated Circuit Devices
App 20140027880 - Duevel; Andreas ; et al. | 2014-01-30 |
Hybrid Package Transmission Line Circuits
App 20140001643 - KONG; Chung Peng (Jackson) ; et al. | 2014-01-02 |
Fully Integrated Voltage Regulators For Multi-stack Integrated Circuit Architectures
App 20130335059 - Saraswat; Ruchir ; et al. | 2013-12-19 |
Integration of switched capacitor networks for power delivery
Grant 8,582,333 - Oraw , et al. November 12, 2 | 2013-11-12 |
Package embedded equalizer
Grant 8,558,636 - Shin , et al. October 15, 2 | 2013-10-15 |
Series And Parallel Hybrid Switched Capacitor Networks For Ic Power Delivery
App 20130058141 - Oraw; Bradley S. ; et al. | 2013-03-07 |
Series and parallel hybrid switched capacitor networks for IC power delivery
Grant 8,330,436 - Oraw , et al. December 11, 2 | 2012-12-11 |
Radio- And Electromagnetic Interference Through-silicon Vias For Stacked- Die Packages, And Methods Of Making Same
App 20120280366 - Kamgaing; Telesphor ; et al. | 2012-11-08 |
Chip Packages Including Through-silicon Via Dice With Vertically Inegrated Phased-array Antennas And Low-frequency And Power Delivery Substrates
App 20120280860 - Kamgaing; Telesphor ; et al. | 2012-11-08 |
High Performance Glass-based 60 Ghz / Mm-wave Phased Array Antennas And Methods Of Making Same
App 20120280380 - Kamgaing; Telesphor | 2012-11-08 |
Package-based Filtering And Matching Solutions
App 20120092076 - Kamgaing; Telesphor ; et al. | 2012-04-19 |
Package-based filtering and matching solutions
Grant 8,111,521 - Kamgaing , et al. February 7, 2 | 2012-02-07 |
Transformer Devices
App 20110115597 - Kamgaing; Telesphor | 2011-05-19 |
Method of fabricating a transformer device
Grant 7,841,070 - Kamgaing November 30, 2 | 2010-11-30 |
Multiband antenna array using electromagnetic bandgap structures
Grant 7,760,140 - Kamgaing July 20, 2 | 2010-07-20 |
Package embedded three dimensional balun
Grant 7,626,472 - Davies-Venn , et al. December 1, 2 | 2009-12-01 |
Compact integration of LC resonators
Grant 7,548,138 - Kamgaing June 16, 2 | 2009-06-16 |
Bandpass filter having first and second serially coupled collection of filter components for providing upper and lower rejection notches
Grant 7,262,674 - Kamgaing August 28, 2 | 2007-08-28 |
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