U.S. patent application number 17/721241 was filed with the patent office on 2022-08-04 for microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric.
The applicant listed for this patent is Intel Corporation. Invention is credited to Georgios C. DOGIAMIS, Javier A. FALCON, Telesphor KAMGAING, Shawna M. LIFF, Vijay K. NAIR, Yoshihiro TOMITA.
Application Number | 20220246554 17/721241 |
Document ID | / |
Family ID | 1000006274863 |
Filed Date | 2022-08-04 |
United States Patent
Application |
20220246554 |
Kind Code |
A1 |
KAMGAING; Telesphor ; et
al. |
August 4, 2022 |
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR
DEVICES AND INTEGRATED ON AN INTER DIE FABRIC
Abstract
Embodiments of the invention include a microelectronic device
that includes a first silicon based substrate having compound
semiconductor components. The microelectronic device also includes
a second substrate coupled to the first substrate. The second
substrate includes an antenna unit for transmitting and receiving
communications at a frequency of approximately 4 GHz or higher.
Inventors: |
KAMGAING; Telesphor;
(Chandler, AZ) ; DOGIAMIS; Georgios C.; (Chandler,
AZ) ; NAIR; Vijay K.; (Mesa, AZ) ; FALCON;
Javier A.; (Chandler, AZ) ; LIFF; Shawna M.;
(Scottsdale, AZ) ; TOMITA; Yoshihiro; (Ibaraki,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Intel Corporation |
Santa Clara |
CA |
US |
|
|
Family ID: |
1000006274863 |
Appl. No.: |
17/721241 |
Filed: |
April 14, 2022 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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15773033 |
May 2, 2018 |
11335651 |
|
|
PCT/US2015/000160 |
Dec 22, 2015 |
|
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17721241 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2924/19043
20130101; H01L 23/66 20130101; H01L 2223/6672 20130101; H01L
2924/15192 20130101; H01L 23/49827 20130101; H01L 2924/18161
20130101; H01L 2924/19103 20130101; H01L 2924/19042 20130101; H01L
2924/19041 20130101; H01L 2924/19011 20130101; H01L 23/5384
20130101; H01L 23/49816 20130101; H01L 23/552 20130101; H01L 25/105
20130101; H01L 2224/16227 20130101; H01L 2223/6677 20130101; H01L
24/00 20130101; H01L 2924/15159 20130101; H01L 2924/15321 20130101;
H01L 2924/19104 20130101; H01L 25/16 20130101; H01L 2924/15153
20130101; H01L 23/48 20130101; H01L 2224/16265 20130101 |
International
Class: |
H01L 23/66 20060101
H01L023/66; H01L 23/48 20060101 H01L023/48; H01L 23/538 20060101
H01L023/538; H01L 23/00 20060101 H01L023/00; H01L 23/498 20060101
H01L023/498; H01L 23/552 20060101 H01L023/552; H01L 25/10 20060101
H01L025/10; H01L 25/16 20060101 H01L025/16 |
Claims
1. A microelectronic device comprising: a first silicon
semiconductor substrate having cavities therein, the first silicon
semiconductor substrate having compound semiconductor components
embedded in the cavities therein, the first silicon semiconductor
substrate having a resistivity below 1 ohm cm, and the first
silicon semiconductor substrate having a footprint; a second
substrate coupled to the first silicon semiconductor substrate, the
second substrate including an antenna unit for transmitting and
receiving communications at a frequency of approximately 4 GHz or
higher; and a plurality of interconnects coupled directly to the
second substrate, wherein one or more of the plurality of
interconnects are outside of the footprint of the first silicon
semiconductor substrate.
2. The microelectronic device of claim 1, wherein the first silicon
semiconductor substrate has a resistivity below 0.1 ohm cm.
3. The microelectronic device of claim 1, wherein the first silicon
semiconductor substrate has a resistivity below 0.01 ohm cm.
4. The microelectronic device of claim 1, further comprising: at
least one integrated passive die (IPD) coupled to at least one of
the first and second substrates, the IPD includes passives for
passive matching networks.
5. The microelectronic device of claim 4, further comprising: an
overmolded component at least partially surrounding the at least
one IPD, the overmolded component to integrate the at least IPD
with the first silicon semiconductor substrate.
6. The microelectronic device of claim 5, further comprising: at
least one thru mold connection formed in the overmolded component
to provide at least one electrical connection between the first
silicon semiconductor substrate and the second substrate.
7. The microelectronic device of claim 1, wherein the compound
semiconductor components include at least one of devices, high
output power transistors, and RF circuitry formed with compound
semiconductor materials.
8. The microelectronic device of claim 7, wherein the compound
semiconductor components include at least one of devices and
circuitry formed with GaN materials.
9. The microelectronic device of claim 1, wherein the
microelectronic device comprises a 5G package architecture for 5G
communications.
10. A microelectronic device comprising: a first silicon
semiconductor substrate having cavities therein, the first silicon
semiconductor substrate having compound semiconductor components
embedded in the cavities therein, the first silicon semiconductor
substrate having a resistivity below 1 ohm cm, and the first
silicon semiconductor substrate having a footprint; a second
substrate coupled to the first silicon semiconductor substrate, the
second substrate including an antenna unit for transmitting and
receiving communications at a frequency of approximately 15 GHz or
higher; and a plurality of interconnects coupled directly to the
second substrate, wherein one or more of the plurality of
interconnects are outside of the footprint of the first silicon
semiconductor substrate.
11. The microelectronic device of claim 10, wherein the first
silicon semiconductor substrate has a resistivity below 0.1 ohm
cm.
12. The microelectronic device of claim 10, wherein the first
silicon semiconductor substrate has a resistivity below 0.01 ohm
cm.
13. The microelectronic device of claim 10, further comprising: at
least one integrated passive die (IPD) coupled to at least one of
the first and second substrates, the IPD includes passives for
passive matching networks.
14. The microelectronic device of claim 13, further comprising: an
overmolded component at least partially surrounding the at least
one IPD, the overmolded component to integrate the at least IPD
with the first silicon semiconductor substrate.
15. The microelectronic device of claim 14, further comprising: at
least one thru mold connection formed in the overmolded component
to provide at least one electrical connection between the first
silicon semiconductor substrate and the second substrate.
16. The microelectronic device of claim 10, wherein the compound
semiconductor components include at least one of devices, high
output power transistors, and RF circuitry formed with compound
semiconductor materials.
17. The microelectronic device of claim 16, wherein the compound
semiconductor components include at least one of devices and
circuitry formed with GaN materials.
18. The microelectronic device of claim 10, wherein the
microelectronic device comprises a 5G package architecture for 5G
communications.
19. A microelectronic device comprising: a first silicon
semiconductor substrate having cavities therein, the first silicon
semiconductor substrate having compound semiconductor components
embedded in the cavities
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This patent application is a continuation of U.S. patent
application Ser. No. 15/773,033, filed May 2, 2018, which is a U.S.
National Phase application under 35 U.S.C. .sctn. 371 of
International Application No. PCT/US2015/000160, filed Dec. 22,
2015, entitled "MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND
SEMICONDUCTOR DEVICES AND INTEGRATED ON AN INTER DIE FABRIC," which
designates the United States of America, the entire disclosure of
which are hereby incorporated by reference in their entirety and
for all purposes.
FIELD OF THE INVENTION
[0002] Embodiments of the present invention relate generally to the
manufacture of semiconductor devices. In particular, embodiments of
the present invention relate to microelectronic devices having
compound semiconductor devices integrated on an inter
diefabric.
BACKGROUND OF THE INVENTION
[0003] Future wireless products are targeting operation frequencies
much higher than the lower GHz range utilized presently. For
instance 5G (5.sup.th generation mobile networks or 5.sup.th
generation wireless systems) communications is expected to operate
at a frequency greater than or equal to 15 GHz. Moreover, the
current WiGig (Wireless Gigabit Alliance) products operate at 60
GHz. Other applications including automotive radar and medical
imaging, utilize wireless communication technologies in the
millimeter wave frequencies (e.g., 30 GHz-300 GHz). For these
wireless applications, the designed RF (radio frequency) circuits
are in need of high quality matching passive networks, in order to
accommodate the transmission of pre-defined frequency bands (where
the communication takes place) as well as in need of high
efficiency power amplifiers and low loss power
combiners/switches.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 illustrates co-integrating different components in a
microelectronic device (e.g., an inter die fabric architecture) in
accordance with one embodiment.
[0005] FIG. 2 illustrates co-integrating different components in a
partitioned microelectronic device (e.g., an inter die fabric
architecture) in accordance with another embodiment.
[0006] FIG. 3 illustrates co-integrating different components in a
microelectronic device (e.g., an inter die fabric architecture)
having a cavity in accordance with another embodiment.
[0007] FIG. 4 illustrates co-integrating different components in a
microelectronic device (e.g., an inter die fabric architecture)
having a cavity in accordance with one embodiment.
[0008] FIG. 5 illustrates a computing device 500 in accordance with
one embodiment.
DETAILED DESCRIPTION OF THE INVENTION
[0009] Described herein are microelectronic devices that are
designed with compound semiconductor devices integrated in a
silicon based substrate of an inter die fabric. In the following
description, various aspects of the illustrative implementations
will be described using terms commonly employed by those skilled in
the art to convey the substance of their work to others skilled in
the art. However, it will be apparent to those skilled in the art
that embodiments of the present invention may be practiced with
only some of the described aspects. For purposes of explanation,
specific numbers, materials and configurations are set forth in
order to provide a thorough understanding of the illustrative
implementations. However, it will be apparent to one skilled in the
art that embodiments of the present invention may be practiced
without the specific details. In other instances, well-known
features are omitted or simplified in order to not obscure the
illustrative implementations.
[0010] Various operations will be described as multiple discrete
operations, in turn, in a manner that is most helpful in
understanding embodiments of the present invention, however, the
order of description should not be construed to imply that these
operations are necessarily order dependent. In particular, these
operations need not be performed in the order of presentation.
[0011] For high frequency (e.g., 5G, WiGig) wireless applications
of millimeter (e.g., 1-10 mm, any mm wave) wave communication
systems, the designed RF circuits (e.g., low-noise amplifiers,
mixers, power amplifiers, switches, etc.) are in need of high
quality passive matching networks, in order to accommodate the
transmission of pre-defined frequency bands where the communication
takes place as well as in need of high efficiency power amplifiers,
and low loss, power combiners/switches, etc. CMOS technology for
greater than 15 GHz operation can be utilized, but with decreased
power amplifier efficiencies and with low quality factor passives,
mainly due to the typically lossy silicon substrate employed. This
results not only in a lower system performance, but also in
increased thermal requirements due to the excess heat generated. In
one example, the high thermal dissipation is due to the fact that
multiple power amplifiers have to be utilized in a phased array
arrangement to achieve the desired output power and transmission
range. This will be even more stringent on 5G systems as the
typical transmission range for cellular network (e.g., 4G, LTE,
LTE-Adv) is several times larger than that required for
connectivity (e.g., WiFi, WiGig).
[0012] The present design includes high frequency components (e.g.,
5G transceiver) and utilizes non-CMOS technologies (e.g.,
non-silicon substrates) for critical parts of a communication
system (e.g., GaAs, GaN, Passives-on-Glass, etc.). Critical parts
requiring high efficiencies and high quality factors can be
fabricated on another technology (e.g., compound semiconductor
materials, group III-V materials). These parts might be either on
device level (e.g., transistors on GaN/GaAs) or on circuit level
(e.g., III-V die integrating a power amplifier, a low noise
amplifier, etc.) and integrated with silicon based substrates. The
full communication system will be formed in a package-fabric
manner, as discussed in embodiments of this invention.
[0013] The present design technology allows co-integrating dies
and/or devices that are fabricated on different technologies and/or
substrates on the same package for performance enhancement and
relaxation of thermal requirements. The package might include
antenna units for communication with other wireless systems.
[0014] In one embodiment, the present design is a 5G (5.sup.th
generation mobile networks or 5.sup.th generation wireless systems)
architecture having non-CMOS based transceiver building blocks
(e.g., group III--V based devices or dies, GaN islands) that are
co-integrated on the same package with low frequency circuits and
integrated passive devices (IPDs) for performance enhancement and
thermal requirements relaxation. In this arrangement, each
component is integrated assembled directly in the package. The
package may have antennas directly integrated onto it. The 5G
architecture operates at a high frequency (e.g., at least 20 GHz,
at least 25 GHz, at least 28 GHz, at least 30 GHz, etc.) and may
also have approximately 1-50 gigabits per second (Gbps) connections
to end points. In another example, the present design operates at
lower frequencies (e.g., at least 4 GHz, approximately 4 GHz).
[0015] The design of this 5G architecture provides optimized
performance for high frequency transceivers based on using compound
semiconductor materials for certain components (e.g., switches,
power amplifier, mixers) and integrated passive devices or dies
(IPDs) for better quality passives. The present design also results
in reduced cost due to having a first substrate designed for
antenna or antenna components and a second substrate designed for
higher frequency components. In one example, the functional testing
of transceiver components, which may utilize in-mold-circuits, are
decoupled from the need to assemble them initially on the package.
Functional blocks such as impedance matching circuits, harmonic
filters, couplers, power combiner/divider, etc. can be implemented
with IPDs. IPDs are generally fabricated using wafer fab
technologies (e.g., thin film deposition, etch, photolithography
processing).
[0016] In one example, if a high resistivity silicon substrate
(e.g., at least 1 ohm cm, at least 10 ohm cm, etc.) is used, then
inductors, transformers and transceiver components can be
integrated on the same substrate with very good electrical
performance. However, a high resistivity substrate is usually not
preferred and not cost-effective for integrating digital circuits
(e.g., baseband circuitry, application processors, etc.). In
another example, if a low resistivity silicon substrate (e.g., less
than 1 ohm cm, etc.) is used then high performance digital circuits
can be achieved, but most front end passive components (e.g.,
transformers, inductors) will have very low quality factors. The
present design enables 5G SoC with III-V circuits on low
resistivity silicon substrate by integrating high performance
passives on an anti-die or substrate of integrated passive device
(IPD).
[0017] In one embodiment, the present design integrates III-V
(e.g., GaN) islands having mm-wave active devices on a low
resistivity silicon substrate (e.g., less than 1 ohm cm, less than
0.1 ohm cm, less than 0.01 ohm cm, etc.). IPD provides desirable
tolerance since semiconductor manufacturing processes are used. Use
of low resistivity silicon enables a full implementation of a
module from an applications processor to antenna input on a silicon
substrate and IPDs. Direct assembly of IPDs on a silicon substrate
(e.g., SoC die) removes parasitic inductance and capacitance, which
can be very substantial at mm-wave frequencies. In fact for 5G
applications, most desired inductors have inductance in the order
of picohenries (pH) vs. nanohenries (nH) for low GHz designs. The
implementation at mm-wave frequencies enables us to integrate the
antenna on the same package with other components (e.g., digital
circuitry, applications processor, any processor, baseband
circuitry, transceiver, etc.).
[0018] FIG. 1 illustrates co-integrating different components in a
microelectronic device (e.g., an inter die fabric architecture) in
accordance with one embodiment. The microelectronic device 100
(e.g., an inter die fabric architecture 100) includes a substrate
120 and a package substrate 150 having an antenna unit 192. The
substrate 120 (e.g., low resistivity silicon substrate having
resistivity less than 1 ohm cm, etc.) includes digital circuitry,
baseband circuitry, processors, application processors, and at
least one transceiver unit. The substrate 120 also includes
integrated or embedded compound semiconductor components 122-126
(e.g., GaN components, GaN devices, GaN circuitry, high output
power transistors, RF circuitry, a combiner, a switch, power
amplifier, individual devices (e.g., transistors), any type of
device or circuitry formed in compound semiconductor materials,
etc.). The components 122-126 are integrated to the substrate 120
with semiconductor fabrication processes. For example, these
components may be grown monolithically on the substrate 120. In
another example, these components may be fabricated with a
different process (e.g., GaAs, GaN, etc.) and then attached to the
substrate 120 (or embedded within cavities of the substrate) at the
beginning, during, or at the end of the processing for the
substrate 120 (e.g., CMOS substrate 120). Integrated passive
devices or dies (IPDs) 140 and 142 are coupled to the substrate 120
(or components 122-126) with connections 166-170 (e.g., bumps, Cu
pillars with solder cap on top, etc.). The IPDs are assembled to
the substrate 120 to enable RF front-end functionality as well as
digital and analog functionalities. The IPDs may include any type
of passives including inductors, transformers, capacitors, and
resistors. In one example, capacitors on the IPD die may be used
for power delivery. In another example, resistors on the same or a
different IPD may be used for digital signal equalization. An
overmolded component 130 (e.g., glass, high resistivity silicon,
organic substrate, ceramic substrate, alumina substrate, compound
semiconductor substrate, etc.) integrates the IPDs on the substrate
120. The component 130 may surround the IPDs completely (e.g., all
sides, top, bottom) or may only partially surround (e.g., not
above) the IPDs. Components of the substrate 120 including
components 122-126 are coupled to the substrate 150 with
connections 163-165 (e.g., thru mold connections) and solder balls
160-162. The substrate 150 includes at least one antenna unit 192,
conductive layers 151, 152, 155, 156, 157-159, and conductive
connections 153, 154, and 156. The conductive layers 151, 155, 157,
and 159 may each be antennas 151, 155, 157, and 159 of the antenna
unit 192. The components of the substrate 120 and IPDs 140 and 142
can communicate with components of the substrate 150 or other
components not shown in FIG. 1 using secondary level interconnect
171 and 172. The connections 163-165 and 160-162 form primary level
interconnect.
[0019] In general, the IPDs are assembled to substrate 120 (e.g.,
substrate in which SoC is fabricated) but in some cases the IPDs
may be pre-molded prior to the assembly to the substrate 120. If
the substrate 120 is smaller than the IPD(s), then the substrate
120 may be assembled on the IPD(s) instead.
[0020] The substrate 150 can have a different thickness, length,
and width dimensions in comparison to a thickness, length, and
width dimensions of the substrate 120.
[0021] In one example, components of the substrate 150 which
primarily dominate a packaging area are partitioned in a separate
lower cost and lower circuit density substrate 150 in comparison to
the substrate 120, which may have high density interconnect (HDI)
and impedance controlled interconnect. A substrate 150 may be
formed with low temperature co-fired ceramic materials, liquid
crystal polymers, organic materials, glass, undoped silicon, etc.
HDI PCB technologies may include blind and/or buried via processes
and possibly microvias with a higher circuit density than
traditional PCBs. In this manner, an area of the substrate 120
without antenna components is reduced to lowercost in comparison to
a planar structure that includes antenna components. The substrate
120 may be formed with any materials (e.g., low resistivity silicon
based substrates, materials for formation of CPUs, Semi-insulating
substrate like GaAs, high resistivity silicon substrate, etc.) that
are designed for high frequency designs having desirable high
frequency characteristics (e.g., substrate loss, dielectric
constant).
[0022] Additional components such as traditional surface-mount
passives may also be mounted to the substrate 120. In addition, the
substrate 120 of FIG. 1 may be overmolded and covered with an
external shield. The mold material may be a low loss nonconductive
dielectric material and the shielding may be made out of a
conductive material.
[0023] In another embodiment, any of the devices or components can
be coupled to each other.
[0024] FIG. 2 illustrates co-integrating different components in a
microelectronic device (e.g., an inter die fabric architecture) in
accordance with another embodiment. The microelectronic device 200
(e.g., an inter die fabric architecture 200) includes a substrate
220 and a package substrate 250 having at least one antenna unit
292. The substrate 220 (e.g., low resistivity silicon substrate
having resistivity less than 1 ohm cm, etc.) includes digital
circuitry, baseband circuitry, processors, application processors,
and at least one transceiver unit. The substrate 220 also includes
integrated or embedded compound semiconductor components 222-226
(e.g., GaN components, GaN devices, GaN circuitry, high output
power transistors, RF circuitry, a combiner, a switch, power
amplifier, individual devices (e.g., transistors), any type of
device or circuitry formed in compound semiconductor materials,
etc.). The components 222-226 are integrated to the substrate 220
with semiconductor fabrication processes. For example, these
components may be grown monolithically on the substrate 220. In
another example, these components may be fabricated with a
different process (e.g., GaAs, GaN, etc.) and then attached to the
substrate 220 (or embedded within cavities of the substrate) at the
beginning, during, or at the end of the processing for the
substrate 220 (e.g., CMOS substrate 220) Integrated passive devices
or dies (IPDs) 231-234 are coupled to the substrate 220 (or
components 223-226) with connections 264-267 (e.g., bumps, Cu
pillars with solder cap on top, etc.). The IPDs are assembled to
the substrate 220 to enable RF front-end functionality as well as
digital and analog functionalities. The IPDs may include any type
of passives including inductors, transformers, capacitors, and
resistors. In one example, capacitors on the IPD die may be used
for power delivery. In another example, resistors on the same or a
different IPD may be used for digital signal equalization. An
overmolded component or module 230 (e.g., glass, high resistivity
silicon, organic substrate, ceramic substrate, alumina substrate,
compound semiconductor substrate, etc.) integrates the IPDs on the
substrate 220. The component 230 may surround the IPDs completely
(e.g., all sides, top, bottom) or may only partially surround
(e.g., not above) the IPDs. Components of the substrate 220
including components 222-226 are coupled to the substrate 250 with
connections 260-263 (e.g., thru mold connections). The substrate
250 includes at least one antenna unit 292, conductive layers 251,
254-259, and conductive connections 253, 254, and 256. The
conductive layers 251, 255, 257, and 259 may each be antennas 251,
255, 257, and 259 of the antenna unit 292. The components of the
substrate 220 and IPDs can communicate with components of the
substrate 250 or other components not shown in FIG. 2 using
secondary level interconnect 271 and 272. The connections 260-263
form primary level interconnect.
[0025] In one example, components of the substrate 250 which
primarily dominate a packaging area are partitioned in a separate
lower cost and lower circuit density substrate 250 in comparison to
the substrate 220, which may have high density interconnect (HDI)
and impedance controlled interconnect. A substrate 250 may be
formed with low temperature co-fired ceramic materials, liquid
crystal polymers, organic materials, glass, undoped silicon, etc.
HDI PCB technologies may include blind and/or buried via processes
and possibly microvias with a higher circuit density than
traditional PCBs. In this manner, an area of the substrate 220
without antenna components is reduced to lower cost in comparison
to a planar structure that includes antenna components. The
substrate 220 may be formed with any materials (e.g., low
resistivity silicon based substrates, materials for formation of
CPUs, etc) that are designed for high frequency designs having
desirable high frequency characteristics (e.g., substrate loss,
dielectric constant).
[0026] In general, the IPDs are assembled to substrate 220 but in
some cases the IPDs may be pre-molded prior to the assembly to the
substrate 220 as illustrated in FIG. 2. If the substrate 220 is
smaller than the IPD(s), then the substrate 220 may be assembled on
the IPD(s) instead.
[0027] The substrate 250 can have a different thickness, length,
and width dimensions in comparison to a thickness, length, and
width dimensions of the substrate 220. In another embodiment, any
of the devices or components can be coupled to each other.
[0028] FIG. 3 illustrates co-integrating different components in a
microelectronic device (e.g., an inter die fabric architecture)
having a cavity in accordance with another embodiment. The
microelectronic device 300 (e.g., an inter die fabric architecture
300) includes a substrate 320 and a package substrate 350 having an
antenna unit 392. The substrate 320 (e.g., low resistivity silicon
substrate having resistivity less than 1 ohm cm, etc.) includes
digital circuitry, baseband circuitry, processors, application
processors, and at least one transceiver unit. The substrate 320
also includes integrated or embedded compound semiconductor
components 321-325 (e.g., GaN components, GaN devices, GaN
circuitry, high output power transistors, RF circuitry, a combiner,
a switch, power amplifier, individual devices (e.g., transistors),
any type of device or circuitry formed in compound semiconductor
materials, etc.). The components 321-325 are integrated to the
substrate 320 with semiconductor fabrication processes. For
example, these components may be grown monolithically on the
substrate 320. In another example, these components may be
fabricated with a different process (e.g., GaAs, GaN, etc.) and
then attached to the substrate 320 (or embedded within cavities of
the substrate) at the beginning, during, or at the end of the
processing for the substrate 320 (e.g., CMOS substrate 320)
Integrated passive devices or dies (IPDs) 331 and 332 are coupled
to the substrate 320 (or components 321-325) with connections
380-384 (e.g., bumps, Cu pillars with solder cap on top, etc.). The
IPDs are assembled to the substrate 320 to enable RF front-end
functionality. The IPDs may include any type of passives including
inductors, transformers, capacitors, and resistors. In one example,
capacitors on the IPD die may be used for power delivery. In
another example, resistors on the same or a different IPD may be
used for digital signal equalization. An overmolded component 330
(e.g., glass, high resistivity silicon, organic substrate, ceramic
substrate, alumina substrate, compound semiconductor substrate,
etc.) integrates the IPDs on the substrate 320. The component 330
may surround the IPDs completely (e.g., all sides, top, bottom) or
may only partially surround (e.g., not above) the IPDs. Components
of the substrate 320 including components 321-325 are coupled to
the substrate 350 with connections 363-365 (e.g., thru mold
connections) and solder balls 360-362. The substrate 350 includes
at least one antenna unit 392, conductive layers 351-353, 355, 356,
358, and conductive connections 353, 354, and 357. The conductive
layers 351, 355, 356, and 358 may each be antennas 351, 355, 356,
and 358, respectively, of the antenna unit 392. The components of
the substrate 320 and IPDs 331 and 332 can communicate with
components of the substrate 350 or other components not shown in
FIG. 3 using secondary level interconnect 371 and 372. The
connections 363-365 and 360-362 form primary level interconnect.
The substrate 350 includes a cavity 373 that allows space for the
substrate 320 and component 330 with IPDs 331 and 332. The cavity
373 allows a decrease in vertical height along a z axis 390 needed
for assembly of the device 300. In this manner, a size, diameter,
and height of the secondary level interconnect 371 and 372 are
reduced in comparison to the secondary level interconnect 171 and
172 of FIG. 1.
[0029] In general, the IPDs are assembled to substrate 320 (e.g.,
SoC) but in some cases the IPDs may be pre-molded prior to the
assembly to the substrate 320. If the substrate 320 is smaller than
the IPD(s), then the substrate 320 may be assembled on the IPD(s)
instead.
[0030] The substrate 350 can have a different thickness, length,
and width dimensions in comparison to a thickness, length, and
width dimensions of the substrate 320.
[0031] In another embodiment, any of the devices or components can
be coupled to each other.
[0032] FIG. 4 illustrates co-integrating different components in a
microelectronic device (e.g., an inter die fabric architecture)
having a cavity in accordance with one embodiment.
[0033] The microelectronic device 400 (e.g., an inter die fabric
architecture 400) includes a substrate 420 and a package substrate
450 having an antenna unit 492. The substrate 420 (e.g., low
resistivity silicon substrate having resistivity less than 1 ohm
cm, etc.) includes digital circuitry, baseband circuitry,
processors, application processors, and at least one transceiver
unit. The substrate 420 also includes integrated or embedded
compound semiconductor components 421-425 (e.g., GaN components,
GaN devices, GaN circuitry, high output power transistors, RF
circuitry, a combiner, a switch, power amplifier, individual
devices (e.g., transistors), any type of device or circuitry formed
in compound semiconductor materials, etc.). The components 421-425
are integrated to the substrate 420 with semiconductor fabrication
processes. For example, these components may be grown
monolithically on the substrate 420. In another example, these
components may be fabricated with a different process (e.g., GaAs,
GaN, etc.) and then attached to the substrate 420 (or embedded
within cavities of the substrate) at the beginning, during, or at
the end of the processing for the substrate 420 (e.g., CMOS
substrate 420) Integrated passive devices or dies (IPDs) 431 and
432 are coupled to the substrate 420 (or components 421-425) with
connections 465-469 (e.g., bumps, Cu pillars with solder cap on
top, etc.). The IPDs are assembled to the substrate 420 to enable
RF front-end functionality. The IPDs may include any type of
passives including inductors, transformers, capacitors, and
resistors. In one example, capacitors on the IPD die may be used
for power delivery. In another example, resistors on the same or a
different IPD may be used for digital signal equalization. An
overmolded component 430 (e.g., glass, high resistivity silicon,
organic substrate, ceramic substrate, alumina substrate, compound
semiconductor substrate, etc.) integrates the IPDs on the substrate
420. The component 430 may surround the IPDs completely (e.g., all
sides, top, bottom) or may only partially surround (e.g., not
above) the IPDs. Components of the substrate 420 including
components 421-425 are coupled to the substrate 450 with
connections 463-465 (e.g., thru mold connections) and solder balls
460-462. The substrate 450 includes at least one antenna unit 492,
conductive layers 451, 452, 455-457, 459, and conductive
connections 453, 454, and 458. The conductive layers 451, 455, 456,
and 457 may each be antennas 451, 452, 456, and 457, respectively,
of the antenna unit 492. The components of the substrate 420 and
IPDs 431 and 432 can communicate with components of the substrate
450 or other components not shown in FIG. 4 using secondary level
interconnect 471 and 472. The connections 463-465 and solder balls
460-462 form primary level interconnect. The substrate 450 includes
a cavity or recess 473 that allows space for the IPDs 431 and 432.
The cavity 473 allows a decrease in vertical height along a z axis
490 needed for assembly of the device 400. In this manner, a size,
diameter, and height of the secondary level interconnect 471 and
472 is reduced in comparison to the secondary level interconnect
171 and 172 of FIG. 1.
[0034] In general, the IPDs are assembled to substrate 420 (e.g.,
SoC) but in some cases the IPDs may be pre-molded prior to the
assembly to the substrate 420. If the substrate 420 is smaller than
the IPD(s), then the substrate 420 may be assembled on the IPD(s)
instead.
[0035] The substrate 450 can have a different thickness, length,
and width dimensions in comparison to a thickness, length, and
width dimensions of the substrate 420.
[0036] In another embodiment, any of the devices or components can
be coupled to each other.
[0037] In one example, compound semiconductor materials (e.g., GaN,
GaAs, etc.) have significantly higher electron mobility in
comparison to Silicon materials which allows faster operation.
Compound semiconductor materials also have wider band gap, which
allows operation of power devices at higher temperatures, and give
lower thermal noise to low power devices at room temperature in
comparison to Silicon materials. Compound semiconductor materials
also have a direct band gap which provides more favorable
optoelectronic properties than an indirect band gap of Silicon.
Passives needed for passive matching networks are integrated in the
IPDs, or passive power combiners or splitters can be assembled on
the microelectronic device (e.g., an inter die fabric
architecture). The components may be approximately drawn to scale
or may not be necessarily drawn to scale depending on a particular
architecture. In one example, for a frequency of approximately 30
GHz, a substrate (e.g., 150, 250, 350, 450) has dimensions of
approximately 2.5 mm by 2.5 mm.
[0038] It will be appreciated that, in a system on a chip
embodiment, the die may include a processor, memory, communications
circuitry and the like. Though a single die is illustrated, there
may be none, one or several dies included in the same region of the
wafer.
[0039] In one embodiment, the microelectronic device may be a
crystalline substrate formed using a bulk silicon or a
silicon-on-insulator substructure. In other implementations, the
microelectronics device may be formed using alternate materials,
which may or may not be combined with silicon, that include but are
not limited to germanium, indium antimonide, lead telluride, indium
arsenide, indium phosphide, gallium arsenide, indium gallium
arsenide, gallium antimonide, or other combinations of group III-V
or group IV materials. Although a few examples of materials from
which the substrate may be formed are described here, any material
that may serve as a foundation upon which a semiconductor device
may be built falls within the scope of embodiments of the present
invention.
[0040] FIG. 5 illustrates a computing device 900 in accordance with
one embodiment. The computing device 900 houses a board 902. The
board (e.g., motherboard, printed circuit board, etc.) may include
a number of components, including but not limited to at least one
processor 904 and at least one communication chip 906. The at least
one processor 904 is physically and electrically coupled to the
board 902. In some implementations, the at least one communication
chip 906 is also physically and electrically coupled to the board
902. In further implementations, the communication chip 906 is part
of the processor 904. In one example, the communication chip 906
(e.g., microelectronic device 100, 200, 300, 400, etc.) includes an
antenna unit 920 (e.g., antenna unit 192, 292, 392, 492, etc.).
[0041] Depending on its applications, computing device 900 may
include other components that may or may not be physically and
electrically coupled to the board 902. These other components
include, but are not limited to, volatile memory (e.g., DRAM 910,
911), non-volatile memory (e.g., ROM 912), flash memory, a graphics
processor 916, a digital signal processor, a crypto processor, a
chipset 914, an antenna unit 920, a display, a touchscreen display
930, a touchscreen controller 922, a battery 932, an audio codec, a
video codec, a power amplifier 915, a global positioning system
(GPS) device 926, a compass 924, a gyroscope, a speaker, a camera
950, and a mass storage device (such as hard disk drive, compact
disk (CD), digital versatile disk (DVD), and so forth).
[0042] The communication chip 906 enables wireless communications
for the transfer of data to and from the computing device 900. The
term "wireless" and its derivatives may be used to describe
circuits, devices, systems, methods, techniques, communications
channels, etc., that may communicate data through the use of
modulated electromagnetic radiation through a non-solid medium. The
term does not imply that the associated devices do not contain any
wires, although in some embodiments they might not. The
communication chip 906 may implement any of a number of wireless
standards or protocols, including but not limited to Wi-Fi (IEEE
802.11 family), WiMAX (IEEE 802.16 family), WiGig, IEEE 802.20,
long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM,
GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well as
any other wireless protocols that are designated as 3G, 4G, 5G, and
beyond. The computing device 900 may include a plurality of
communication chips 906. For instance, a first communication chip
906 may be dedicated to shorter range wireless communications such
as Wi-Fi, WiGig, and Bluetooth and a second communication chip 906
may be dedicated to longer range wireless communications such as
GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, 5G, and others.
[0043] The at least one processor 904 of the computing device 900
includes an integrated circuit die packaged within the at least one
processor 904. In some embodiments of the invention, the integrated
circuit die of the processor includes one or more devices, such as
microelectronic devices (e.g., microelectronic device 100, 200,
300, 400, 500, etc.) in accordance with implementations of
embodiments of the invention. The term "processor" may refer to any
device or portion of a device that processes electronic data from
registers and/or memory to transform that electronic data into
other electronic data that may be stored in registers and/or
memory.
[0044] The communication chip 906 also includes an integrated
circuit die packaged within the communication chip 906. In
accordance with another implementation of embodiments of the
invention, the integrated circuit die of the communication chip
includes one or more microelectronic devices (e.g., microelectronic
device 100, 200, 300, 400, etc.).
[0045] The following examples pertain to further embodiments.
Example 1 is a microelectronic device that includes a first silicon
based substrate having compound semiconductor components and a
second substrate that is coupled to the first substrate. The second
substrate includes an antenna unit for transmitting and receiving
communications at a frequency of approximately 4 GHz or higher
(e.g., at least 4 GHz, at least 15 GHz, at least 25 GHz). In one
example, the first substrate includes a transceiver unit and a
baseband unit.
[0046] In example 2, the subject matter of example 1 can optionally
include an integrated passive die (IPD) that is coupled to at least
one of the first and second substrates. The IPD includes passives
for passive matching networks, power supply, digital signal
equalization, filtering, etc.
[0047] In example 3, the subject matter of any of examples 1-2 can
optionally include an overmolded component that at least partially
surrounds the at least one IPD. The overmolded component integrates
the at least IPD with the first substrate.
[0048] In example 4, the subject matter of any of examples 1-3 can
optionally include at least one thru mold connection formed in the
overmolded component to provide at least one electrical connection
between the first substrate and the second substrate.
[0049] In example 5, the subject matter of example 4 can optionally
include the compound semiconductor components including at least
one of devices, high output power transistors, and RF circuitry
formed with compound semiconductor materials.
[0050] In example 6, the subject matter of any of examples 1-5 can
optionally include the compound semiconductor components including
at least one of devices and circuitry formed with GaN
materials.
[0051] In example 7, the subject matter of any of examples 1-6 can
optionally include the microelectronic device being a 5G package
architecture for 5G communications.
[0052] In example 8, a microelectronic device includes a first
silicon based substrate having compound semiconductor components
and a second substrate having a cavity for positioning of the first
silicon based substrate within the cavity. The second substrate
includes an antenna unit for transmitting and receiving
communications at a frequency of approximately 15 GHz or higher
(e.g., at least 4 GHz, at least 15 GHz, at least 25 GHz).
[0053] In example 9, the subject matter of example 8 can optionally
include an integrated passive die (IPD) that is coupled to at least
one of the first and second substrates. The IPD includes passives
for passive matching networks.
[0054] In example 10, the subject matter of any of examples 8-9 can
optionally include an overmolded component that at least partially
surrounds the at least one IPD. The overmolded component integrates
the at least IPD with the first substrate.
[0055] In example 11, the subject matter of any of examples 8-10
can optionally include at least one thru mold connection formed in
the overmolded component to provide at least one electrical
connection between the first substrate and the second
substrate.
[0056] In example 12, the subject matter of example 11 can
optionally include the compound semiconductor components including
at least one of devices, high output power transistors, and RF
circuitry formed with compound semiconductor materials.
[0057] In example 13, the subject matter of any of examples 8-12
can optionally include the compound semiconductor components
including at least one of devices and circuitry formed with GaN
materials.
[0058] In example 14, the subject matter of any of examples 8-13
can optionally include the microelectronic device being a 5G
package architecture for 5G communications.
[0059] Example 15 is a computing device that includes at least one
processor to process data and a communication module or chip that
is coupled to the at least one processor. The communication module
or chip includes a first silicon based substrate having compound
semiconductor components and a second substrate coupled to the
first silicon based substrate. The second substrate having a cavity
and an antenna unit for transmitting and receiving communications
at a frequency of approximately 15 GHz or higher.
[0060] In example 16, the subject matter of example 15 can
optionally include the computing device further including at least
one integrated passive die (IPD) coupled to at least one of the
first and second substrates. The IPD is positioned at least
partially within the cavity of the second substrate.
[0061] In example 17, the subject matter of any of examples 15-16
can optionally include the computing device further comprising an
overmolded component at least partially surrounding the at least
one IPD. The overmolded component to integrate the at least IPD
with the first substrate.
[0062] In example 18, the subject matter of any of examples 15-17
can optionally include at least one thru mold connection formed in
the overmolded component to provide at least one electrical
connection between the first substrate and the second
substrate.
[0063] In example 19, the subject matter of any of examples 15-18
can optionally include the compound semiconductor components
including at least one of devices, high output power transistors,
and RF circuitry formed with compound semiconductor materials.
[0064] In example 20, the subject matter of any of examples 15-19
can optionally include the compound semiconductor components
include at least one of devices and circuitry formed with GaN
materials.
* * * * *