| Patent | Date |
|---|
Microelectronic Devices Designed With Compound Semiconductor Devices And Integrated On An Inter Die Fabric
App 20220246554 - KAMGAING; Telesphor ; et al. | 2022-08-04 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric
Grant 11,387,200 - Dogiamis , et al. July 12, 2 | 2022-07-12 |
Carrier For Microelectronic Assemblies Having Direct Bonding
App 20220199449 - Baker; Michael J. ; et al. | 2022-06-23 |
Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric
Grant 11,335,651 - Kamgaing , et al. May 17, 2 | 2022-05-17 |
TSV-less die stacking using plated pillars/through mold interconnect
Grant 11,296,052 - Meyers , et al. April 5, 2 | 2022-04-05 |
Quantum circuit assemblies with on-chip demultiplexers
Grant 11,177,912 - Elsherbini , et al. November 16, 2 | 2021-11-16 |
Semiconductor Packaging With High Density Interconnects
App 20210193583 - ELSHERBINI; Adel A. ; et al. | 2021-06-24 |
Semiconductor packaging with high density interconnects
Grant 10,971,453 - Elsherbini , et al. April 6, 2 | 2021-04-06 |
Ultra Small Molded Module Integrated With Die By Module-on-wafer Assembly
App 20200286834 - YOSHIHIRO; Tomita ; et al. | 2020-09-10 |
Quantum computing assemblies with through-hole dies
Grant 10,756,004 - Elsherbini , et al. A | 2020-08-25 |
Microelectronic Devices With High Frequency Communication Modules Having Compound Semiconductor Devices Integrated On A Package
App 20200227366 - DOGIAMIS; Georgios C. ; et al. | 2020-07-16 |
Ultra small molded module integrated with die by module-on-wafer assembly
Grant 10,707,171 - Yoshihiro , et al. | 2020-07-07 |
Tsv-less Die Stacking Using Plated Pillars/through Mold Interconnect
App 20200212012 - MEYERS; Preston T. ; et al. | 2020-07-02 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric
Grant 10,629,551 - Dogiamis , et al. | 2020-04-21 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package
Grant 10,573,608 - Dogiamis , et al. Feb | 2020-02-25 |
Package substrates with top superconductor layers for qubit devices
Grant 10,468,578 - Elsherbini , et al. No | 2019-11-05 |
Semiconductor Packaging With High Density Interconnects
App 20190259705 - Elsherbini; Adel A. ; et al. | 2019-08-22 |
Quantum computing assemblies
Grant 10,380,496 - Elsherbini , et al. A | 2019-08-13 |
Shielded interconnects
Grant 10,319,896 - Falcon , et al. | 2019-06-11 |
Qubit die attachment using preforms
Grant 10,256,206 - Falcon , et al. | 2019-04-09 |
Qubit Die Attachment Using Preforms
App 20190043822 - Falcon; Javier A. ; et al. | 2019-02-07 |
Quantum Computing Assemblies
App 20190042964 - Elsherbini; Adel A. ; et al. | 2019-02-07 |
Quantum Circuit Assemblies With On-chip Demultiplexers
App 20190044668 - Elsherbini; Adel A. ; et al. | 2019-02-07 |
Package Substrates With Top Superconductor Layers For Qubit Devices
App 20190044047 - Elsherbini; Adel A. ; et al. | 2019-02-07 |
Shielded Interconnects
App 20190006572 - Falcon; Javier A. ; et al. | 2019-01-03 |
Microelectronic Devices With High Frequency Communication Modules Having Compound Semiconductor Devices Integrated On A Package Fabric
App 20180342472 - DOGIAMIS; Georgios C. ; et al. | 2018-11-29 |
Ultra Small Molded Module Integrated With Die By Module-on-wafer Assembly
App 20180337135 - YOSHIHIRO; Tomita ; et al. | 2018-11-22 |
Microelectronic Devices Designed With High Frequency Communication Devices Including Compound Semiconductor Devices Integrated On A Die Fabric On Package
App 20180331051 - DOGIAMIS; Georgios C. ; et al. | 2018-11-15 |
Microelectronic Devices Designed With Compound Semiconductor Devices And Integrated On An Inter Die Fabric
App 20180240762 - KAMGAING; Telesphor ; et al. | 2018-08-23 |
Space-efficient Underfilling Techniques For Electronic Assemblies
App 20180061673 - HEPPNER; JOSHUA D. ; et al. | 2018-03-01 |
Space-efficient underfilling techniques for electronic assemblies
Grant 9,728,425 - Heppner , et al. August 8, 2 | 2017-08-08 |
Semiconductor Package Interposer Having Encapsulated Interconnects
App 20170179080 - MATHKAR; Akshay ; et al. | 2017-06-22 |
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