U.S. patent application number 15/670341 was filed with the patent office on 2018-03-01 for space-efficient underfilling techniques for electronic assemblies.
This patent application is currently assigned to INTEL CORPORATION. The applicant listed for this patent is INTEL CORPORATION. Invention is credited to MICHAEL J. BAKER, JAVIER A. FALCON, JOSHUA D. HEPPNER, SERGE ROUX.
Application Number | 20180061673 15/670341 |
Document ID | / |
Family ID | 59410743 |
Filed Date | 2018-03-01 |
United States Patent
Application |
20180061673 |
Kind Code |
A1 |
HEPPNER; JOSHUA D. ; et
al. |
March 1, 2018 |
SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC
ASSEMBLIES
Abstract
Space-efficient underfilling techniques for electronic
assemblies are described. According to some such techniques, an
underfilling method may comprise mounting an electronic element on
a surface of a substrate, dispensing an underfill material upon the
surface of the substrate within a dispense region for forming an
underfill for the electronic element, and projecting curing rays
upon at least a portion of the dispensed underfill material to
inhibit an outward flow of dispensed underfill material from the
dispense region, and the underfill material may comprise a
non-visible light (NVL)-curable material. Other embodiments are
described and claimed.
Inventors: |
HEPPNER; JOSHUA D.;
(Chandler, AZ) ; ROUX; SERGE; (Gilbert, AZ)
; BAKER; MICHAEL J.; (Gilbert, AZ) ; FALCON;
JAVIER A.; (Chandler, AZ) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INTEL CORPORATION |
SANTA CLARA |
CA |
US |
|
|
Assignee: |
INTEL CORPORATION
SANTA CLARA
CA
|
Family ID: |
59410743 |
Appl. No.: |
15/670341 |
Filed: |
August 7, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
15089491 |
Apr 2, 2016 |
9728425 |
|
|
15670341 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2224/743 20130101;
H01L 2224/16225 20130101; H01L 21/563 20130101; B29K 2063/00
20130101; H01L 2224/92125 20130101; H01L 23/3157 20130101; B29L
2031/3481 20130101; B29K 2995/0005 20130101; H01L 2224/73204
20130101; H01L 21/67126 20130101 |
International
Class: |
H01L 21/56 20060101
H01L021/56; H01L 21/67 20060101 H01L021/67; B29C 35/08 20060101
B29C035/08; H01L 23/31 20060101 H01L023/31 |
Claims
1. A method, comprising: mounting an electronic element on a
surface of a substrate; dispensing an underfill material upon the
surface of the substrate within a dispense region for forming an
underfill for the electronic element, the underfill material to
comprise a non-visible light (NVL)-curable material; and projecting
curing rays upon at least a portion of the dispensed underfill
material to inhibit an outward flow of dispensed underfill material
from the dispense region.
2. The method of claim 1, the curing rays to comprise ultraviolet
(UV) light.
3. The method of claim 1, the curing rays to comprise infrared (IR)
light.
4. The method of claim 1, comprising conveying a dispense assembly
along a dispense path to dispense the underfill material within the
dispense region.
5. The method of claim 4, the dispense assembly to comprise a light
source, the light source to project a curing beam upon dispensed
underfill material as the dispense assembly traverses the dispense
path.
6. The method of claim 1, comprising projecting a curing frame upon
a curing region surrounding the dispense region.
7. The method of claim 1, the electronic element to comprise a
semiconductor die.
8. The method of claim 7, the semiconductor die to comprise one or
more integrated circuits (ICs).
9. The method of claim 1, the substrate to comprise a printed
circuit board (PCB).
10. The method of claim 1, the underfill material to comprise an
NVL-curable epoxy.
11. An apparatus, comprising: a dispenser to dispense an underfill
material, the underfill material to comprise a non-visible light
(NVL)-curable material selected for use to form an underfill for an
electronic element mounted on a surface of a substrate; and a light
source coupled to the dispenser, the light source to emit curing
rays for curing underfill material dispensed by the dispenser.
12. The apparatus of claim 11, the curing rays to comprise
ultraviolet (UV) light.
13. The apparatus of claim 11, the curing rays to comprise infrared
(IR) light.
14. The apparatus of claim 11, the electronic element to comprise a
semiconductor die.
15. The apparatus of claim 14, the semiconductor die to comprise
one or more integrated circuits (ICs).
16. The apparatus of claim 11, the substrate to comprise a printed
circuit board (PCB).
17. The apparatus of claim 11, the underfill material to comprise
an NVL-curable epoxy.
18. A method, comprising: depositing a stencil material to form an
underfilling stencil for an electronic element mounted on a surface
of a substrate; dispensing an underfill material through one or
more openings of the underfilling stencil to form an underfill for
the electronic element, the underfill material to comprise a
non-visible light (NVL)-curable material; and projecting curing
rays to cure at least a portion of the dispensed underfill
material.
19. The method of claim 18, the curing rays to comprise ultraviolet
(UV) light.
20. The method of claim 18, the curing rays to comprise infrared
(IR) light.
21. The method of claim 18, at least a portion of the curing rays
to at least partially permeate the underfilling stencil.
22. The method of claim 18, the electronic element to comprise a
semiconductor die.
23. The method of claim 22, the semiconductor die to comprise one
or more integrated circuits (ICs).
24. The method of claim 18, the substrate to comprise a printed
circuit board (PCB).
25. The method of claim 18, the underfill material to comprise an
NVL-curable epoxy.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of, claims the benefit
of, and claims priority to U.S. patent application Ser. No.
15/089,491 filed on Apr. 2, 2016, the subject matter of which is
incorporated herein by reference in its entirety.
TECHNICAL FIELD
[0002] Embodiments herein generally relate to electronic
assemblies, such as electronic assemblies comprising electronic
components mounted on printed circuit boards (PCBs).
BACKGROUND
[0003] Some types of connection arrangements for surface mounting
electronic components to PCBs feature mounting connections of types
that provide limited mechanical flexibility. For example, due to
the rigidity of the solder balls of a ball grid array (BGA), even a
relatively slight degree of bending may result in solder joint
fracture. In order to safeguard against the potential for
mechanical stress upon an assembly to bend or otherwise deform the
substrate in such a way as to fracture mounting connections of a
given component, an underfill material may be implanted in the
region between that component and the substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1A illustrates an overhead view of a first electronic
assembly.
[0005] FIG. 1B illustrates a lateral view of the first electronic
assembly.
[0006] FIG. 2 illustrates an embodiment of a first underfilling
process.
[0007] FIG. 3 illustrates an embodiment of a dispense path.
[0008] FIG. 4 illustrates an embodiment of a first underfill
region.
[0009] FIG. 5 illustrates an embodiment of a first keep-out
zone.
[0010] FIG. 6 illustrates an embodiment of a dispense assembly.
[0011] FIG. 7 illustrates an embodiment of a second underfilling
process.
[0012] FIG. 8 illustrates an embodiment of a second underfill
region and an embodiment of a second keep-out zone.
[0013] FIG. 9 illustrates an embodiment of a third underfilling
process.
[0014] FIG. 10A illustrates an embodiment of a first stage of a
fourth underfilling process.
[0015] FIG. 10B illustrates an embodiment of a second stage of the
fourth underfilling process.
[0016] FIG. 11 illustrates an embodiment of a second electronic
assembly.
[0017] FIG. 12A illustrates an embodiment of a first stage of a
feature formation process.
[0018] FIG. 12B illustrates an embodiment of a second stage of the
feature formation process.
[0019] FIG. 12C illustrates an embodiment of a third stage of the
feature formation process.
[0020] FIG. 13 illustrates an embodiment of a first process
flow.
[0021] FIG. 14 illustrates an embodiment of a second process
flow.
[0022] FIG. 15 illustrates an embodiment of a storage medium.
[0023] FIG. 16 illustrates an embodiment of a computing
architecture.
[0024] FIG. 17 illustrates an embodiment of a system.
[0025] FIG. 18 illustrates an embodiment of a device.
DETAILED DESCRIPTION
[0026] Various embodiments may be generally directed to
space-efficient underfilling techniques for electronic assemblies.
According to some such techniques, an underfilling method may
comprise mounting an electronic element on a surface of a
substrate, dispensing an underfill material upon the surface of the
substrate within a dispense region for forming an underfill for the
electronic element, and projecting curing rays upon at least a
portion of the dispensed underfill material to inhibit an outward
flow of dispensed underfill material from the dispense region, and
the underfill material may comprise a non-visible light
(NVL)-curable material. Other embodiments are described and
claimed.
[0027] Various embodiments may comprise one or more elements. An
element may comprise any structure arranged to perform certain
operations. Each element may be implemented as hardware, software,
or any combination thereof, as desired for a given set of design
parameters or performance constraints. Although an embodiment may
be described with a limited number of elements in a certain
topology by way of example, the embodiment may include more or less
elements in alternate topologies as desired for a given
implementation. It is worthy to note that any reference to "one
embodiment" or "an embodiment" means that a particular feature,
structure, or characteristic described in connection with the
embodiment is included in at least one embodiment. The appearances
of the phrases "in one embodiment," "in some embodiments," and "in
various embodiments" in various places in the specification are not
necessarily all referring to the same embodiment.
[0028] FIG. 1A illustrates an overhead view of an electronic
assembly 100. Electronic assembly 100 comprises an element 102 and
a substrate 104, and element 102 is mounted on substrate 104. In
various embodiments, element 102 may generally comprise an
electronic element. In some embodiments, element 102 may comprise a
silicon die, or another type of semiconductor die. In various
embodiments, element 102 may comprise one or more integrated
circuits (ICs). In some embodiments, such IC(s) may comprise
processing circuitry. In various embodiments, such IC(s) may
comprise radio frequency (RF) transceiver circuitry. In some
embodiments, substrate 104 may comprise a printed circuit board
(PCB). The embodiments are not limited to these examples.
[0029] FIG. 1B illustrates a lateral view of an electronic assembly
100. As shown in FIG. 1B, in various embodiments, element 102 may
be mounted onto substrate 104 via a connection array 106.
Connection array 106 may generally comprise a set of one or more
connections that mechanically couple element 102 to substrate 104.
In some embodiments, some or all of the connections of connection
array 106 may comprise conductive connections that electronically
couple conductive features of element 102 with conductive features
of substrate 104. Examples of such conductive features according to
various embodiments may include--without limitation--traces,
tracks, vias, pads, lands, leads, and planes. In some embodiments,
connection array 106 may comprise the various solder balls that may
conductively connect an array of BGA pads on the surface of
substrate 104 to a corresponding array of BGA pads on the bottom of
element 102. The embodiments are not limited to this example.
[0030] In various embodiments, the nature of the connections in
connection array 106 may constrain the degree to which electronic
assembly 100 can flex in the vicinity of element 102 without
fracturing one or more of the connections in connection array 106.
For example, the acceptable flex in the vicinity of element 102 may
be significantly limited in some embodiments in which connection
array 106 comprises solder balls connecting BGA pads of element 102
to BGA pads of substrate 104. In various embodiments, in order to
safeguard against the potential for mechanical stress upon
electronic assembly 100 to bend or otherwise deform substrate 104
in such a way as to fracture connections of connection array 106,
it may be desirable to implant an underfill material to fill
unoccupied space between element 102 and the substrate 104.
[0031] FIG. 2 illustrates an embodiment of an underfilling process
according to which such an underfill may be formed according to
some embodiments. According to the underfilling process of FIG. 2,
a dispenser 208 may be used to dispense an underfill material 210
upon the surface of substrate 104. More particularly, in various
embodiments, dispenser 208 may dispense underfill material 210
within a dispense region. In some embodiments, dispenser 208 may
dispense underfill material 210 as dispenser 208 traverses a
dispense path, which may generally comprise a path along some or
all of the periphery of element 102. In such embodiments, the
dispense region may comprise the peripheral regions within which
the underfill material 210 is dispensed as dispenser 208 traverses
the dispense path. In various embodiments, capillary action may
draw dispensed underfill material 210 from the dispense region into
the unoccupied space between element 102 and substrate 104. In this
example, that unoccupied space may comprise the space not occupied
by connections of connection array 106.
[0032] In some embodiments, underfill material 210 may generally
comprise a material that remains substantially rigid or firm when
heated to a maximum temperature expected to be observed in the
vicinity of element 102 during ongoing operation. In various
embodiments, in order to enable underfill material 210 to flow
after being dispensed upon the surface of substrate 104, underfill
material 210 may be heated prior to being dispensed. In some
embodiments, heating underfill material 210 may cause it to
transition from a firm or highly-viscous state to a less viscous
state, which may increase its ability/tendency to flow into
unoccupied space beneath element 102. In various embodiments,
heating underfill material 210 may increase its tendency to be
drawn into unoccupied space beneath element 102 by capillary
action. In some embodiments, substrate 104 may also be heated in
order to enhance the capillary action effect. The embodiments are
not limited in this context.
[0033] FIG. 3 illustrates an embodiment of a dispense path 312 that
may be representative of a dispense path that may be traversed by
dispenser 208 in various embodiments according to the underfilling
process of FIG. 2. As shown in FIG. 3, dispense path 312 generally
comprises a path along all four sides of element 102. If dispenser
208 of FIG. 2 is configured to dispense underfill material 210
while traversing dispense path 312, then the dispense region may
generally comprise board space proximate to the four sides of
element 102. It is to be appreciated that numerous dispense paths
are both possible and contemplated, and the embodiments are not
limited to this example. In some embodiments, an implemented
dispense path may pass along a lesser number of sides of element
102, and/or may traverse a lesser portion of the periphery of
element 102. In various embodiments, rather than comprising a
continuous path, an implemented dispense path may comprise a set of
two or more non-contiguous sub-paths. The embodiments are not
limited in this context.
[0034] With respect to any given underfill process such as the
underfill process of FIG. 2, the term "underfill region" may be
used to collectively denote any space on the surface of substrate
104--other than that beneath element 102--that ultimately becomes
coated with underfill material in conjunction with that underfill
process. In some embodiments, while some dispensed underfill
material 210 may flow into the unoccupied space beneath element
102, other dispensed underfill material 210 may tend to flow
outwardly, away from element 102. In various embodiments, heating
underfill material 210 to enable it to more easily flow into the
unoccupied space beneath element 102 may increase the tendency for
some dispensed underfill material 210 to flow outwardly, away from
element 102, resulting in a larger underfill region.
[0035] FIG. 4 illustrates an underfill region 414 that may be
representative of the implementation of the underfilling process of
FIG. 2 according to some embodiments. With respect to any given
underfilling process, the term "underfill region" may be used to
collectively denote any space on the surface of the
substrate--other than that beneath the element to be
underfilled--that ultimately becomes coated with underfill material
in conjunction with that underfill process. Thus, underfill region
414 may be representative of the space on the surface of substrate
104--other than that beneath element 102--that becomes coated with
underfill material 210 in conjunction with the underfilling process
of FIG. 2. As reflected in FIG. 4, in various embodiments,
according to the underfilling process of FIG. 2, outwardly-flowing
underfill material 210 may reach regions of the surface of
substrate 104 that are significantly distant from element 102.
[0036] In some embodiments, for any of a variety of possible
reasons, it may not be desirable to mount or otherwise incorporate
other elements on regions of the surface of substrate 104 that are
(or will become) coated with underfill material. As such, in
various embodiments, a design for electronic assembly 100 may
define a keep-out zone to accommodate an underfill region such as
underfill region 414. In such embodiments, the keep-out zone may
generally comprise a defined region within which elements are not
to be mounted or otherwise incorporated upon the surface of
substrate 104. In some embodiments, a keep-out zone that is defined
for a given underfilling process may be slightly larger than the
expected underfill region with respect to that underfilling
process, in order to provide a margin for error FIG. 5 illustrates
an example of a keep-out zone (KOZ) 516 that may be defined to
accommodate underfill region 414 according to various embodiments.
In some embodiments, as reflected by the example of FIG. 5, the
amount of surface area that must be reserved as a keep-out zone in
conjunction with forming an underfill for element 102 according to
the underfilling process of FIG. 2 may be significant, and may even
exceed the amount of surface area occupied by element 102 in some
cases.
[0037] Disclosed herein are space-efficient underfilling techniques
that may be implemented in various embodiments in order to form an
underfill for an electronic element in a manner that consumes less
surface area relative to an underfilling process such as that of
FIG. 2. According to some such techniques, an underfilling process
may be designed such that the outward flow of dispensed underfill
material is inhibited in order to reduce the size of the underfill
region that results from that underfilling process. In various
embodiments, the use of such an underfilling process may enable a
reduction in the size of a keep-out zone for the electronic
element. The embodiments are not limited in this context.
[0038] FIG. 6 illustrates an embodiment of a dispense assembly 600
that may be used to implement one or more of the disclosed
space-efficient underfilling techniques according to some
embodiments. As shown in FIG. 6, dispense assembly may comprise a
dispenser 608 coupled with a light source 618. Dispenser 608 may
generally be configured to dispense an underfill material. In
various embodiments, dispenser 608 may be configured to dispense an
underfill material that can be cured using non-visible-light (NVL),
and light source 618 may be configured to emit non-visible light of
a nature appropriate for curing underfill material dispensed by
dispenser 608. As employed herein, the term "non-visible-light"
denotes electromagnetic radiation of wavelengths substantially
residing outside of the range of wavelengths typically visible to
the human eye. As employed herein to describe a given material, the
term "NVL-curable" denotes that the described material can be cured
using non-visible-light.
[0039] In some embodiments, dispenser 608 may be configured to
dispense an NVL-curable underfill material that can be cured using
ultraviolet (UV) light (a "UV-curable" underfill material), and
light source 618 may be configured to emit UV light of the nature
required to cure that UV-curable underfill material. In various
embodiments, dispenser 608 may be configured to dispense an
NVL-curable underfill material that can be cured using infrared
(IR) light (an "IR-curable" underfill material), and light source
618 may be configured to emit IR light of the nature required to
cure that IR-curable underfill material. The embodiments are not
limited to these examples.
[0040] FIG. 7 illustrates an embodiment of an underfilling process
that may be representative of the implementation of one or more of
the disclosed space-efficient underfilling techniques according to
some embodiments. In various embodiments, according to the
underfilling process of FIG. 7, dispenser 608 may generally
dispense an underfill material 710 upon the surface of substrate
104 within a dispense region for forming an underfill for element
102. In some embodiments, light source 618 may project a curing
beam 720 upon at least a portion of the dispensed underfill
material 710 to inhibit outward flow of dispensed underfill
material 710 from the dispense region. Curing beam 720 may
generally comprise light rays of a type usable to cure underfill
material 710.
[0041] In various embodiments, in conjunction with being used to
form an underfill for element 102, dispense assembly 600 may
generally be positioned such that dispenser 608 is situated between
light source 618 and element 102. In some embodiments, dispensed
underfill material 710 that flows away from element 102 may quickly
be cured by curing beam 720, while the flow of dispensed underfill
material 710 towards element 102 may be unrestricted. In various
embodiments, the curing of dispensed underfill material 710 by
curing beam 720 may create a dam-like effect, according to which
the outward flow of dispensed underfill material 710 may be blocked
by cured underfill material 710 in its path, forcing the material
to flow in the opposite direction. In some embodiments, dispense
assembly 600 may be conveyed along a dispense path, such as
dispense path 312 of FIG. 3. In various embodiments, dispenser 608
may dispense underfill material 710 within the dispense region by
dispensing underfill material 710 as dispense assembly 600
traverses the dispense path. In some embodiments, light source 618
may project curing beam 720 upon dispensed underfill material 710
as dispense assembly 600 traverses the dispense path. The
embodiments are not limited in this context.
[0042] In various embodiments, underfill material 710 may comprise
an NVL-curable material, and curing rays 1020 may comprise
non-visible light of a nature appropriate for curing that
NVL-curable material. In some embodiments, underfill material 710
may comprise a UV-curable material, and curing beam 720 may
comprise UV light. In various embodiments, underfill material 710
may comprise an IR-curable material, and curing beam 720 may
comprise IR light. In some embodiments, underfill material 710 may
comprise an NVL-curable epoxy. For example, in various embodiments,
underfill material 710 may comprise a cationic UV-curable epoxy or
a free radical UV-curable epoxy. In some embodiments, underfill
material 710 may comprise an NVL-curable material, such as an
NVL-curable epoxy, that is also thermally curable. The embodiments
are not limited in this context.
[0043] FIG. 8 illustrates an underfill region 814 that may be
representative of the implementation of the underfilling process of
FIG. 7 according to various embodiments. For example, underfill
region 814 may be representative of an underfill region that
results when an NVL-curable underfill material is dispensed by
dispense assembly 600 of FIG. 6 as it traverses dispense path 312
of FIG. 3. Unlike underfill region 414 of FIG. 4, underfill region
814 only extends a small distance outward from the periphery of
element 102. As such, as shown in FIG. 8, the use of the
underfilling process of FIG. 7 may permit the implementation of a
keep-out zone 816 that is significantly smaller than the keep-out
zone 516 that may be required to accommodate underfill region 414
in conjunction with implementation of the underfilling process of
FIG. 2. The embodiments are not limited to this example.
[0044] FIG. 9 illustrates an embodiment of another underfilling
process that may be representative of the implementation of one or
more of the disclosed space-efficient underfilling techniques
according to some embodiments. According to the underfilling
process of FIG. 9, rather than being projected by a light source
that moves in tandem with the dispenser that dispenses the
underfill material, the curing rays may be continuously projected
upon a static curing region that surrounds the dispense region. For
example, curing rays may be projected upon the curing region in the
form of curing frame 922. Although curing frame 922 is depicted in
this example as being square in shape, other shapes are both
possible and contemplated, and the embodiments are not limited to
this example. In various embodiments, portions of underfill
material that flow away from element 102 and are cured by curing
frame 922 may essentially act as an o-ring, seal, dam, or other
type of obstacle that prevents or inhibits flow of underfill
material away from element 102. According to some embodiments, the
underfilling process of FIG. 9 may be well-suited for use in
forming an underfill for a semiconductor die, and/or in situations
requiring glob top control or dam and fill applications, such as
wirebond protection applications. According to various embodiments,
in the latter case, an exposure LED pattern may be projected around
the underfill material dispenser. The embodiments are not limited
to this example.
[0045] FIGS. 10A and 10B illustrate first and second stages of
another underfilling process that may be representative of the
implementation of one or more of the disclosed space-efficient
underfilling techniques according to some embodiments. As reflected
in FIG. 10A, the first stage may involve forming an underfilling
stencil 1024 for an element 1002 mounted on a surface of a
substrate 1004. In various embodiments, underfilling stencil 1024
may be formed by deposition of a stencil material. In some
embodiments, element 102 may generally comprise an electronic
element. In various embodiments, element 102 may comprise a silicon
die, or another type of semiconductor die. In some embodiments,
element 102 may comprise one or more integrated circuits (ICs). In
various embodiments, such IC(s) may comprise processing circuitry.
In some embodiments, such IC(s) may comprise radio frequency (RF)
transceiver circuitry. In various embodiments, substrate 104 may
comprise a printed circuit board (PCB). The embodiments are not
limited to these examples.
[0046] As reflected in FIG. 10B, the second stage may involve
dispensing underfill material 1010 to form an underfill for element
1002. In some embodiments, underfill material 1010 may be dispensed
through one or more openings of underfilling stencil 1024. In
various embodiments, a light source 1018 may be used to project
curing rays 1020 in order to cure at least a portion of the
dispensed underfilling material 1010. In some embodiments, at least
a portion of curing rays 1020 may at least partially permeate
underfilling stencil 1024 in conjunction with curing the underfill
material 1010. In various embodiments, curing rays 1020 may be
projected for an amount of time sufficient to cause some or all of
the dispensed underfill material 1010 to hold its shape, and
underfilling stencil 1024 may then be removed. In some embodiments,
the underfilling process of FIGS. 10A and 10B may be well-suited
for use in strip level applications, and/or system in package (SiP)
applications in which the dispensing of underfill material may tend
to be time consuming. The embodiments are not limited in this
context.
[0047] In various embodiments, underfill material 1010 may comprise
an NVL-curable material, and curing rays 1020 may comprise
non-visible light of a nature appropriate for curing that
NVL-curable material. In some embodiments, underfill material 1010
may comprise a UV-curable material, and curing rays 1020 may
comprise UV light. In various embodiments, underfill material 1010
may comprise an IR-curable material, and curing rays 1020 may
comprise IR light. In some embodiments, underfill material 1010 may
comprise an NVL-curable epoxy. For example, in various embodiments,
underfill material 1010 may comprise a cationic UV-curable epoxy or
a free radical UV-curable epoxy. In some embodiments, underfill
material 1010 may comprise an NVL-curable material, such as an
NVL-curable epoxy, that is also thermally curable. The embodiments
are not limited in this context.
[0048] FIG. 11 illustrates a lateral view of an electronic assembly
1100. As shown in FIG. 11, electronic assembly 1100 comprises a
substrate 1104, as well as a plurality of elements 1126 and 1128
that are embedded in and/or mounted on that substrate 1104. In
various embodiments, elements 1128 may comprise electronic
components/packages that are mounted on substrate 1104. In some
embodiments, elements 1126 may comprise conductive features, such
as traces, tracks, vias, pads, lands, leads, and planes. The
embodiments are not limited in this context.
[0049] FIGS. 12A, 12B, and 12C illustrate first, second, and third
stages of a feature formation process that may be representative of
the implementation of one or more techniques disclosed herein. As
reflected in FIG. 12A, the first stage of the feature formation
process may involve forming a stencil 1224. In various embodiments,
stencil 1224 may be formed by deposition of a stencil material. As
reflected in FIG. 12B, the second stage of the feature formation
process may involve dispensing a material 1210 in order to form
features upon elements 1126. In some embodiments, material 1210 may
be dispensed through openings of stencil 1224 that generally
coincide with the locations of elements 1126. In various
embodiments, a light source 1218 may be used to project curing rays
1220 in order to cure at least a portion of the dispensed material
1210. In some embodiments, at least a portion of curing rays 1220
may at least partially permeate stencil 1224 in conjunction with
curing the material 1210. In various embodiments, curing rays 1220
may be projected for an amount of time sufficient to cause the
dispensed material 1210 to hold its shape. In some embodiments, the
third stage of the feature formation process may involve removing
stencil 1224. In various embodiments, as reflected in FIG. 12C, the
curing of the dispensed material 1210 during the second phase may
cause the dispensed material 1210 to harden and form features 1230
that hold their shape once stencil 1224 is removed. The embodiments
are not limited in this context.
[0050] In various embodiments, material 1210 may comprise an
NVL-curable material, and curing rays 1220 may comprise non-visible
light of a nature appropriate for curing that NVL-curable material.
In some embodiments, material 1210 may comprise a UV-curable
material, and curing rays 1220 may comprise UV light. In various
embodiments, material 1210 may comprise an IR-curable material, and
curing rays 1220 may comprise IR light. In some embodiments,
material 1210 may comprise an NVL-curable epoxy. For example, in
various embodiments, material 1210 may comprise a cationic
UV-curable epoxy or a free radical UV-curable epoxy. In some
embodiments, material 1210 may comprise an NVL-curable material,
such as an NVL-curable epoxy, that is also thermally curable. The
embodiments are not limited in this context.
[0051] Operations for the above embodiments may be further
described with reference to the following figures and accompanying
examples. Some of the figures may include a process flow. Although
such figures presented herein may include a particular process
flow, it can be appreciated that the process flow merely provides
an example of how one or more techniques described herein may be
implemented. Any particular such process flow may be implemented
using one or more hardware elements, one or more software elements
executed by a processor, or any combination thereof. The
embodiments are not limited in this context.
[0052] FIG. 13 illustrates an example of a process flow 1300 that
may be representative of the implementation of one or more of the
disclosed techniques according to some embodiments. For example,
process flow 1300 may be representative of one or both of the
underfilling process of FIG. 7 and the underfilling process of FIG.
9. As shown in FIG. 13, an electronic element may be mounted on a
surface of a substrate at 1302. For example, element 102 may be
mounted on a surface of substrate 104. At 1304, an NVL-curable
underfill material may be dispensed upon the surface of the
substrate within a dispense region for forming an underfill for the
electronic element. For example, dispense assembly 600 of FIG. 6
may be conveyed along a dispense path, and may dispense NVL-curable
underfill material upon the surface of the substrate within the
dispense region as it traverses the dispense path. At 1306, curing
rays may be projected upon at least a portion of the dispensed
underfill material to inhibit an outward flow of dispensed
underfill material from the dispense region. For example, light
source 618 of FIG. 6 may project a curing beam upon dispensed
underfill material as dispense assembly 600 traverses a dispense
path. The embodiments are not limited to these examples.
[0053] FIG. 14 illustrates an example of a process flow 1400 that
may be representative of the implementation of one or more of the
disclosed techniques according to various embodiments. For example,
process flow 1400 may be representative of the underfilling process
of FIGS. 10A and 10B. As shown in FIG. 14, stencil material may be
deposited at 1402 to form an underfilling stencil for an electronic
element mounted on a surface of a substrate. For example, stencil
material may be deposited to form underfilling stencil 1024 of FIG.
10A. At 1404, an NVL-curable underfill material may be dispensed
through one or more openings of the underfilling stencil to form an
underfill for the electronic element. For example, underfill
material 1010 of FIG. 10B may be dispensed through one or more
openings of underfilling stencil 1024 to form an underfill for
element 1002. At 1406, curing rays may be projected to cure at
least a portion of the disposed underfill material. For example,
light source 1018 of FIG. 10B may project curing rays 1020 to cure
at least a portion of the underfill material 1010 dispensed in
order to form the underfill for element 1002. The embodiments are
not limited to these examples.
[0054] It is worthy of note that although the preceding discussion
has been directed to example embodiments in which an NVL-curable
underfill material is used, the embodiments are not so limited. Any
light-curable underfill material may potentially be used in
conjunction with implementation of one or more of the disclosed
techniques according to various embodiments. As employed herein to
describe a given material, the term "light-curable" denotes that
the material can be cured using electromagnetic radiation of some
kind, which may or may not comprise non-visible light. In some
embodiments, a light-curable underfill material may be dispensed
and cured according to one or more of the disclosed techniques. In
various embodiments, the light-curable underfill material may
comprise an NVL-curable material, such as a UV-curable material or
an IR-curable material, that is cured using non-visible light. In
some other embodiments, the light-curable underfill material may
comprise a visible light (VL)-curable material that is cured using
visible light. In various embodiments, it may be possible to cure
the light-curable underfill material both by using non-visible
light and by using visible light. In some embodiments, a
combination of non-visible light and visible light may be used to
cure the light-curable underfill material. The embodiments are not
limited in this context.
[0055] FIG. 15 illustrates an embodiment of a storage medium 1500.
Storage medium 1500 may comprise any computer-readable storage
medium or machine-readable storage medium, such as an optical,
magnetic or semiconductor storage medium. In various embodiments,
storage medium 1500 may comprise an article of manufacture. In some
embodiments, storage medium 1500 may comprise a non-transitory
storage medium. In some embodiments, storage medium 1500 may store
computer-executable instructions, such as computer-executable
instructions to implement one or both of process flow 1300 of FIG.
13 and process flow 1400 of FIG. 14. Examples of a
computer-readable storage medium or machine-readable storage medium
may include any tangible media capable of storing electronic data,
including volatile memory or non-volatile memory, removable or
non-removable memory, erasable or non-erasable memory, writeable or
re-writeable memory, and so forth. Examples of computer-executable
instructions may include any suitable type of code, such as source
code, compiled code, interpreted code, executable code, static
code, dynamic code, object-oriented code, visual code, and the
like. The embodiments are not limited in this context.
[0056] FIG. 16 illustrates an embodiment of an exemplary computing
architecture 1600 that may be suitable for implementing various
embodiments as previously described. In various embodiments, the
computing architecture 1600 may comprise or be implemented as part
of an electronic device. In some embodiments, the computing
architecture 1600 may be representative of a computing device that
comprises a structure featuring an electronic assembly constructed
to one or more of the disclosed techniques, such as one or more of
the underfilling process of FIG. 7, the underfilling process of
FIG. 9, the underfilling process of FIGS. 10A and 10B, the feature
formation process of FIGS. 12A, 12B, and 12C, process flow 1300 of
FIG. 13, and process flow 1400 of FIG. 14. The embodiments are not
limited in this context.
[0057] As used in this application, the terms "system" and
"component" and "module" are intended to refer to a
computer-related entity, either hardware, a combination of hardware
and software, software, or software in execution, examples of which
are provided by the exemplary computing architecture 1600. For
example, a component can be, but is not limited to being, a process
running on a processor, a processor, a hard disk drive, multiple
storage drives (of optical and/or magnetic storage medium), an
object, an executable, a thread of execution, a program, and/or a
computer. By way of illustration, both an application running on a
server and the server can be a component. One or more components
can reside within a process and/or thread of execution, and a
component can be localized on one computer and/or distributed
between two or more computers. Further, components may be
communicatively coupled to each other by various types of
communications media to coordinate operations. The coordination may
involve the uni-directional or bi-directional exchange of
information. For instance, the components may communicate
information in the form of signals communicated over the
communications media. The information can be implemented as signals
allocated to various signal lines. In such allocations, each
message is a signal. Further embodiments, however, may
alternatively employ data messages. Such data messages may be sent
across various connections. Exemplary connections include parallel
interfaces, serial interfaces, and bus interfaces.
[0058] The computing architecture 1600 includes various common
computing elements, such as one or more processors, multi-core
processors, co-processors, memory units, chipsets, controllers,
peripherals, interfaces, oscillators, timing devices, video cards,
audio cards, multimedia input/output (I/O) components, power
supplies, and so forth. The embodiments, however, are not limited
to implementation by the computing architecture 1600.
[0059] As shown in FIG. 16, according to computing architecture
1600, a computer 1602 comprises a processing unit 1604, a system
memory 1606 and a system bus 1608. In some embodiments, computer
1602 may comprise a server. In some embodiments, computer 1602 may
comprise a client. The processing unit 1604 can be any of various
commercially available processors, including without limitation an
AMD.RTM. Athlon.RTM., Duron.RTM. and Opteron.RTM. processors;
ARM.RTM. application, embedded and secure processors; IBM.RTM. and
Motorola.RTM. DragonBall.RTM. and PowerPC.RTM. processors; IBM and
Sony.RTM. Cell processors; Intel.RTM. Celeron.RTM., Core (2)
Duo.RTM., Itanium.RTM., Pentium.RTM., Xeon.RTM., and XScale.RTM.
processors; and similar processors. Dual microprocessors,
multi-core processors, and other multi-processor architectures may
also be employed as the processing unit 1604.
[0060] The system bus 1608 provides an interface for system
components including, but not limited to, the system memory 1606 to
the processing unit 1604. The system bus 1608 can be any of several
types of bus structure that may further interconnect to a memory
bus (with or without a memory controller), a peripheral bus, and a
local bus using any of a variety of commercially available bus
architectures. Interface adapters may connect to the system bus
1608 via a slot architecture. Example slot architectures may
include without limitation Accelerated Graphics Port (AGP), Card
Bus, (Extended) Industry Standard Architecture ((E)ISA), Micro
Channel Architecture (MCA), NuBus, Peripheral Component
Interconnect (Extended) (PCI(X)), PCI Express, Personal Computer
Memory Card International Association (PCMCIA), and the like.
[0061] The system memory 1606 may include various types of
computer-readable storage media in the form of one or more higher
speed memory units, such as read-only memory (ROM), random-access
memory (RAM), dynamic RAM (DRAM), Double-Data-Rate DRAM (DDRAM),
synchronous DRAM (SDRAM), static RAM (SRAM), programmable ROM
(PROM), erasable programmable ROM (EPROM), electrically erasable
programmable ROM (EEPROM), flash memory, polymer memory such as
ferroelectric polymer memory, ovonic memory, phase change or
ferroelectric memory, silicon-oxide-nitride-oxide-silicon (SONOS)
memory, magnetic or optical cards, an array of devices such as
Redundant Array of Independent Disks (RAID) drives, solid state
memory devices (e.g., USB memory, solid state drives (SSD) and any
other type of storage media suitable for storing information. In
the illustrated embodiment shown in FIG. 16, the system memory 1606
can include non-volatile memory 1610 and/or volatile memory 1612. A
basic input/output system (BIOS) can be stored in the non-volatile
memory 1610.
[0062] The computer 1602 may include various types of
computer-readable storage media in the form of one or more lower
speed memory units, including an internal (or external) hard disk
drive (HDD) 1614, a magnetic floppy disk drive (FDD) 1616 to read
from or write to a removable magnetic disk 1618, and an optical
disk drive 1620 to read from or write to a removable optical disk
1622 (e.g., a CD-ROM or DVD). The HDD 1614, FDD 1616 and optical
disk drive 1620 can be connected to the system bus 1608 by a HDD
interface 1624, an FDD interface 1626 and an optical drive
interface 1628, respectively. The HDD interface 1624 for external
drive implementations can include at least one or both of Universal
Serial Bus (USB) and IEEE 1394 interface technologies.
[0063] The drives and associated computer-readable media provide
volatile and/or nonvolatile storage of data, data structures,
computer-executable instructions, and so forth. For example, a
number of program modules can be stored in the drives and memory
units 1610, 1612, including an operating system 1630, one or more
application programs 1632, other program modules 1634, and program
data 1636.
[0064] A user can enter commands and information into the computer
1602 through one or more wire/wireless input devices, for example,
a keyboard 1638 and a pointing device, such as a mouse 1640. Other
input devices may include microphones, infra-red (IR) remote
controls, radio-frequency (RF) remote controls, game pads, stylus
pens, card readers, dongles, finger print readers, gloves, graphics
tablets, joysticks, keyboards, retina readers, touch screens (e.g.,
capacitive, resistive, etc.), trackballs, trackpads, sensors,
styluses, and the like. These and other input devices are often
connected to the processing unit 1604 through an input device
interface 1642 that is coupled to the system bus 1608, but can be
connected by other interfaces such as a parallel port, IEEE 1394
serial port, a game port, a USB port, an IR interface, and so
forth.
[0065] A monitor 1644 or other type of display device is also
connected to the system bus 1608 via an interface, such as a video
adaptor 1646. The monitor 1644 may be internal or external to the
computer 1602. In addition to the monitor 1644, a computer
typically includes other peripheral output devices, such as
speakers, printers, and so forth.
[0066] The computer 1602 may operate in a networked environment
using logical connections via wire and/or wireless communications
to one or more remote computers, such as a remote computer 1648.
The remote computer 1648 can be a workstation, a server computer, a
router, a personal computer, portable computer,
microprocessor-based entertainment appliance, a peer device or
other common network node, and typically includes many or all of
the elements described relative to the computer 1602, although, for
purposes of brevity, only a memory/storage device 1650 is
illustrated. The logical connections depicted include wire/wireless
connectivity to a local area network (LAN) 1652 and/or larger
networks, for example, a wide area network (WAN) 1654. Such LAN and
WAN networking environments are commonplace in offices and
companies, and facilitate enterprise-wide computer networks, such
as intranets, all of which may connect to a global communications
network, for example, the Internet.
[0067] When used in a LAN networking environment, the computer 1602
is connected to the LAN 1652 through a wire and/or wireless
communication network interface or adaptor 1656. The adaptor 1656
can facilitate wire and/or wireless communications to the LAN 1652,
which may also include a wireless access point disposed thereon for
communicating with the wireless functionality of the adaptor
1656.
[0068] When used in a WAN networking environment, the computer 1602
can include a modem 1658, or is connected to a communications
server on the WAN 1654, or has other means for establishing
communications over the WAN 1654, such as by way of the Internet.
The modem 1658, which can be internal or external and a wire and/or
wireless device, connects to the system bus 1608 via the input
device interface 1642. In a networked environment, program modules
depicted relative to the computer 1602, or portions thereof, can be
stored in the remote memory/storage device 1650. It will be
appreciated that the network connections shown are exemplary and
other means of establishing a communications link between the
computers can be used.
[0069] The computer 1602 is operable to communicate with wire and
wireless devices or entities using the IEEE 802 family of
standards, such as wireless devices operatively disposed in
wireless communication (e.g., IEEE 802.16 over-the-air modulation
techniques). This includes at least Wi-Fi (or Wireless Fidelity),
WiMax, and Bluetooth.TM. wireless technologies, among others. Thus,
the communication can be a predefined structure as with a
conventional network or simply an ad hoc communication between at
least two devices. Wi-Fi networks use radio technologies called
IEEE 802.11x (a, b, g, n, etc.) to provide secure, reliable, fast
wireless connectivity. A Wi-Fi network can be used to connect
computers to each other, to the Internet, and to wire networks
(which use IEEE 802.3-related media and functions).
[0070] FIG. 17 illustrates an embodiment of a system 1700. In
various embodiments, system 1700 may be representative of a system
or architecture that is realized according to one or more
techniques described herein, such as one or more of the
underfilling process of FIG. 7, the underfilling process of FIG. 9,
the underfilling process of FIGS. 10A and 10B, the feature
formation process of FIGS. 12A, 12B, and 12C, process flow 1300 of
FIG. 13, process flow 1400 of FIG. 14, storage medium 1500 of FIG.
15, and computing architecture 1600 of FIG. 16. The embodiments are
not limited in this respect.
[0071] As shown in FIG. 17, system 1700 may include multiple
elements. One or more elements may be implemented using one or more
circuits, components, registers, processors, software subroutines,
modules, or any combination thereof, as desired for a given set of
design or performance constraints. Although FIG. 17 shows a limited
number of elements in a certain topology by way of example, it can
be appreciated that more or less elements in any suitable topology
may be used in system 1700 as desired for a given implementation.
The embodiments are not limited in this context.
[0072] In embodiments, system 1700 may be a media system although
system 1700 is not limited to this context. For example, system
1700 may be incorporated into a personal computer (PC), laptop
computer, ultra-laptop computer, tablet, touch pad, portable
computer, handheld computer, palmtop computer, personal digital
assistant (PDA), cellular telephone, combination cellular
telephone/PDA, television, smart device (e.g., smart phone, smart
tablet or smart television), mobile internet device (MID),
messaging device, data communication device, and so forth.
[0073] In embodiments, system 1700 includes a platform 1701 coupled
to a display 1745. Platform 1701 may receive content from a content
device such as content services device(s) 1748 or content delivery
device(s) 1749 or other similar content sources. A navigation
controller 1750 including one or more navigation features may be
used to interact with, for example, platform 1701 and/or display
1745. Each of these components is described in more detail
below.
[0074] In embodiments, platform 1701 may include any combination of
a processor circuit 1702, chipset 1703, memory unit 1704,
transceiver 1744, storage 1746, applications 1751, and/or graphics
subsystem 1752. Chipset 1703 may provide intercommunication among
processor circuit 1702, memory unit 1704, transceiver 1744, storage
1746, applications 1751, and/or graphics subsystem 1752. For
example, chipset 1703 may include a storage adapter (not depicted)
capable of providing intercommunication with storage 1746.
[0075] Processor circuit 1702 may be implemented using any
processor or logic device, and may be the same as or similar to
processing unit 1604 of FIG. 16. Memory unit 1704 may be
implemented using any machine-readable or computer-readable media
capable of storing data, and may be the same as or similar to
system memory 1606 of FIG. 16. Transceiver 1744 may include one or
more radios capable of transmitting and receiving signals using
various suitable wireless communications techniques. Display 1745
may include any television type monitor or display, and may be the
same as or similar to monitor 1644 of FIG. 16. Storage 1746 may be
implemented as a non-volatile storage device, and may be the same
as or similar to HDD 1614 of FIG. 16.
[0076] Graphics subsystem 1752 may perform processing of images
such as still or video for display. Graphics subsystem 1752 may be
a graphics processing unit (GPU) or a visual processing unit (VPU),
for example. An analog or digital interface may be used to
communicatively couple graphics subsystem 1752 and display 1745.
For example, the interface may be any of a High-Definition
Multimedia Interface, DisplayPort, wireless HDMI, and/or wireless
HD compliant techniques. Graphics subsystem 1752 could be
integrated into processor circuit 1702 or chipset 1703. Graphics
subsystem 1752 could be a stand-alone card communicatively coupled
to chipset 1703.
[0077] The graphics and/or video processing techniques described
herein may be implemented in various hardware architectures. For
example, graphics and/or video functionality may be integrated
within a chipset. Alternatively, a discrete graphics and/or video
processor may be used. As still another embodiment, the graphics
and/or video functions may be implemented by a general purpose
processor, including a multi-core processor. In a further
embodiment, the functions may be implemented in a consumer
electronics device.
[0078] In embodiments, content services device(s) 1748 may be
hosted by any national, international and/or independent service
and thus accessible to platform 1701 via the Internet, for example.
Content services device(s) 1748 may be coupled to platform 1701
and/or to display 1745. Platform 1701 and/or content services
device(s) 1748 may be coupled to a network 1753 to communicate
(e.g., send and/or receive) media information to and from network
1753. Content delivery device(s) 1749 also may be coupled to
platform 1701 and/or to display 1745.
[0079] In embodiments, content services device(s) 1748 may include
a cable television box, personal computer, network, telephone,
Internet enabled devices or appliance capable of delivering digital
information and/or content, and any other similar device capable of
unidirectionally or bidirectionally communicating content between
content providers and platform 1701 and/display 1745, via network
1753 or directly. It will be appreciated that the content may be
communicated unidirectionally and/or bidirectionally to and from
any one of the components in system 1700 and a content provider via
network 1753. Examples of content may include any media information
including, for example, video, music, medical and gaming
information, and so forth.
[0080] Content services device(s) 1748 receives content such as
cable television programming including media information, digital
information, and/or other content. Examples of content providers
may include any cable or satellite television or radio or Internet
content providers. The provided examples are not meant to limit
embodiments of the disclosed subject matter.
[0081] In embodiments, platform 1701 may receive control signals
from navigation controller 1750 having one or more navigation
features. The navigation features of navigation controller 1750 may
be used to interact with a user interface 1754, for example. In
embodiments, navigation controller 1750 may be a pointing device
that may be a computer hardware component (specifically human
interface device) that allows a user to input spatial (e.g.,
continuous and multi-dimensional) data into a computer. Many
systems such as graphical user interfaces (GUI), and televisions
and monitors allow the user to control and provide data to the
computer or television using physical gestures.
[0082] Movements of the navigation features of navigation
controller 1750 may be echoed on a display (e.g., display 1745) by
movements of a pointer, cursor, focus ring, or other visual
indicators displayed on the display. For example, under the control
of software applications 1751, the navigation features located on
navigation controller 1750 may be mapped to virtual navigation
features displayed on user interface 1754. In embodiments,
navigation controller 1750 may not be a separate component but
integrated into platform 1701 and/or display 1745. Embodiments,
however, are not limited to the elements or in the context shown or
described herein.
[0083] In embodiments, drivers (not shown) may include technology
to enable users to instantly turn on and off platform 1701 like a
television with the touch of a button after initial boot-up, when
enabled, for example. Program logic may allow platform 1701 to
stream content to media adaptors or other content services
device(s) 1748 or content delivery device(s) 1749 when the platform
is turned "off." In addition, chip set 1703 may include hardware
and/or software support for 5.1 surround sound audio and/or high
definition 7.1 surround sound audio, for example. Drivers may
include a graphics driver for integrated graphics platforms. In
embodiments, the graphics driver may include a peripheral component
interconnect (PCI) Express graphics card.
[0084] In various embodiments, any one or more of the components
shown in system 1700 may be integrated. For example, platform 1701
and content services device(s) 1748 may be integrated, or platform
1701 and content delivery device(s) 1749 may be integrated, or
platform 1701, content services device(s) 1748, and content
delivery device(s) 1749 may be integrated, for example. In various
embodiments, platform 1701 and display 1745 may be an integrated
unit. Display 1745 and content service device(s) 1748 may be
integrated, or display 1745 and content delivery device(s) 1749 may
be integrated, for example. These examples are not meant to limit
the disclosed subject matter.
[0085] In various embodiments, system 1700 may be implemented as a
wireless system, a wired system, or a combination of both. When
implemented as a wireless system, system 1700 may include
components and interfaces suitable for communicating over a
wireless shared media, such as one or more antennas, transmitters,
receivers, transceivers, amplifiers, filters, control logic, and so
forth. An example of wireless shared media may include portions of
a wireless spectrum, such as the RF spectrum and so forth. When
implemented as a wired system, system 1700 may include components
and interfaces suitable for communicating over wired communications
media, such as I/O adapters, physical connectors to connect the I/O
adapter with a corresponding wired communications medium, a network
interface card (NIC), disc controller, video controller, audio
controller, and so forth. Examples of wired communications media
may include a wire, cable, metal leads, printed circuit board
(PCB), backplane, switch fabric, semiconductor material,
twisted-pair wire, co-axial cable, fiber optics, and so forth.
[0086] Platform 1701 may establish one or more logical or physical
channels to communicate information. The information may include
media information and control information. Media information may
refer to any data representing content meant for a user. Examples
of content may include, for example, data from a voice
conversation, videoconference, streaming video, electronic mail
("email") message, voice mail message, alphanumeric symbols,
graphics, image, video, text and so forth. Data from a voice
conversation may be, for example, speech information, silence
periods, background noise, comfort noise, tones and so forth.
Control information may refer to any data representing commands,
instructions or control words meant for an automated system. For
example, control information may be used to route media information
through a system, or instruct a node to process the media
information in a predetermined manner. The embodiments, however,
are not limited to the elements or in the context shown or
described in FIG. 17.
[0087] As described above, system 1700 may be embodied in varying
physical styles or form factors. FIG. 18 illustrates embodiments of
a small form factor device 1800 in which system 1700 may be
embodied. In embodiments, for example, device 1800 may be
implemented as a mobile computing device having wireless
capabilities. A mobile computing device may refer to any device
having a processing system and a mobile power source or supply,
such as one or more batteries, for example.
[0088] As described above, examples of a mobile computing device
may include a personal computer (PC), laptop computer, ultra-laptop
computer, tablet, touch pad, portable computer, handheld computer,
palmtop computer, personal digital assistant (PDA), cellular
telephone, combination cellular telephone/PDA, television, smart
device (e.g., smart phone, smart tablet or smart television),
mobile internet device (MID), messaging device, data communication
device, and so forth.
[0089] Examples of a mobile computing device also may include
computers that are arranged to be worn by a person, such as a wrist
computer, finger computer, ring computer, eyeglass computer,
belt-clip computer, arm-band computer, shoe computers, clothing
computers, and other wearable computers. In embodiments, for
example, a mobile computing device may be implemented as a smart
phone capable of executing computer applications, as well as voice
communications and/or data communications. Although some
embodiments may be described with a mobile computing device
implemented as a smart phone by way of example, it may be
appreciated that other embodiments may be implemented using other
wireless mobile computing devices as well. The embodiments are not
limited in this context.
[0090] As shown in FIG. 18, device 1800 may include a display 1845,
a navigation controller 1850, a user interface 1854, a housing
1855, an I/O device 1856, and an antenna 1857. Display 1845 may
include any suitable display unit for displaying information
appropriate for a mobile computing device, and may be the same as
or similar to display 1745 in FIG. 17. Navigation controller 1850
may include one or more navigation features which may be used to
interact with user interface 1854, and may be the same as or
similar to navigation controller 1750 in FIG. 17. I/O device 1856
may include any suitable I/O device for entering information into a
mobile computing device. Examples for I/O device 1856 may include
an alphanumeric keyboard, a numeric keypad, a touch pad, input
keys, buttons, switches, rocker switches, microphones, speakers,
voice recognition device and software, and so forth. Information
also may be entered into device 1800 by way of microphone. Such
information may be digitized by a voice recognition device. The
embodiments are not limited in this context.
[0091] Various embodiments may be implemented using hardware
elements, software elements, or a combination of both. Examples of
hardware elements may include processors, microprocessors,
circuits, circuit elements (e.g., transistors, resistors,
capacitors, inductors, and so forth), integrated circuits,
application specific integrated circuits (ASIC), programmable logic
devices (PLD), digital signal processors (DSP), field programmable
gate array (FPGA), logic gates, registers, semiconductor device,
chips, microchips, chip sets, and so forth. Examples of software
may include software components, programs, applications, computer
programs, application programs, system programs, machine programs,
operating system software, middleware, firmware, software modules,
routines, subroutines, functions, methods, procedures, software
interfaces, application program interfaces (API), instruction sets,
computing code, computer code, code segments, computer code
segments, words, values, symbols, or any combination thereof.
Determining whether an embodiment is implemented using hardware
elements and/or software elements may vary in accordance with any
number of factors, such as desired computational rate, power
levels, heat tolerances, processing cycle budget, input data rates,
output data rates, memory resources, data bus speeds and other
design or performance constraints.
[0092] One or more aspects of at least one embodiment may be
implemented by representative instructions stored on a
machine-readable medium which represents various logic within the
processor, which when read by a machine causes the machine to
fabricate logic to perform the techniques described herein. Such
representations, known as "IP cores" may be stored on a tangible,
machine readable medium and supplied to various customers or
manufacturing facilities to load into the fabrication machines that
actually make the logic or processor. Some embodiments may be
implemented, for example, using a machine-readable medium or
article which may store an instruction or a set of instructions
that, if executed by a machine, may cause the machine to perform a
method and/or operations in accordance with the embodiments. Such a
machine may include, for example, any suitable processing platform,
computing platform, computing device, processing device, computing
system, processing system, computer, processor, or the like, and
may be implemented using any suitable combination of hardware
and/or software. The machine-readable medium or article may
include, for example, any suitable type of memory unit, memory
device, memory article, memory medium, storage device, storage
article, storage medium and/or storage unit, for example, memory,
removable or non-removable media, erasable or non-erasable media,
writeable or re-writeable media, digital or analog media, hard
disk, floppy disk, Compact Disk Read Only Memory (CD-ROM), Compact
Disk Recordable (CD-R), Compact Disk Rewriteable (CD-RW), optical
disk, magnetic media, magneto-optical media, removable memory cards
or disks, various types of Digital Versatile Disk (DVD), a tape, a
cassette, or the like. The instructions may include any suitable
type of code, such as source code, compiled code, interpreted code,
executable code, static code, dynamic code, encrypted code, and the
like, implemented using any suitable high-level, low-level,
object-oriented, visual, compiled and/or interpreted programming
language.
[0093] The following examples pertain to further embodiments:
[0094] Example 1 is a method, comprising mounting an electronic
element on a surface of a substrate, dispensing an underfill
material upon the surface of the substrate within a dispense region
for forming an underfill for the electronic element, the underfill
material to comprise a non-visible light (NVL)-curable material,
and projecting curing rays upon at least a portion of the dispensed
underfill material to inhibit an outward flow of dispensed
underfill material from the dispense region.
[0095] Example 2 is the method of Example 1, the curing rays to
comprise ultraviolet (UV) light.
[0096] Example 3 is the method of Example 1, the curing rays to
comprise infrared (IR) light.
[0097] Example 4 is the method of any of Examples 1 to 3,
comprising conveying a dispense assembly along a dispense path to
dispense the underfill material within the dispense region.
[0098] Example 5 is the method of Example 4, the dispense assembly
to comprise a light source, the light source to project a curing
beam upon dispensed underfill material as the dispense assembly
traverses the dispense path.
[0099] Example 6 is the method of any of Examples 1 to 3,
comprising projecting a curing frame upon a curing region
surrounding the dispense region.
[0100] Example 7 is the method of any of Examples 1 to 6, the
electronic element to comprise a semiconductor die.
[0101] Example 8 is the method of Example 7, the semiconductor die
to comprise one or more integrated circuits (ICs).
[0102] Example 9 is the method of Example 8, the one or more ICs to
comprise processing circuitry.
[0103] Example 10 is the method of any of Examples 8 to 9, the one
or more ICs to comprise radio frequency (RF) transceiver
circuitry.
[0104] Example 11 is the method of any of Examples 1 to 10, the
substrate to comprise a printed circuit board (PCB).
[0105] Example 12 is the method of any of Examples 1 to 11, the
underfill material to comprise an NVL-curable epoxy.
[0106] Example 13 is the method of Example 12, the NVL-curable
epoxy to comprise a cationic ultraviolet (UV)-curable epoxy or a
free radical UV-curable epoxy.
[0107] Example 14 is the method of any of Examples 12 to 13, the
NVL-curable epoxy to comprise a thermally-curable epoxy.
[0108] Example 15 is an apparatus, comprising a dispenser to
dispense an underfill material, the underfill material to comprise
a non-visible light (NVL)-curable material selected for use to form
an underfill for an electronic element mounted on a surface of a
substrate, and a light source coupled to the dispenser, the light
source to emit curing rays for curing underfill material dispensed
by the dispenser.
[0109] Example 16 is the apparatus of Example 15, the curing rays
to comprise ultraviolet (UV) light.
[0110] Example 17 is the apparatus of Example 15, the curing rays
to comprise infrared (IR) light.
[0111] Example 18 is the apparatus of any of Examples 15 to 17, the
electronic element to comprise a semiconductor die.
[0112] Example 19 is the apparatus of Example 18, the semiconductor
die to comprise one or more integrated circuits (ICs).
[0113] Example 20 is the apparatus of Example 19, the one or more
ICs to comprise processing circuitry.
[0114] Example 21 is the apparatus of any of Examples 19 to 20, the
one or more ICs to comprise radio frequency (RF) transceiver
circuitry.
[0115] Example 22 is the apparatus of any of Examples 15 to 21, the
substrate to comprise a printed circuit board (PCB).
[0116] Example 23 is the apparatus of any of Examples 15 to 22, the
underfill material to comprise an NVL-curable epoxy.
[0117] Example 24 is the apparatus of Example 23, the NVL-curable
epoxy to comprise a cationic ultraviolet (UV)-curable epoxy or a
free radical UV-curable epoxy.
[0118] Example 25 is the apparatus of any of Examples 23 to 24, the
NVL-curable epoxy to comprise a thermally-curable epoxy.
[0119] Example 26 is a method, comprising depositing a stencil
material to form an underfilling stencil for an electronic element
mounted on a surface of a substrate, dispensing an underfill
material through one or more openings of the underfilling stencil
to form an underfill for the electronic element, the underfill
material to comprise a non-visible light (NVL)-curable material,
and projecting curing rays to cure at least a portion of the
dispensed underfill material.
[0120] Example 27 is the method of Example 26, the curing rays to
comprise ultraviolet (UV) light.
[0121] Example 28 is the method of Example 26, the curing rays to
comprise infrared (IR) light.
[0122] Example 29 is the method of any of Examples 26 to 28, at
least a portion of the curing rays to at least partially permeate
the underfilling stencil.
[0123] Example 30 is the method of any of Examples 26 to 29, the
electronic element to comprise a semiconductor die.
[0124] Example 31 is the method of Example 30, the semiconductor
die to comprise one or more integrated circuits (ICs).
[0125] Example 32 is the method of Example 31, the one or more ICs
to comprise processing circuitry.
[0126] Example 33 is the method of any of Examples 31 to 32, the
one or more ICs to comprise radio frequency (RF) transceiver
circuitry.
[0127] Example 34 is the method of any of Examples 26 to 33, the
substrate to comprise a printed circuit board (PCB).
[0128] Example 35 is the method of any of Examples 26 to 34, the
underfill material to comprise an NVL-curable epoxy.
[0129] Example 36 is the method of Example 35, the NVL-curable
epoxy to comprise a cationic ultraviolet (UV)-curable epoxy or a
free radical UV-curable epoxy.
[0130] Example 37 is the method of any of Examples 35 to 36, the
NVL-curable epoxy to comprise a thermally-curable epoxy.
[0131] Example 38 is at least one non-transitory computer-readable
storage medium, comprising a set of instructions that, in response
to being executed by processing circuitry of an electronic device
fabrication system, cause the electronic device fabrication system
to mount an electronic element on a surface of a substrate,
dispense an underfill material upon the surface of the substrate
within a dispense region for forming an underfill for the
electronic element, the underfill material to comprise a
non-visible light (NVL)-curable material, and project curing rays
upon at least a portion of the dispensed underfill material to
inhibit an outward flow of dispensed underfill material from the
dispense region.
[0132] Example 39 is the at least one non-transitory
computer-readable storage medium of Example 38, the curing rays to
comprise ultraviolet (UV) light.
[0133] Example 40 is the at least one non-transitory
computer-readable storage medium of Example 38, the curing rays to
comprise infrared (IR) light.
[0134] Example 41 is the at least one non-transitory
computer-readable storage medium of any of Examples 38 to 40,
comprising instructions that, in response to being executed by
processing circuitry of the electronic device fabrication system,
cause the electronic device fabrication system to convey a dispense
assembly along a dispense path to dispense the underfill material
within the dispense region.
[0135] Example 42 is the at least one non-transitory
computer-readable storage medium of Example 41, the dispense
assembly to comprise a light source, the light source to project a
curing beam upon dispensed underfill material as the dispense
assembly traverses the dispense path.
[0136] Example 43 is the at least one non-transitory
computer-readable storage medium of any of Examples 38 to 40,
comprising instructions that, in response to being executed by
processing circuitry of the electronic device fabrication system,
cause the electronic device fabrication system to project a curing
frame upon a curing region surrounding the dispense region.
[0137] Example 44 is the at least one non-transitory
computer-readable storage medium of any of Examples 38 to 43, the
electronic element to comprise a semiconductor die.
[0138] Example 45 is the at least one non-transitory
computer-readable storage medium of Example 44, the semiconductor
die to comprise one or more integrated circuits (ICs).
[0139] Example 46 is the at least one non-transitory
computer-readable storage medium of Example 45, the one or more ICs
to comprise processing circuitry.
[0140] Example 47 is the at least one non-transitory
computer-readable storage medium of any of Examples 45 to 46, the
one or more ICs to comprise radio frequency (RF) transceiver
circuitry.
[0141] Example 48 is the at least one non-transitory
computer-readable storage medium of any of Examples 38 to 47, the
substrate to comprise a printed circuit board (PCB).
[0142] Example 49 is the at least one non-transitory
computer-readable storage medium of any of Examples 1 to 48, the
underfill material to comprise an NVL-curable epoxy.
[0143] Example 50 is the at least one non-transitory
computer-readable storage medium of Example 49, the NVL-curable
epoxy to comprise a cationic ultraviolet (UV)-curable epoxy or a
free radical UV-curable epoxy.
[0144] Example 51 is the at least one non-transitory
computer-readable storage medium of any of Examples 49 to 50, the
NVL-curable epoxy to comprise a thermally-curable epoxy.
[0145] Example 52 is a dispense assembly, comprising means for
dispensing an underfill material, the underfill material to
comprise a non-visible light (NVL)-curable material selected for
use to form an underfill for an electronic element mounted on a
surface of a substrate, and means for emitting curing rays for
curing dispensed underfill material.
[0146] Example 53 is the dispense assembly of Example 52, the
curing rays to comprise ultraviolet (UV) light.
[0147] Example 54 is the dispense assembly of Example 52, the
curing rays to comprise infrared (IR) light.
[0148] Example 55 is the dispense assembly of any of Examples 52 to
54, the electronic element to comprise a semiconductor die.
[0149] Example 56 is the dispense assembly of Example 55, the
semiconductor die to comprise one or more integrated circuits
(ICs).
[0150] Example 57 is the dispense assembly of Example 56, the one
or more ICs to comprise processing circuitry.
[0151] Example 58 is the dispense assembly of any of Examples 56 to
57, the one or more ICs to comprise radio frequency (RF)
transceiver circuitry.
[0152] Example 59 is the dispense assembly of any of Examples 52 to
58, the substrate to comprise a printed circuit board (PCB).
[0153] Example 60 is the dispense assembly of any of Examples 52 to
59, the underfill material to comprise an NVL-curable epoxy.
[0154] Example 61 is the dispense assembly of Example 60, the
NVL-curable epoxy to comprise a cationic ultraviolet (UV)-curable
epoxy or a free radical UV-curable epoxy.
[0155] Example 62 is the dispense assembly of any of Examples 60 to
61, the NVL-curable epoxy to comprise a thermally-curable
epoxy.
[0156] Example 63 is at least one non-transitory computer-readable
storage medium, comprising a set of instructions that, in response
to being executed by processing circuitry of an electronic device
fabrication system, cause the electronic device fabrication system
to deposit a stencil material to form an underfilling stencil for
an electronic element mounted on a surface of a substrate, dispense
an underfill material through one or more openings of the
underfilling stencil to form an underfill for the electronic
element, the underfill material to comprise a non-visible light
(NVL)-curable material, and project curing rays to cure at least a
portion of the dispensed underfill material.
[0157] Example 64 is the at least one non-transitory
computer-readable storage medium of Example 63, the curing rays to
comprise ultraviolet (UV) light.
[0158] Example 65 is the at least one non-transitory
computer-readable storage medium of Example 63, the curing rays to
comprise infrared (IR) light.
[0159] Example 66 is the at least one non-transitory
computer-readable storage medium of any of Examples 63 to 65, at
least a portion of the curing rays to at least partially permeate
the underfilling stencil.
[0160] Example 67 is the at least one non-transitory
computer-readable storage medium of any of Examples 63 to 66, the
electronic element to comprise a semiconductor die.
[0161] Example 68 is the at least one non-transitory
computer-readable storage medium of Example 67, the semiconductor
die to comprise one or more integrated circuits (ICs).
[0162] Example 69 is the at least one non-transitory
computer-readable storage medium of Example 68, the one or more ICs
to comprise processing circuitry.
[0163] Example 70 is the at least one non-transitory
computer-readable storage medium of any of Examples 68 to 69, the
one or more ICs to comprise radio frequency (RF) transceiver
circuitry.
[0164] Example 71 is the at least one non-transitory
computer-readable storage medium of any of Examples 63 to 70, the
substrate to comprise a printed circuit board (PCB).
[0165] Example 72 is the at least one non-transitory
computer-readable storage medium of any of Examples 63 to 71, the
underfill material to comprise an NVL-curable epoxy.
[0166] Example 73 is the at least one non-transitory
computer-readable storage medium of Example 72, the NVL-curable
epoxy to comprise a cationic ultraviolet (UV)-curable epoxy or a
free radical UV-curable epoxy.
[0167] Example 74 is the at least one non-transitory
computer-readable storage medium of any of Examples 72 to 73, the
NVL-curable epoxy to comprise a thermally-curable epoxy.
[0168] Numerous specific details have been set forth herein to
provide a thorough understanding of the embodiments. It will be
understood by those skilled in the art, however, that the
embodiments may be practiced without these specific details. In
other instances, well-known operations, components, and circuits
have not been described in detail so as not to obscure the
embodiments. It can be appreciated that the specific structural and
functional details disclosed herein may be representative and do
not necessarily limit the scope of the embodiments.
[0169] Some embodiments may be described using the expression
"coupled" and "connected" along with their derivatives. These terms
are not intended as synonyms for each other. For example, some
embodiments may be described using the terms "connected" and/or
"coupled" to indicate that two or more elements are in direct
physical or electrical contact with each other. The term "coupled,"
however, may also mean that two or more elements are not in direct
contact with each other, but yet still co-operate or interact with
each other.
[0170] Unless specifically stated otherwise, it may be appreciated
that terms such as "processing," "computing," "calculating,"
"determining," or the like, refer to the action and/or processes of
a computer or computing system, or similar electronic computing
device, that manipulates and/or transforms data represented as
physical quantities (e.g., electronic) within the computing
system's registers and/or memories into other data similarly
represented as physical quantities within the computing system's
memories, registers or other such information storage, transmission
or display devices. The embodiments are not limited in this
context.
[0171] It should be noted that the methods described herein do not
have to be executed in the order described, or in any particular
order. Moreover, various activities described with respect to the
methods identified herein can be executed in serial or parallel
fashion.
[0172] Although specific embodiments have been illustrated and
described herein, it should be appreciated that any arrangement
calculated to achieve the same purpose may be substituted for the
specific embodiments shown. This disclosure is intended to cover
any and all adaptations or variations of various embodiments. It is
to be understood that the above description has been made in an
illustrative fashion, and not a restrictive one. Combinations of
the above embodiments, and other embodiments not specifically
described herein will be apparent to those of skill in the art upon
reviewing the above description. Thus, the scope of various
embodiments includes any other applications in which the above
compositions, structures, and methods are used.
[0173] It is emphasized that the Abstract of the Disclosure is
provided to comply with 37 C.F.R. .sctn.1.72(b), requiring an
abstract that will allow the reader to quickly ascertain the nature
of the technical disclosure. It is submitted with the understanding
that it will not be used to interpret or limit the scope or meaning
of the claims. In addition, in the foregoing Detailed Description,
it can be seen that various features are grouped together in a
single embodiment for the purpose of streamlining the disclosure.
This method of disclosure is not to be interpreted as reflecting an
intention that the claimed embodiments require more features than
are expressly recited in each claim. Rather, as the following
claims reflect, inventive subject matter lies in less than all
features of a single disclosed embodiment. Thus the following
claims are hereby incorporated into the Detailed Description, with
each claim standing on its own as a separate preferred embodiment.
In the appended claims, the terms "including" and "in which" are
used as the plain-English equivalents of the respective terms
"comprising" and "wherein," respectively. Moreover, the terms
"first," "second," and "third," etc. are used merely as labels, and
are not intended to impose numerical requirements on their
objects.
[0174] Although the subject matter has been described in language
specific to structural features and/or methodological acts, it is
to be understood that the subject matter defined in the appended
claims is not necessarily limited to the specific features or acts
described above. Rather, the specific features and acts described
above are disclosed as example forms of implementing the
claims.
* * * * *