| Patent | Date |
|---|
Modular System For Internet Of Things
App 20210307189 - Lucero; Chris D. ; et al. | 2021-09-30 |
Stretching retention plate for electronic assemblies
Grant 10,825,714 - Chavez-Clemente , et al. November 3, 2 | 2020-11-03 |
Flexible packaging for a wearable electronic device
Grant 10,820,437 - Aleksov , et al. October 27, 2 | 2020-10-27 |
Ultra Small Molded Module Integrated With Die By Module-on-wafer Assembly
App 20200286834 - YOSHIHIRO; Tomita ; et al. | 2020-09-10 |
Ultra small molded module integrated with die by module-on-wafer assembly
Grant 10,707,171 - Yoshihiro , et al. | 2020-07-07 |
Electronic device package with recessed substrate for underfill containment
Grant 10,672,625 - Chan Arguedas , et al. | 2020-06-02 |
Through-mold structures
Grant 10,636,716 - Oster , et al. | 2020-04-28 |
Systems and methods for electromagnetic interference shielding
Grant 10,615,128 - Dias , et al. | 2020-04-07 |
Complex cavity formation in molded packaging structures
Grant 10,446,461 - Oster , et al. Oc | 2019-10-15 |
Flexible Packaging For A Wearable Electronic Device
App 20190281717 - Aleksov; Aleksandar ; et al. | 2019-09-12 |
Electronic Device Package
App 20190074199 - Chan Arguedas; Sergio A. ; et al. | 2019-03-07 |
Socket contact techniques and configurations
Grant 10,205,292 - Athreya , et al. Feb | 2019-02-12 |
Magnetic Particle Embedded Flex Or Printed Flex For Magnetic Tray Or Electro-magnetic Carrier
App 20180376591 - TOMITA; Yoshihiro ; et al. | 2018-12-27 |
Ultra Small Molded Module Integrated With Die By Module-on-wafer Assembly
App 20180337135 - YOSHIHIRO; Tomita ; et al. | 2018-11-22 |
Flexible substrate retention on a reusable carrier
Grant 10,111,368 - Tomita , et al. October 23, 2 | 2018-10-23 |
Through-mold Structures
App 20180277458 - Oster; Sasha ; et al. | 2018-09-27 |
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier
Grant 10,070,520 - Tomita , et al. September 4, 2 | 2018-09-04 |
Surface-mount inductor structures for forming one or more inductors with substrate traces
Grant 10,056,182 - Murtagian , et al. August 21, 2 | 2018-08-21 |
Systems And Methods For Electromagnetic Interference Shielding
App 20180226358 - Dias; Rajendra C. ; et al. | 2018-08-09 |
Semiconductor Package With Electromagnetic Interference Shielding Structures
App 20180166363 - Heppner; Joshua D. ; et al. | 2018-06-14 |
Ball grid array (BGA) with anchoring pins
Grant 9,953,909 - Liang , et al. April 24, 2 | 2018-04-24 |
Systems and methods for electromagnetic interference shielding
Grant 9,953,929 - Dias , et al. April 24, 2 | 2018-04-24 |
Complex Cavity Formation In Molded Packaging Structures
App 20180096862 - Oster; Sasha N. ; et al. | 2018-04-05 |
Space-efficient Underfilling Techniques For Electronic Assemblies
App 20180061673 - HEPPNER; JOSHUA D. ; et al. | 2018-03-01 |
Socket Contact Techniques And Configurations
App 20180019558 - Athreya; Dhanya ; et al. | 2018-01-18 |
Ball Grid Array (bga) With Anchoring Pins
App 20180019193 - Liang; Zuyang ; et al. | 2018-01-18 |
Complex cavity formation in molded packaging structures
Grant 9,824,901 - Oster , et al. November 21, 2 | 2017-11-21 |
Electronic package that includes finned vias
Grant 9,795,026 - Mahanta , et al. October 17, 2 | 2017-10-17 |
Integrated Circuit Package Having Integrated Emi Shield
App 20170287847 - Dias; Rajendra C. ; et al. | 2017-10-05 |
Complex Cavity Formation In Molded Packaging Structures
App 20170287736 - Oster; Sasha ; et al. | 2017-10-05 |
Stretching Retention Plate For Electronic Assemblies
App 20170287771 - CHAVEZ-CLEMENTE; DANIEL ; et al. | 2017-10-05 |
Socket contact techniques and configurations
Grant 9,780,510 - Athreya , et al. October 3, 2 | 2017-10-03 |
Modular Squeegee Head Apparatus For Printing Materials
App 20170266948 - Heppner; Joshua D. ; et al. | 2017-09-21 |
Systems And Methods For Eloectromagnetic Interference Shielding
App 20170271270 - Dias; Rajendra C. ; et al. | 2017-09-21 |
Perforated Conductive Material For Emi Shielding Of Semiconductor Device And Components
App 20170250145 - Dias; Rajendra C. ; et al. | 2017-08-31 |
Space-efficient underfilling techniques for electronic assemblies
Grant 9,728,425 - Heppner , et al. August 8, 2 | 2017-08-08 |
Perforated conductive material for EMI shielding of semiconductor device and components
Grant 9,704,811 - Dias , et al. July 11, 2 | 2017-07-11 |
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier
App 20170188455 - Tomita; Yoshihiro ; et al. | 2017-06-29 |
Through-mold Structures
App 20170178990 - Oster; Sasha ; et al. | 2017-06-22 |
Perforated Conductive Material For Emi Shielding Of Semiconductor Device And Components
App 20170179040 - Dias; Rajendra C. ; et al. | 2017-06-22 |
Flexible Substrate Retention On A Reusable Carrier
App 20170181338 - TOMITA; YOSHIHIRO ; et al. | 2017-06-22 |
Semiconductor Package With Trenched Molding-based Electromagnetic Interference Shielding
App 20170179041 - Dias; Rajendra C. ; et al. | 2017-06-22 |
Universal Pick And Place Head For Handling Components Of Any Shape
App 20170166407 - Singh; Kumar Abhishek ; et al. | 2017-06-15 |
Electronic Package That Includes Finned Vias
App 20170171957 - Mahanta; Nayandeep K. ; et al. | 2017-06-15 |
Integrated circuit and method that utilize a shape memory material
Grant 9,635,764 - Qiu , et al. April 25, 2 | 2017-04-25 |
Techniques and configurations associated with a package load assembly
Grant 9,615,483 - Chawla , et al. April 4, 2 | 2017-04-04 |
Integrated Circuit And Method That Utilize A Shape Memory Material
App 20170094799 - Qiu; Shipeng ; et al. | 2017-03-30 |
Electronic assembly that includes a plurality of electronic packages
Grant 9,603,276 - Llapitan , et al. March 21, 2 | 2017-03-21 |
Vertical socket contact with flat force response
Grant 9,601,848 - Heppner , et al. March 21, 2 | 2017-03-21 |
Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate
Grant 9,491,881 - Heppner , et al. November 8, 2 | 2016-11-08 |
Socket Contact Techniques And Configurations
App 20160254629 - Athreya; Dhanya ; et al. | 2016-09-01 |
Lateral slide pick and place cover for reduced bent pins in LGA sockets
Grant 9,385,444 - Krithivasan , et al. July 5, 2 | 2016-07-05 |
Connector assembly and method
Grant 9,385,457 - Chawla , et al. July 5, 2 | 2016-07-05 |
Socket That Engages A Plurality Of Electronic Packages
App 20160190716 - Liu; Kuang ; et al. | 2016-06-30 |
Electronic Assembly That Includes A Plurality Of Electronic Packages
App 20160190717 - Llapitan; David J. ; et al. | 2016-06-30 |
Electronic assemblies with scalable clip-type connectors
Grant 9,325,087 - Chawla , et al. April 26, 2 | 2016-04-26 |
Techniques And Configurations Associated With A Package Load Assembly
App 20160079150 - Chawla; Gaurav ; et al. | 2016-03-17 |
Integrated circuit connectors
Grant 9,265,170 - Swaminathan , et al. February 16, 2 | 2016-02-16 |
Vertical Socket Contact With Flat Force Response
App 20160043488 - Heppner; Joshua D ; et al. | 2016-02-11 |
Shielded Sockets For Microprocessors And Fabrication Thereof By Overmolding And Plating
App 20160028203 - Heppner; Joshua D. ; et al. | 2016-01-28 |
Shielded sockets for microprocessors and fabrication thereof by overmolding and plating
Grant 9,178,328 - Heppner , et al. November 3, 2 | 2015-11-03 |
Vertical socket contact with flat force response
Grant 9,172,160 - Heppner , et al. October 27, 2 | 2015-10-27 |
Electronic Assemblies With Scalable Clip-type Connectors
App 20150280337 - Chawla; Gaurav ; et al. | 2015-10-01 |
Connector Assembly And Method
App 20150249298 - Chawla; Gaurav ; et al. | 2015-09-03 |
Two Piece Shielded Socket
App 20150214665 - Heppner; Joshua D. ; et al. | 2015-07-30 |
Lateral Slide Pick And Place Cover For Reduced Bent Pins In Lga Sockets
App 20150171527 - Krithivasan; Vijaykumar ; et al. | 2015-06-18 |
Chip Socket Including A Circular Contact Pattern
App 20150162719 - Chawla; Gaurav ; et al. | 2015-06-11 |
Surface-mount Inductor Structures For Forming One Or More Inductors With Substrate Traces
App 20150155092 - Murtagian; Gregorio R. ; et al. | 2015-06-04 |
Integrated Circuit Connectors
App 20150118870 - Swaminathan; Rajasekaran ; et al. | 2015-04-30 |
Connector assembly and methods with integrated pitch translation
Grant 9,017,106 - Heppner , et al. April 28, 2 | 2015-04-28 |
Chip socket including a circular contact pattern
Grant 8,961,193 - Chawla , et al. February 24, 2 | 2015-02-24 |
Shielded Sockets For Microprocessors And Fabrication Thereof By Overmolding And Plating
App 20150004813 - Heppner; Joshua D. ; et al. | 2015-01-01 |
Connector assembly and method
Grant 8,905,794 - Chawla , et al. December 9, 2 | 2014-12-09 |
Vertical Socket Contact With Flat Force Response
App 20140273553 - Heppner; Joshua D. ; et al. | 2014-09-18 |
Connector Assembly And Methods With Integrated Pitch Translation
App 20140273662 - Heppner; Joshua D. ; et al. | 2014-09-18 |
Surface-mount Inductor Structures For Forming One Or More Inductors With Substrate Traces
App 20140167900 - Murtagian; Gregorio R. ; et al. | 2014-06-19 |
Connector Assembly And Method
App 20140162475 - Chawla; Gaurav ; et al. | 2014-06-12 |
Chip Socket Including A Circular Contact Pattern
App 20140162474 - Chawla; Gaurav ; et al. | 2014-06-12 |
Shielded socket housing
Grant 8,025,531 - Zhang , et al. September 27, 2 | 2011-09-27 |
| 