U.S. patent application number 16/118990 was filed with the patent office on 2018-12-27 for magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier.
The applicant listed for this patent is Intel Corporation. Invention is credited to Joshua D. HEPPNER, Shawna M. LIFF, Pramod MALATKAR, Yoshihiro TOMITA.
Application Number | 20180376591 16/118990 |
Document ID | / |
Family ID | 59088107 |
Filed Date | 2018-12-27 |
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United States Patent
Application |
20180376591 |
Kind Code |
A1 |
TOMITA; Yoshihiro ; et
al. |
December 27, 2018 |
MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY
OR ELECTRO-MAGNETIC CARRIER
Abstract
In accordance with disclosed embodiments, there are provided
methods, systems, and apparatuses for implementing a magnetic
particle embedded flexible substrate, a printed flexible substrate
for a magnetic tray, or an electro-magnetic carrier for magnetized
or ferromagnetic flexible substrates. For instance, in accordance
with one embodiment, there are means disclosed for fabricating a
flexible substrate having one or more electrical interconnects to
couple with leads of an electrical device; integrating magnetic
particles or ferromagnetic particles into the flexible substrate;
supporting the flexible substrate with a carrier plate during one
or more manufacturing processes for the flexible substrate, in
which the flexible substrate is held flat against the carrier plate
by an attractive magnetic force between the magnetic particles or
ferromagnetic particles integrated with the flexible substrate and
a complementary magnetic attraction of the carrier plate; and
removing the flexible substrate from the carrier plate subsequent
to completion of the one or more manufacturing processes for the
flexible substrate. Other related embodiments are disclosed.
Inventors: |
TOMITA; Yoshihiro;
(Tsukuba-shi, JP) ; HEPPNER; Joshua D.; (Chandler,
AZ) ; LIFF; Shawna M.; (Scottsdale, AZ) ;
MALATKAR; Pramod; (Chandler, AZ) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Intel Corporation |
Santa Clara |
CA |
US |
|
|
Family ID: |
59088107 |
Appl. No.: |
16/118990 |
Filed: |
August 31, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14998263 |
Dec 26, 2015 |
10070520 |
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16118990 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
A41D 13/0015 20130101;
A43B 1/0054 20130101; H05K 1/189 20130101; H05K 2201/0129 20130101;
H05K 1/0283 20130101; H05K 1/03 20130101; H05K 2201/0215 20130101;
H05K 1/0393 20130101; H05K 2201/0133 20130101; H05K 2203/104
20130101; H05K 2201/0314 20130101; H05K 1/118 20130101; H05K
2201/083 20130101; H05K 3/0011 20130101; A43B 3/0005 20130101; H05K
2203/0152 20130101; A41D 1/002 20130101; H05K 3/007 20130101; H05K
2201/0203 20130101; H05K 2201/08 20130101; H05K 3/32 20130101 |
International
Class: |
H05K 1/03 20060101
H05K001/03; H05K 3/00 20060101 H05K003/00; A41D 13/00 20060101
A41D013/00; A43B 1/00 20060101 A43B001/00; A43B 3/00 20060101
A43B003/00; H05K 1/11 20060101 H05K001/11; H05K 1/18 20060101
H05K001/18; H05K 3/32 20060101 H05K003/32; A41D 1/00 20180101
A41D001/00 |
Claims
1. An apparatus, comprising: an electrical device affixed to a
substrate; one or more electrical interconnects electrically
coupled with leads of the electrical device; one or more electrical
components electrically coupled with the electrical device via the
one or more electrical interconnects; and particles integrated with
the substrate, the particles comprising a non-magnetic ferrous
material.
2. The apparatus of claim 1, wherein the non-magnetic ferrous
material is FeO.
3. The apparatus of claim 1, wherein the substrate is a flexible
substrate.
4. The apparatus of claim 3, wherein the flexible substrate lacks
sufficient rigidity and biaxial strength to hold its shape within a
horizontal plane when unsupported.
5. The apparatus of claim 1, wherein the particles integrated with
the substrate are painted onto the substrate.
6. The apparatus of claim 1, wherein the particles integrated with
the substrate are printed onto the substrate.
7. The apparatus of claim 1, wherein the particles integrated with
the substrate are coated onto the substrate.
8. The apparatus of claim 1, wherein the particles integrated with
the substrate are mixed and cured within the substrate.
9. The apparatus of claim 1, wherein the apparatus is embodied
within one of: a clothing item; sports attire; a shoe; fashion
electronics to be worn as a clothing item or an accessory; tech
togs to be worn as a clothing item or an accessory; fashionable
technology to be worn as a clothing item or an accessory; or a
flexible wearable technology to be worn as a clothing item or an
accessory.
10. A flexible substrate comprising: an electrical device affixed
to the flexible substrate; one or more electrical interconnects
electrically coupled with leads of the electrical device; one or
more electrical components electrically coupled with the electrical
device via the one or more electrical interconnects; wherein the
flexible substrate lacks sufficient rigidity and biaxial strength
to hold its shape within a horizontal plane when unsupported; and
magnetic particles or ferromagnetic particles integrated with the
flexible substrate.
11. The flexible substrate of claim 10, the flexible substrate
having undergone one or more manufacturing processes while held
flat against a carrier plate by an attractive magnetic force
between the magnetic particles or ferromagnetic particles
integrated with the flexible substrate and a complementary magnetic
attraction of the carrier plate, wherein the carrier plate
supported the flexible substrate during one or more manufacturing
processes for the flexible substrate.
12. The flexible substrate of claim 10, wherein the magnetic
particles or ferromagnetic particles integrated with the flexible
substrate are: painted onto the flexible substrate; printed onto
the flexible substrate; coated onto the flexible substrate; or
mixed and cured within the flexible substrate.
13. The flexible substrate of claim 10, wherein the flexible
substrate is embodied within one of: a clothing item; sports
attire; a shoe; fashion electronics to be worn as a clothing item
or an accessory; tech togs to be worn as a clothing item or an
accessory; fashionable technology to be worn as a clothing item or
an accessory; or a flexible wearable technology to be worn as a
clothing item or an accessory.
14. A wearable technology to be worn as a clothing item or an
accessory, the wearable technology comprising: an electrical device
affixed to a flexible substrate; one or more electrical
interconnects within the flexible substrate electrically coupled
with leads of the electrical device; one or more electrical
components affixed to the flexible substrate and electrically
coupled with the electrical device via the one or more electrical
interconnects; wherein the flexible substrate lacks sufficient
rigidity and biaxial strength to hold its shape within a horizontal
plane when unsupported; and magnetic particles or ferromagnetic
particles integrated with the flexible substrate.
15. The wearable technology of claim 14, the flexible substrate
having undergone one or more manufacturing processes while held
flat against a carrier plate by an attractive magnetic force
between the magnetic particles or ferromagnetic particles
integrated with the flexible substrate and a complementary magnetic
attraction of the carrier plate, wherein the carrier plate
supported the flexible substrate during one or more manufacturing
processes for the flexible substrate.
16. The wearable technology of claim 14, further comprising: a
magnetic coupler, clasp, or latch held closed through attractive
magnetic forces between the magnetic coupler, clasp, or latch and
the flexible substrate having magnetic filler particles integrated
therewith during a process of manufacture of the flexible
substrate.
17. The wearable technology of claim 14, wherein the wearable
technology is embodied within one of: a clothing item; sports
attire; a shoe; fashion electronics to be worn as a clothing item
or an accessory; tech togs to be worn as a clothing item or an
accessory; fashionable technology to be worn as a clothing item or
an accessory; or a flexible wearable technology to be worn as a
clothing item or an accessory.
Description
COPYRIGHT NOTICE
[0001] A portion of the disclosure of this patent document contains
material which is subject to copyright protection. The copyright
owner has no objection to the facsimile reproduction by anyone of
the patent document or the patent disclosure, as it appears in the
Patent and Trademark Office patent file or records, but otherwise
reserves all copyright rights whatsoever.
TECHNICAL FIELD
[0002] The subject matter described herein relates generally to the
field of semiconductor and electronics manufacturing, and more
particularly, systems, methods, and apparatuses for implementing a
magnetic particle embedded flexible substrate, a printed flexible
substrate for a magnetic tray, or an electro-magnetic carrier for
magnetized or ferromagnetic flexible substrates.
BACKGROUND
[0003] The subject matter discussed in the background section
should not be assumed to be prior art merely as a result of its
mention in the background section. Similarly, a problem mentioned
in the background section or associated with the subject matter of
the background section should not be assumed to have been
previously recognized in the prior art. The subject matter in the
background section merely represents different approaches, which in
and of themselves may also correspond to embodiments of the claimed
subject matter.
[0004] As modern electronics advance a variety of new use cases and
implementations are entering the marketplace including the use of
flexible (and sometimes stretchable) electronics for clothing and
other wearable devices. This presents a serious problem for
manufacturers of such electronics devices, clothing, and so called
"wearables" given the simple fact that advanced electronics
historically have been made to be ridged. "Wearables," "wearable
technology," "fashionable technology," "wearable devices," "tech
togs," and "fashion electronics" are all in reference to a class of
clothing, garments, and accessories which incorporate computer and
advanced electronics technologies into "wearable" pieces, be they
clothing or otherwise. Wearable devices such as activity trackers
represent a part of the "Internet of Things" or "IoT" as they form
part of the network of physical objects or "things" embedded with
electronics, software, sensors and connectivity to enable objects
to exchange data with a manufacturer, operator and/or other
connected devices, without requiring human intervention.
[0005] While such wearables commonly have an aesthetic aspect to
them, we discuss the functional and technological aspects of
wearables herein and more particularly discuss issues pertaining to
semiconductor and electronics manufacturing of such wearables.
[0006] Fundamentally, as manufacturers of such wearables having
these flexible and stretchable substrates embodied therein seek to
scale up production processes and lower the cost of manufacturing,
there are needed new manufacturing processes for the handling and
processing of such flexible and stretchable substrates, just as
conventional approaches were developed in years past for the
handling and processing of conventional rigid (e.g., inflexible)
electronics substrates.
[0007] Unfortunately, such conventional approaches are not
satisfactory for the handling of flexible and stretchable
substrates due to the fragile nature of the materials. For
instance, a variety of problems arise when attempting to utilize
conventional manufacturing techniques developed for non-flexible
substrates with flexible substrates, including the flexible
substrates failing to maintain their shape on a carrier, the
flexible substrates ripping or tearing, the flexible substrates
being blown off of their carrier plates due to even small air
currents or drafts, and so forth. Clips, clamps, and mechanical
presses used with conventional inflexible substrates have been
observed to be especially prone to damaging the soft and fragile
materials used in such flexible substrates.
[0008] The present state of the art may therefore benefit from the
means for implementing a magnetic particle embedded flexible
substrate, a printed flexible substrate for a magnetic tray, or an
electro-magnetic carrier for magnetized or ferromagnetic flexible
substrates as is described herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Embodiments are illustrated by way of example, and not by
way of limitation, and will be more fully understood with reference
to the following detailed description when considered in connection
with the figures in which:
[0010] FIG. 1 depicts exemplary wearables in accordance with which
embodiments may operate;
[0011] FIG. 2A depicts exemplary embedded magnetic particle
substrate in accordance with described embodiments;
[0012] FIG. 2B depicts an exemplary flexible substrate in
accordance with described embodiments;
[0013] FIG. 2C depicts an exemplary flexible interconnect substrate
in accordance with described embodiments;
[0014] FIG. 3A depicts exemplary carrier plates in accordance with
described embodiments;
[0015] FIG. 3B depicts alternative exemplary carrier plates in
accordance with described embodiments;
[0016] FIG. 4A depicts a flexible substrate and a magnetic carrier
plate in accordance with described embodiments;
[0017] FIG. 4B depicts another flexible substrate and a magnetic
carrier plate in accordance with described embodiments;
[0018] FIG. 4C depicts a flexible substrate and an electromagnetic
carrier plate in accordance with described embodiments;
[0019] FIG. 5 is a flow diagram illustrating a method for
implementing a magnetic particle embedded flexible substrate, a
printed flexible substrate for a magnetic tray, or an
electro-magnetic carrier for magnetized or ferromagnetic flexible
substrates in accordance with described embodiments; and
[0020] FIG. 6 is a schematic of a computer system, in accordance
with an embodiment of the present invention.
DETAILED DESCRIPTION
[0021] Described herein are systems, apparatuses, and methods for
implementing a magnetic particle embedded flexible substrate, a
printed flexible substrate for a magnetic tray, or an
electro-magnetic carrier for magnetized or ferromagnetic flexible
substrates. For instance, in accordance with one embodiment, there
are means disclosed for fabricating a flexible substrate having one
or more electrical interconnects to couple with leads of an
electrical device; integrating magnetic particles or ferromagnetic
particles into the flexible substrate; supporting the flexible
substrate with a carrier plate during one or more manufacturing
processes for the flexible substrate, in which the flexible
substrate is held flat against the carrier plate by an attractive
magnetic force between the magnetic particles or ferromagnetic
particles integrated with the flexible substrate and a
complementary magnetic attraction of the carrier plate; and
removing the flexible substrate from the carrier plate subsequent
to completion of the one or more manufacturing processes for the
flexible substrate.
[0022] Flexible electronics, also known as flex circuits represent
an area of technology for assembling electronic circuits by
mounting electronic devices on flexible plastic substrates, as well
as related flexible and stretchable electronics which serve the
same function but permit some elasticity as well. Such flexible and
flexible-stretchable electronics utilize substrate materials
including, for example, a stretchable dielectric material (e.g., a
stretchable material which acts as an electrical insulator and can
be polarized by an applied electric field), a compliant (e.g.,
bendable, flexible) dielectric material, a stretchable and bendable
dielectric material, etc. For instance, such materials may be
formed from polyimide substrates, PEEK substrates (e.g., PolyEther
Ether Ketone, a colorless organic thermoplastic polymer), PDMS
substrates (e.g., PolyDiMethylSiloxane and also called dimethicone,
one of a group of polymeric organosilicon compounds), silicon-based
organic polymer substrates, transparent conductive polyester films
and substrates, stretchable polydimethylsiloxane (PDMS) substrates,
stretchable Polyisoprene substrates, stretchable polybutadiene
substrates, stretchable polyisobutylene substrates, stretchable
polyurethanes substrates, stretchable thermoplasticpolyurethanes
substrates, stretchable butyl rubber substrates, stretchable
nitrile rubber substrates, stretchable woven fabric substrates, and
screen printed silver circuits on polyester substrate
materials.
[0023] Such flexible electronic assemblies may be manufactured
using identical components used for rigid printed circuit boards,
allowing the board to conform to a desired shape, or to flex during
its use, however, the underlying substrate has unique properties
(such as thinness, flexibility, stretchability) which are
beneficial to the wearables field of technologies but for which the
conventional manufacturing processes are no longer satisfactory or
even feasible in certain instances.
[0024] Certain Flexible Printed Circuits (FPCs) are made with a
photolithographic technology or embodied within flexible foil
circuits or Flexible Flat Cables (FFCs) by laminating very thin
(e.g., 0.07 mm) copper strips between two layers of Polyethylene
terephthalate (PET, PETE) which are then coated with thermosetting
adhesive activated and cured during lamination.
[0025] In the following description, numerous specific details are
set forth such as examples of specific systems, languages,
components, etc., in order to provide a thorough understanding of
the various embodiments. It will be apparent, however, to one
skilled in the art that these specific details need not be employed
to practice the embodiments disclosed herein. In other instances,
well known materials or methods have not been described in detail
in order to avoid unnecessarily obscuring the disclosed
embodiments.
[0026] In addition to various hardware components depicted in the
figures and described herein, embodiments further include various
operations which are described below. The operations described in
accordance with such embodiments may be performed by hardware
components or may be embodied in machine-executable instructions,
which may be used to cause a general-purpose or special-purpose
processor programmed with the instructions to perform the
operations. Alternatively, the operations may be performed by a
combination of hardware and software.
[0027] Any of the disclosed embodiments may be used alone or
together with one another in any combination. Although various
embodiments may have been partially motivated by deficiencies with
conventional techniques and approaches, some of which are described
or alluded to within the specification, the embodiments need not
necessarily address or solve any of these deficiencies, but rather,
may address only some of the deficiencies, address none of the
deficiencies, or be directed toward different deficiencies and
problems which are not directly discussed.
[0028] FIG. 1 depicts exemplary wearables 100 in accordance with
which embodiments may operate. More particularly, there are
depicted wearables 100, each of which has embodied therein a
flexible substrate. The wearable 100 on the left has embedded
therein a magnetic particle substrate 101 and the wearable on the
right has embedded therein a printed flexible substrate 102 such as
that which will self-attract to a magnetic tray or an electro
magnetic carrier through electromagnetic attraction in accordance
with the embodiments as set forth herein.
[0029] Such flexible electronics provide tightly assembled
electronic packages for both static electronics but which require
electrical connections in 3 axes, thus making the flexibility of
the electronics advantageous for both manufacturing and assembly of
such products, as well as dynamic electronics applications such
movable electronics for which the electronics and electrical
connections are required to flex and/or stretch during manufacture,
assembly, as well as during their intended use by consumers.
[0030] In a related embodiment there is a wearable technology to be
worn as a clothing item or an accessory, in which the wearable
technology includes at least an integrated circuit on a flexible
substrate, a stretchable substrate, or a flexible and stretchable
substrate.
[0031] In accordance with such an embodiment, the wearable
technology is embodied within one of: a clothing item; sports
attire; a shoe; fashion electronics to be worn as a clothing item
or an accessory; tech togs to be worn as a clothing item or an
accessory; fashionable technology to be worn as a clothing item or
an accessory; or a flexible wearable technology to be worn as a
clothing item or an accessory.
[0032] FIG. 2A depicts exemplary embedded magnetic particle
substrate 201 in accordance with described embodiments. In
particular, there is the depicted an embedded magnetic particle
substrate 201 having thereupon or integrated therein the depicted
circuitry and components 220. Further depicted are the magnetic
particles 210 which are mixed into and cured with the embedded
magnetic particle substrate 201 and thus form part of the embedded
magnetic particle substrate 201 and specifically serve the function
of making the substrate magnetic. Also depicted as an alternative
embodiment are embedded magnets 250 (e.g., embedded magnetic
"buttons" or "tabs") within the embedded magnetic particle
substrate 201. Either the embedded magnetic particles 210 or the
embedded magnets 250, or both, may be utilized in accordance with
the described embodiments.
[0033] FIG. 2B depicts an exemplary flexible substrate 299 in
accordance with described embodiments. In particular, there is
depicted the flexible substrate 299 having embedded therein
magnetic particles 210 as well as electrical traces 265 and circuit
and component contact points 270, each of which provide
interconnectivity through flexible substrate 299 for a variety of
components and circuitry to be integrated into or onto the flexible
substrate 299.
[0034] FIG. 2C depicts an exemplary flexible interconnect substrate
298 in accordance with described embodiments. The flexible
interconnect substrate 298 depicted is both flexible and
stretchable in accordance with such embodiments, having electrical
traces 265 embedded therein which are capable of expanding and
contracting as the elasticity of the flexible interconnect
substrate 298 yields to pulling forces and re-contracts under its
elastic force. Such a material is useful in wearables which are
integrated into clothing, such as sports attire having sensors and
other functional components integrated therein. Further depicted
are the circuit and component contact points 270 as well as
circuitry and components 220 which are interconnected with both the
contact points and also the electrical traces 265 of the flexible
interconnect substrate 298.
[0035] Notably, there is depicted the flexible interconnect
substrate 298 having printed magnetic surface particles 247
printed, coated, or painted thereupon, in accordance with described
embodiments, the printed magnetic surface particles 247 provide the
flexible interconnect substrate 298 with an electromagnetic
attractive force.
[0036] During the manufacturing process for electronics, such as
the magnetic particle substrate 201 which is depicted at FIG. 2A,
the flexible substrate 299 depicted at FIG. 2B, and the flexible
interconnect substrate 298 depicted at FIG. 2C, it is necessary to
utilize handling medias referred to as carriers or carrier plates
or captive carrier plates, etc. These carrier plates are necessary
due to the inherent thinness, flexibility, and fragility of the
flexible substrate materials (e.g., 201, 298, and 299). The
flexible substrates are very thin, similar to paper, and as such,
the material simply does not hold its shape naturally when placed
upon or place within such a carrier.
[0037] While it is desired that the flexible electronics bend
easily during their eventual use in dynamic consumer electronics
and wearables, it is not desirable for them to bend, curl, or
twist, etc., during the actual manufacturing process.
[0038] Conventional manufacturing techniques include clipping or
clamping the materials to a carrier plate, however, these
methodologies tend to rip, tear, or otherwise damage the fragile
substrate materials. Simply allowing the flexible substrates to lie
upon a carrier plate during the manufacturing process is likewise
ineffective because they tend to curl, bend, warp, or even crinkle
when the substrates are subjected to thermal curing processes, or
even blow away when subjected to blown nitrogen and other chemical
blowing agents which are common to such flexible substrate
manufacturing techniques.
[0039] Another approach has been to tape the flexible electronics
to the carrier plate, but this creates additional problems as
adhesive residue remains behind on the flexible substrate which is
problematic and difficult to remove, often requiring additional
chemical processing and therefore increased costs, environmental
hazard, and waste.
[0040] Still further, the carrier plates then have adhesive residue
which similarly requires cleaning and thus adds cost, complexity,
and wasted manufacturing resources. Yet another approach has been
to tape the flexible electronics to a carrier plate using flanges
or handling zones of the flexible electronics which do not form
part of the end product, and then these flanges or handling zones
are cut away, thus negating the need to clean the adhesive residue
from the flexible electronics manufactured. While this has some
benefit, there is the obvious disadvantage of increased
manufacturing processes (e.g., the removal of the flanges) as well
as waste as the flanges and handling zones are simply discarded,
and wholly fails to address the problem of the adhesive residue
which is left upon the carrier plates.
[0041] Certain manufacturing processes require a heating of the
flexible substrate materials (e.g., 201, 298, and 299) which causes
them to expand which causes still further damage to the flexible
substrate materials (e.g., 201, 298, and 299) if they are
mechanically bound to a carrier plate as the expanding and
contracting can induce material warping, tearing, or simply
separation from the mechanical clips, clamps, tape, or whatever
means are being utilized to mechanically bound the flexible
substrate materials (e.g., 201, 298, and 299) to the carrier
plates.
[0042] Therefore, in accordance with the embodiments described
herein, the flexible substrate materials (e.g., 201, 298, and 299)
are made to be held to the carrier plates by way of magnetic
attraction between the carrier plates and the flexible substrate
materials (e.g., 201, 298, and 299). For instance, as is depicted
with regard to each of flexible substrate materials 201, 298, and
299, the magnetic particles may be embedded within the flexible
substrate materials (e.g., 201, 298, and 299) such that they will
hold fast to a carrier plate through their mutual magnetic
attraction. Alternatively, the flexible substrate materials (e.g.,
201, 298, and 299) can have ferrous materials embedded therein such
that they themselves are not magnetic, yet will nevertheless hold
fast to a carrier plate which is magnetic.
[0043] Regardless of whether the flexible substrate materials
(e.g., 201, 298, and 299) are made to be magnetic through magnetic
particles being integrated, printed, coated, or painted thereon, or
the flexible substrate materials (e.g., 201, 298, and 299) having
ferrous materials integrated therein such that they are attracted
to a magnetic force, use of the flexible substrate materials (e.g.,
201, 298, and 299) with carrier plates where the holding means is
through electromagnetic forces greatly improves the
manufacturability of the flexible substrate materials (e.g., 201,
298, and 299) as it is no longer necessary to utilize mechanical
holding means such as clips and clamps which damage the substrates,
nor is it necessary to utilize tapes and adhesives which
contaminate the substrates with adhesive residue and introduce more
costly and complex manufacturing processes. Still further, the
flexible substrate materials (e.g., 201, 298, and 299) are not
inclined to warp, curve, curl, twist, or blow away, because the
substrates are held with sufficient force to the carrier plate and
further because the magnetic attraction between the carrier plate
and the flexible substrate materials (e.g., 201, 298, and 299) can
be made with the attractive force distributed over a large portion
or the entirety of their surface area.
[0044] Because there is no tape or cover plate required for the
manufacture of the flexible substrate materials (e.g., 201, 298,
and 299) as described, it is possible to immediately advance the
flexible substrate materials (e.g., 201, 298, and 299) through the
conventional processes once the flexible substrate materials (e.g.,
201, 298, and 299) are held fast to the carrier plate by magnetic
force. Conversely, tape requires cleaning, clips and clams require
removal, cover plates require another automatic robotic process to
remove the top plate or cover plate, etc. The flexible substrate
materials (e.g., 201, 298, and 299) held to the carrier plate by
way of magnetic attraction, however, can traverse the manufacturing
line as though they were conventional rigid PCB (printed circuit
boards) as the carrier plate supports the flexible substrate
materials (e.g., 201, 298, and 299) the with requisite rigidity
needed by such conventional processes.
[0045] FIG. 3A depicts exemplary carrier plates in accordance with
described embodiments. In particular, there is depicted a
ferromagnetic carrier plate 305 at the top left which is not itself
magnetic, but strongly attracts to any object which is magnetic,
such as the flexible substrate materials (e.g., 201, 298, and 299)
having magnetic particles integrated therein or magnetic particles
printed, painted, or coated thereupon. Depicted at the bottom right
is a carrier plate 310 having been adapted with magnetic strips 311
such that it may receive and hold fast to the flexible substrate
materials (e.g., 201, 298, and 299) with magnetic particles
integrated therein or magnetic particles printed, painted, or
coated thereupon.
[0046] FIG. 3B depicts alternative exemplary carrier plates in
accordance with described embodiments. In particular, there is
depicted a magnetic carrier plate 320 at the top left which is
itself magnetic and will therefore receive and hold fast by
magnetic attraction to the flexible substrate materials (e.g., 201,
298, and 299) with magnetic particles integrated therein or
magnetic particles printed, painted, or coated thereupon or to
flexible substrate materials (e.g., 201, 298, and 299) with ferrous
particles embedded therein or printed, painted, or coated
thereupon. Depicted at the bottom right is an electromagnetic
carrier plate 325 which permits the magnetic force to be "turned
on" when electricity is applied and the electromagnetic carrier
plate 325 will therefore receive and hold fast by magnetic
attraction to the flexible substrate materials (e.g., 201, 298, and
299) with magnetic particles integrated therein or magnetic
particles printed, painted, or coated thereupon or to flexible
substrate materials (e.g., 201, 298, and 299) with ferrous
particles embedded therein or printed, painted, or coated
thereupon. Conveniently, the electromagnetic carrier plate 325
additionally permits the magnetic force to be "turned off" when
electricity source is removed, which then makes for easier removal
of the flexible substrate materials (e.g., 201, 298, and 299) from
the electromagnetic carrier plate 325.
[0047] It is therefore in accordance with one embodiment that the
flexible substrate materials (e.g., 201, 298, and 299) are prepared
on a magnetic plate, such as magnetic plates 310, 320 or 325, such
that the flexible substrate materials (e.g., 201, 298, and 299)
remain fixed upon the magnetic plate. In accordance with such an
embodiment, a cover plate is not required nor is a cover plate used
as the flexible substrate materials (e.g., 201, 298, and 299) hold
fast to the carrier plate without requiring additional downward
pressure from the cover plate. Further still, adhesives are not
utilized nor are mechanical binders such as clips or clamps used,
as the flexible substrate materials (e.g., 201, 298, and 299) will
hold fast to the carrier plate via magnetism without such adhesive
or mechanical means.
[0048] In a related embodiment, the substrate materials (e.g., 201,
298, and 299) are made with magnetic particles and a ferromagnetic
carrier plate 305 is utilized rather than a magnetic carrier plate.
With the ferromagnetic carrier plate 305, similar to the magnetic
carrier plate, the flexible substrate materials (e.g., 201, 298,
and 299) having the magnetic particles embedded therein or coated,
printed, or painted thereupon, are prepared on the ferromagnetic
carrier plate 305, such that the flexible substrate materials
remain fixed upon the ferromagnetic carrier plate 305. As before,
tapes, adhesives, cover plates, and mechanical binders are not
required and are not utilized.
[0049] In accordance with a particular embodiment, the flexible
substrate materials (e.g., 201, 298, and 299) are manufactured with
the magnetic particles or the ferrous particles embedded or coated
on so called "streets" (strips lengthwise along the flexible
substrates being manufactured) which are connected with and form
part of the flexible substrate materials during manufacturing so as
to hold the flexible substrate materials to the carrier plates as
described, and at the conclusion of manufacturing, the strips or
"streets" are cut away and do not form any part of the consumer
product within which the flexible substrates are integrated. Such
streets or strips may form either a perimeter or a boarder all the
way around the flexible substrate, which is later cut away, or form
margins on one two or three sides of the flexible substrate, again,
to be cut away later at the conclusion of the manufacturing
processes for the flexible substrate. The strips or streets need
not be straight and may therefore form the boarder or perimeter of
an elliptical or other shaped flexible substrate according to the
needs of the manufacturer.
[0050] In accordance with a particular embodiment, the flexible
substrate materials include the strips or streets and the ferrous
or magnetic particles are embodied within or applied to only the
strip or street section of the substrate material and are not
embodied within or applied to the flexible substrate having the
components and circuitry and which ultimately is to be integrated
into a consumer product. In such a way, if the consumer product has
design specifications, uses, or characteristics which make it
preferable to avoid the inclusion of such magnetic or ferrous
materials, then the described processes may nevertheless be
utilized, but without necessitating the inclusion of such magnetic
or ferromagnetic particles in the end product as a result of the
described processes for holding the flexible substrates to the
carrier plates by way of magnetic forces.
[0051] In accordance with a particular embodiment, only a subset or
a portion or a zone of the carrier plate is made to be magnetic or
ferromagnetic, for instance, such as the magnetic strips 311 which
are depicted or alternatively, strips or portions or regions which
align with and interface to complementary portions of the flexible
substrate, such the strips or streets which are described
above.
[0052] FIG. 4A depicts a flexible substrate 466 and a magnetic
carrier plate 465 in accordance with described embodiments. In
Particular, there is a flexible substrate 466 depicted having
magnetic filler particles 468 within the substrate material. Also
depicted are metal traces 467 and contact points for
interconnecting various components and circuits to be installed
upon the flexible substrate 466.
[0053] There is depicted a magnetic attractive force 469 between
the flexible substrate 466 and the magnetic carrier plate 465 by
which the flexible substrate 466 is held fast to the magnetic
carrier plate 465 during the manufacturing processes. A profile
view of the flexible substrate 466 and the magnetic carrier plate
465 is further depicted on the far right hand side, however, the
elements shown are the same.
[0054] In accordance with a particular embodiment the magnetic
characteristics, be they magnetic particles or ferrous particles
attracted to magnetic forces, are embodied into the flexible
substrate 466 though a buildup process, for instance, as part of a
laminated sheet affixed to the flexible substrate or as part of a
laminatable sheet to be applied to the flexible substrate 466.
Various elements may be incorporated into the flexible substrate as
part of the manufacturing processes to build up the flexible
substrate, and any or all of these may be adapted to receive the
magnetic particles or ferrous particles attracted to magnetic
forces such that the resultant flexible substrate embodies the
magnetic particles or ferrous particles attracted to magnetic
forces and is attracted to the carrier plate in the manner which is
described herein.
[0055] For instance, as part of the buildup of the flexible
substrate 466 or the strips or "streets" attached to the flexible
substrate 466 a variety of laminates may be used, any of which may
incorporate the magnetic particles or ferrous particles attracted
to magnetic forces. Still further, the adhesives utilized to bond
the various laminate layers together (not adhesive or tape to bond
to the carrier plate but part of the flexible substrate itself) may
be adapted with the magnetic particles or ferrous particles
attracted to magnetic forces such that when the adhesives are
applied as part of the laminate and buildup processes the flexible
substrate is as a result made to be magnetic or made to be
attracted to magnetic forces due to the incorporation of the
magnetic particles or ferrous particles within such adhesives.
[0056] In a particular embodiment the magnetic particles or ferrous
particles attracted to magnetic forces are incorporated into a
solder mask, solder stop mask, or a solder resist layer, which is
the thin lacquer-like layer of polymer commonly applied atop the
electrical metal traces 467 and interconnecting circuits for
protection against oxidation and to prevent solder bridges (an
unintended electrical connection between two conductors) from
forming between the closely spaced solder pads and contact
points.
[0057] In accordance with one embodiment, the flexible substrate
466 having magnetic particles or ferrous particles embodied therein
is formed into a wearable electronic device, such as a ring, watch,
bracelet, belt, clothing, etc., and the magnetic properties of the
flexible substrate 466 are then utilized as part of a magnetic
coupling means of the wearable electronic device. For instance, a
clasp or latch, or other magnetic coupling means may be integrated
into the wearable electronic device in such a way that it holds its
closed position by attractive magnetic forces exerted by the
flexible substrate 466. Consider for instance the watch and
bracelet wearable electronic devices depicted at FIG. 1, having a
clasp or other magnetic coupler which remains closed through
attractive magnetic forces with magnetic filler particles 468
within the substrate material thus eliminating the need for another
magnetic force within the design, saving cost, space, and reducing
waste.
[0058] FIG. 4B depicts another flexible substrate 466 and a
magnetic carrier plate 465 in accordance with described
embodiments. In particular, the flexible substrate 466 is shown in
the top view as being attached to and held fast with the magnetic
carrier plate 465 by the magnetic attractive force 469. At the
bottom view the removal process for the flexible substrate 466 from
the magnetic carrier plate 465 is shown in which the method by
which the flexible substrate 466 is removed is to simply slide the
flexible substrate 466 off of the magnetic carrier plate 465 in
accordance with such an embodiment. According to another
embodiment, the flexible substrate is peeled off of the magnetic
carrier plate 465 rather than sliding the magnetic carrier plate
465 off of the carrier plate.
[0059] In accordance with another embodiment the magnetic force is
varied at the magnetic carrier plate 465 to optimize the removal of
the flexible substrate 466 by heating or cooling the magnetic
carrier plate 465 to attain the desired magnetic force for the
removal of the flexible substrate 466.
[0060] FIG. 4C depicts a flexible substrate 466 and an
electromagnetic carrier plate 485 in accordance with described
embodiments. In particular, the flexible substrate 466 is shown in
the top view as being attached to and held fast with the
electromagnetic carrier plate 485 by the magnetic attractive force
469 while the electromagnetic carrier plate 485 is energized by an
electrical input source (e.g., while the electromagnetic carrier
plate 485 is "turned on"). At the bottom view the removal process
for the flexible substrate 466 from the electromagnetic carrier
plate 485 is shown in which the method by which the flexible
substrate 466 is removed is to simply lift off the flexible
substrate 466 from the electromagnetic carrier plate 485 once the
electromagnetic carrier plate 485 is no loner energized, in
accordance with such an embodiment.
[0061] In accordance with another embodiment the electromagnetic
force is varied at the electromagnetic carrier plate 485 to
optimize the removal of the flexible substrate 466 without entirely
de-energizing (e.g., "turning off") the electromagnetic carrier
plate 485.
[0062] According to the described embodiments, the magnetic
particles used as filler or used as a composite or alloy from which
the magnetic carrier plate is constructed may be any one of a
rubberized magnetic material, a high temperature resistant magnetic
material which resists de-magnetizing at high temperatures so as to
support thermal curing of the flexible substrates without damaging
the magnetic carrier plate used during the manufacturing process,
magnetized adhesives, magnetized laminates, magnetized sheets,
magnetized filler particles, magnetized tape, magnetic ceramics,
SmCo or Neodymium Iron Boron (NdFeB) filler particles, tabs,
strips, buttons, etc.
[0063] FIG. 5 is a flow diagram illustrating a method 500 for
implementing a magnetic particle embedded flexible substrate, a
printed flexible substrate for a magnetic tray, or an
electro-magnetic carrier for magnetized or ferromagnetic flexible
substrates in accordance with described embodiments. Some of the
blocks and/or operations listed below are optional in accordance
with certain embodiments. The numbering of the blocks presented is
for the sake of clarity and is not intended to prescribe an order
of operations in which the various blocks must occur. Additionally,
operations from flow 500 may be utilized in a variety of
combinations.
[0064] At block 505 the method includes fabricating a flexible
substrate having one or more electrical interconnects to couple
with leads of an electrical device.
[0065] At block 510 the method includes integrating magnetic
particles or ferromagnetic particles with the flexible
substrate.
[0066] At block 515 the method includes supporting the flexible
substrate with a carrier plate during one or more manufacturing
processes for the flexible substrate, in which the flexible
substrate is held flat against the carrier plate by an attractive
magnetic force between the magnetic particles or ferromagnetic
particles integrated with the flexible substrate and a
complementary magnetic attraction of the carrier plate.
[0067] At block 520 the method includes removing the flexible
substrate from the carrier plate subsequent to completion of the
one or more manufacturing processes for the flexible substrate.
[0068] In accordance with another embodiment of method 500,
supporting the flexible substrate with the carrier plate during the
one or more manufacturing processes for the flexible substrate
includes: supporting the flexible substrate with the carrier plate
during one or more of assembly processing operations,
semi-conductor manufacturing processes, substrate manufacturing
processes, or flexible substrate thermal curing processes, flexible
substrate build-up and lamination processes, flexible substrate
soldering processes, and flexible substrate functional testing
processes.
[0069] In accordance with another embodiment of method 500, the
flexible substrate for the electrical device lacks sufficient
rigidity and biaxial strength to hold its shape within a horizontal
plane when unsupported by the carrier plate.
[0070] In accordance with another embodiment of method 500, the
flexible substrate for the electrical device is sufficiently thin
that it does not maintain its shape within a horizontal plane when
removed from the carrier plate.
[0071] In accordance with another embodiment of method 500,
integrating magnetic particles or ferromagnetic particles with the
flexible substrate includes one of: integrating magnetized
adhesives between laminates of the fabricated flexible substrate;
integrating magnetized laminates into the fabricated flexible
substrate; integrating magnetized sheets into the fabricated
flexible substrate; integrating magnetized filler particles into
the fabricated flexible substrate; integrating magnetized tape into
the fabricated flexible substrate; integrating magnetic ceramics
into the fabricated flexible substrate; integrating SmCo or
Neodymium Iron Boron (NdFeB) or SiO.sub.2 (Silicon dioxide) or
ferrous oxide filler particles into the fabricated flexible
substrate; or integrating magnetic or ferromagnetic tabs, strips,
or buttons into the fabricated flexible substrate.
[0072] In accordance with another embodiment of method 500,
integrating magnetic particles or ferromagnetic particles with the
flexible substrate includes one of: printing magnetic ink or
ferromagnetic ink onto the flexible substrate; painting the
flexible substrate with magnetic paint or ferromagnetic paint;
coating the flexible substrate with a magnetic or ferromagnetic
laminate; coating the flexible substrate with a magnetic or
ferromagnetic adhesive; coating the flexible substrate with a
magnetic or ferromagnetic tape; coating the flexible substrate with
a magnetic or ferromagnetic polymer; coating the flexible substrate
with a magnetic or ferromagnetic elastomer; coating the flexible
substrate with a magnetic or ferromagnetic plastic; coating the
flexible substrate in a magnetic or ferromagnetic solder resist
layer; coating the flexible substrate in a magnetic or
ferromagnetic solder mask; coating the flexible substrate in a
magnetic or ferromagnetic solder stop mask; or coating the flexible
substrate in a magnetic or ferromagnetic lacquer.
[0073] In accordance with another embodiment of method 500, the
process further includes electrically coupling the leads of the
electrical device with the one or more electrical interconnects
fabricated into the flexible substrate while the flexible substrate
remains held flat against the carrier plate by the magnetic
attraction between the carrier plate and the flexible
substrate.
[0074] In accordance with another embodiment of method 500, the
flexible substrate for the electrical device includes a compliant
and stretchable dielectric material substrate having a plurality of
stretchable electrical interconnects integrated therein as the one
or more electrical interconnects; in which the stretchable
electrical interconnects electrically couple the electrical device
with one or more electrical components via the one or more
stretchable electrical interconnects; and in which the stretchable
electrical interconnects provide an electrical and communications
interface between the electrical device and the one or more
electrical components through the dielectric material.
[0075] In accordance with another embodiment of method 500,
supporting the flexible substrate with the carrier plate during the
one or more manufacturing processes for the flexible substrate
includes: attaching the electrical device to the flexible
substrate, in which the electrical device includes an integrated
circuit, a processor, a die, or a central processor unit (CPU);
attaching one or more electrical components to the flexible
substrate, in which the one or more electrical components include
any one of: a battery, a sensor, a transceiver, a memory, and a
system on a chip (SOC); and electrically interfacing the electrical
device attached to the flexible substrate with the one or more
electrical components attached to the flexible substrate while the
flexible substrate remains held flat against the carrier plate by
the attractive magnetic force.
[0076] In accordance with another embodiment of method 500, the
flexible substrate and electrical device includes a module package
including at least a microelectronic die embedded in a processor
and a memory and one or more communication circuits.
[0077] In accordance with another embodiment of method 500, the
flexible substrate includes an uncured elastomer including an
elastomer mix and FeO (ferrous oxide) particles which respond to
stimuli of a magnetic field; in which the method further includes:
curing the elastomer mix and FeO particles forming the flexible
substrate; and electrically coupling the leads of the electrical
device with the one or more electrical interconnects fabricated
into the flexible substrate subsequent to curing the elastomer mix
and FeO particles, in which the flexible substrate is held flat
against the carrier plate by an attractive magnetic force between
the FeO particles cured into the flexible substrate and the
complementary magnetic attraction of the carrier plate.
[0078] In accordance with another embodiment of method 500, the
flexible substrate includes a compliant and stretchable substrate
for the electrical device and one or more electrically connected
electrical components, sensors, or functional modules; in which the
stretchable substrate includes at least one of a stretchable
polydimethylsiloxane (PDMS) substrate, a stretchable Polyisoprene
substrate, a stretchable polybutadiene substrate, a stretchable
polyisobutylene substrate, a stretchable polyurethanes substrate, a
stretchable thermoplasticpolyurethanes substrate, a stretchable
butyl rubber substrate, a stretchable nitrile rubber substrate, or
a stretchable woven fabric substrate.
[0079] In accordance with another embodiment of method 500, the
flexible substrate includes one of: a flex circuit; a flexible
plastic substrate; a stretchable electronic substrate; a
stretchable dielectric material; a compliant, bendable, or flexible
dielectric substrate; a polyimide substrate; a PolyEther Ether
Ketone (PEEK) substrate; a PolyDiMethylSiloxane (PDMS) substrate; a
Flexible Printed Circuit (FPC) substrate; a photolithographic
exposed substrate; a flexible foil circuit and substrate; a
Flexible Flat Cable (FFC) substrate; a copper strip laminated
between two layers of Polyethylene terephthalate (PETE) and coated
by a thermosetting adhesive; a silicon-based organic polymer
substrate; and a screen printed silver circuits on polyester
substrate.
[0080] In accordance with another embodiment of method 500, the
carrier plate is magnetic and the flexible substrate is
ferromagnetic.
[0081] In accordance with another embodiment of method 500, the
carrier plate is magnetic and the flexible substrate is
magnetic.
[0082] In accordance with another embodiment of method 500, the
carrier plate is ferromagnetic and the flexible substrate is
magnetic.
[0083] In accordance with another embodiment of method 500, the
carrier plate is an electromagnetic carrier plate and the flexible
substrate is magnetic or ferromagnetic and further in which the
flexible substrate is held flat against the carrier plate by an
attractive magnetic force between the flexible substrate and a
complementary magnetic attraction of the electromagnetic carrier
plate while the electromagnetic carrier plate is energized by an
electrical input source.
[0084] In accordance with another embodiment of method 500,
supporting the flexible substrate with the carrier plate during one
or more manufacturing processes for the flexible substrate includes
applying the one or more manufacturing processes to the flexible
substrate held to the carrier plate by magnetic attraction without
the use of a top plate, without the use of a cover plate, without
the use of mechanical clips, without the use of mechanical clamps,
without the use of adhesive tape binding the flexible substrate to
the carrier plate; and without the use of discardable flanges.
[0085] In accordance with another embodiment of method 500,
removing the flexible substrate from the carrier plate subsequent
to completion of the one or more manufacturing processes for the
flexible substrate includes one of: sliding the flexible substrate
off of the carrier plate; peeling the flexible substrate off of the
carrier plate; or terminating an electromagnetic attraction of the
carrier plate by removing an electrical power source to the carrier
plate functioning as an electromagnetic carrier plate and lifting
the flexible substrate off of the carrier plate.
[0086] In accordance with another embodiment of method 500, the
carrier plate includes a magnetic carrier plate; and in which
removing the flexible substrate from the carrier plate subsequent
to completion of the one or more manufacturing processes for the
flexible substrate includes heating or cooling the carrier plate to
attain a specified magnetic force for the removal of the flexible
substrate from the magnetic carrier plate and removing the flexible
substrate from the magnetic carrier plate when the specified
magnetic force is attained.
[0087] In accordance with another embodiment of method 500, the
carrier plate includes an electromagnetic carrier plate; and in
which removing the flexible substrate from the carrier plate
subsequent to completion of the one or more manufacturing processes
for the flexible substrate includes varying an electromagnetic
attractive force of the electromagnetic carrier plate by increasing
or decreasing an electrical input to the electromagnetic carrier
plate to attain a specified electromagnetic force for the removal
of the flexible substrate from the magnetic carrier plate and
removing the flexible substrate from the electromagnetic carrier
plate when the specified electromagnetic force is attained.
[0088] In accordance with another embodiment of method 500, the
process further includes: assembling the flexible substrate into a
consumer product, in which the consumer product includes one of: a
clothing item; sports attire; a shoe; a watch; a ring; a bracelet;
a wearable technology to be worn as a clothing item or an
accessory; fashion electronics to be worn as a clothing item or an
accessory; tech togs to be worn as a clothing item or an accessory;
fashionable technology to be worn as a clothing item or an
accessory; or a flexible wearable technology to be worn as a
clothing item or an accessory.
[0089] FIG. 6 is a schematic of a computer system 600, in
accordance with an embodiment of the present invention. The
computer system 600 (also referred to as the electronic system 600)
as depicted can embody a magnetic particle embedded flexible
substrate, a printed flexible substrate for a magnetic tray, or an
electro-magnetic carrier for magnetized or ferromagnetic flexible
substrates, according to any of the several disclosed embodiments
and their equivalents as set forth in this disclosure. The computer
system 600 may be a mobile device such as a net-book computer. The
computer system 600 may be a mobile device such as a wireless smart
phone or tablet. The computer system 600 may be a desktop computer.
The computer system 600 may be a hand-held reader. The computer
system 600 may be a server system. The computer system 600 may be a
supercomputer or high-performance computing system.
[0090] In accordance with one embodiment, the electronic system 600
is a computer system that includes a system bus 620 to electrically
couple the various components of the electronic system 600. The
system bus 620 is a single bus or any combination of busses
according to various embodiments. The electronic system 600
includes a voltage source 630 that provides power to the integrated
circuit 610. In some embodiments, the voltage source 630 supplies
current to the integrated circuit 610 through the system bus
620.
[0091] Such an integrated circuit 610 is electrically coupled to
the system bus 620 and includes any circuit, or combination of
circuits according to an embodiment. In an embodiment, the
integrated circuit 610 includes a processor 612 that can be of any
type. As used herein, the processor 612 may mean any type of
circuit such as, but not limited to, a microprocessor, a
microcontroller, a graphics processor, a digital signal processor,
or another processor. In an embodiment, the processor 612 includes,
or is coupled with, electrical devices having a magnetic particle
embedded flexible substrate, a printed flexible substrate for a
magnetic tray, or an electro-magnetic carrier for magnetized or
ferromagnetic flexible substrates, as disclosed herein.
[0092] In accordance with one embodiment, SRAM embodiments are
found in memory caches of the processor. Other types of circuits
that can be included in the integrated circuit 610 are a custom
circuit or an application-specific integrated circuit (ASIC), such
as a communications circuit 614 for use in wireless devices such as
cellular telephones, smart phones, pagers, portable computers,
two-way radios, and similar electronic systems, or a communications
circuit for servers. In an embodiment, the integrated circuit 610
includes on-die memory 616 such as static random-access memory
(SRAM). In an embodiment, the integrated circuit 610 includes
embedded on-die memory 616 such as embedded dynamic random-access
memory (eDRAM).
[0093] In accordance with one embodiment, the integrated circuit
610 is complemented with a subsequent integrated circuit 611.
Useful embodiments include a dual processor 613 and a dual
communications circuit 615 and dual on-die memory 617 such as SRAM.
In accordance with one embodiment, the dual integrated circuit 610
includes embedded on-die memory 617 such as eDRAM.
[0094] In one embodiment, the electronic system 600 also includes
an external memory 640 that in turn may include one or more memory
elements suitable to the particular application, such as a main
memory 642 in the form of RAM, one or more hard drives 644, and/or
one or more drives that handle removable media 646, such as
diskettes, compact disks (CDs), digital variable disks (DVDs),
flash memory drives, and other removable media known in the art.
The external memory 640 may also be embedded memory 648 such as the
first die in a die stack, according to an embodiment.
[0095] In accordance with one embodiment, the electronic system 600
also includes a display device 650 and an audio output 660. In one
embodiment, the electronic system 600 includes an input device 670
such as a controller that may be a keyboard, mouse, trackball, game
controller, microphone, voice-recognition device, or any other
input device that inputs information into the electronic system
600. In an embodiment, an input device 670 is a camera. In an
embodiment, an input device 670 is a digital sound recorder. In an
embodiment, an input device 670 is a camera and a digital sound
recorder.
[0096] As shown herein, the integrated circuit 610 can be
implemented in a number of different embodiments, including a
package substrate having a magnetic particle embedded flexible
substrate, a printed flexible substrate for a magnetic tray, or an
electro-magnetic carrier for magnetized or ferromagnetic flexible
substrates, according to any of the several disclosed embodiments
and their equivalents, an electronic system, a computer system, one
or more methods of fabricating an integrated circuit, and one or
more methods of fabricating an electronic assembly that includes a
package substrate having a magnetic particle embedded flexible
substrate, a printed flexible substrate for a magnetic tray, or an
electro-magnetic carrier for magnetized or ferromagnetic flexible
substrates, according to any of the several disclosed embodiments
as set forth herein in the various embodiments and their
art-recognized equivalents. The elements, materials, geometries,
dimensions, and sequence of operations can all be varied to suit
particular I/O coupling requirements including array contact count,
array contact configuration for a microelectronic die embedded in a
processor mounting substrate according to any of the several
disclosed package substrates having a magnetic particle embedded
flexible substrate, a printed flexible substrate for a magnetic
tray, or an electro-magnetic carrier for magnetized or
ferromagnetic flexible substrates embodiments and their
equivalents. A foundation substrate 698 may be included, as
represented by the dashed line of FIG. 6. Passive devices 699 may
also be included, as is also depicted in FIG. 6.
[0097] In accordance with a particular embodiment, there is a
flexible substrate including: an electrical device affixed to the
flexible substrate; one or more electrical interconnects
electrically coupled with leads of the electrical device; one or
more electrical components electrically coupled with the electrical
device via the one or more electrical interconnects; in which the
flexible substrate lacks sufficient rigidity and biaxial strength
to hold its shape within a horizontal plane when unsupported; and
magnetic particles or ferromagnetic particles integrated with the
flexible substrate, the flexible substrate having undergone one or
more manufacturing processes while held flat against a carrier
plate by an attractive magnetic force between the magnetic
particles or ferromagnetic particles integrated with the flexible
substrate and a complementary magnetic attraction of the carrier
plate, in which the carrier plate supported the flexible substrate
during one or more manufacturing processes for the flexible
substrate.
[0098] In accordance with another embodiment of the flexible
substrate, the magnetic particles or ferromagnetic particles
integrated with the flexible substrate are: painted onto the
flexible substrate; printed onto the flexible substrate; coated
onto the flexible substrate; or mixed and cured within the flexible
substrate.
[0099] In accordance with another embodiment of the flexible
substrate, the apparatus is embodied within one of: a clothing
item; sports attire; a shoe; fashion electronics to be worn as a
clothing item or an accessory; tech togs to be worn as a clothing
item or an accessory; fashionable technology to be worn as a
clothing item or an accessory; or a flexible wearable technology to
be worn as a clothing item or an accessory.
[0100] In accordance with a particular embodiment, there is a
wearable technology to be worn as a clothing item or an accessory,
the wearable technology including: an electrical device affixed to
a flexible substrate; one or more electrical interconnects within
the flexible substrate electrically coupled with leads of the
electrical device; one or more electrical components affixed to the
flexible substrate and electrically coupled with the electrical
device via the one or more electrical interconnects; in which the
flexible substrate lacks sufficient rigidity and biaxial strength
to hold its shape within a horizontal plane when unsupported; and
magnetic particles or ferromagnetic particles integrated with the
flexible substrate, the flexible substrate having undergone one or
more manufacturing processes while held flat against a carrier
plate by an attractive magnetic force between the magnetic
particles or ferromagnetic particles integrated with the flexible
substrate and a complementary magnetic attraction of the carrier
plate, in which the carrier plate supported the flexible substrate
during one or more manufacturing processes for the flexible
substrate.
[0101] In accordance with another embodiment of the wearable
technology, the wearable technology further includes a magnetic
coupler, clasp, or latch held closed through attractive magnetic
forces between the magnetic coupler, clasp, or latch and the
flexible substrate having magnetic filler particles integrated
therewith during a process of manufacture of the flexible
substrate.
[0102] In accordance with another embodiment of the wearable
technology, the wearable technology is embodied within one of: a
clothing item; sports attire; a shoe; fashion electronics to be
worn as a clothing item or an accessory; tech togs to be worn as a
clothing item or an accessory; fashionable technology to be worn as
a clothing item or an accessory; or a flexible wearable technology
to be worn as a clothing item or an accessory.
[0103] While the subject matter disclosed herein has been described
by way of example and in terms of the specific embodiments, it is
to be understood that the claimed embodiments are not limited to
the explicitly enumerated embodiments disclosed. To the contrary,
the disclosure is intended to cover various modifications and
similar arrangements as would be apparent to those skilled in the
art. Therefore, the scope of the appended claims should be accorded
the broadest interpretation so as to encompass all such
modifications and similar arrangements. It is to be understood that
the above description is intended to be illustrative, and not
restrictive. Many other embodiments will be apparent to those of
skill in the art upon reading and understanding the above
description. The scope of the disclosed subject matter is therefore
to be determined in reference to the appended claims, along with
the full scope of equivalents to which such claims are
entitled.
* * * * *