Malatkar; Pramod

Patent Applications and Registrations

Patent applications and USPTO patent grants for Malatkar; Pramod.The latest application filed is for "packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (bbul) packages".

Company Profile

17.34.59

Malatkar; Pramod - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mechanical failure monitoring, detection, and classification in electronic assemblies Grant 11,327,050 - Yazzie , et al. May 10, 2	2022-05-10
Die back side structures for warpage control Grant 11,322,456 - Eid , et al. May 3, 2	2022-05-03
Packaged Semiconductor Die With Bumpless Die-package Interface For Bumpless Build-up Layer (bbul) Packages App 20220068861 - MALATKAR; Pramod ; et al.	2022-03-03
Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages Grant 11,201,128 - Malatkar , et al. December 14, 2	2021-12-14
Printed Heat Spreader Structures And Methods Of Providing Same App 20210242105 - Reyes Schuldes; Jesus Gerardo ; et al.	2021-08-05
Electronic package that includes lamination layer Grant 10,985,080 - Malatkar , et al. April 20, 2	2021-04-20
Integrated circuit packages with patterned protective material Grant 10,957,656 - Yazzie , et al. March 23, 2	2021-03-23
Varied Ball Ball-grid-array (bga) Packages App 20210082798 - LU; Xiao ; et al.	2021-03-18
Integrated Circuit Packages With Patterned Protective Material App 20200357752 - Yazzie; Kyle ; et al.	2020-11-12
Membrane test for mechanical testing of stretchable electronics Grant 10,634,594 - Mahajan , et al.	2020-04-28
Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging Grant 10,607,909 - Muthur Srinath , et al.	2020-03-31
Die Back Side Structures For Warpage Control App 20200066655 - EID; Feras ; et al.	2020-02-27
Thermal head with a thermal barrier for integrated circuit die processing Grant 10,499,461 - Mamodia , et al. De	2019-12-03
Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration Grant 10,475,750 - Nair , et al. Nov	2019-11-12
Non-rectangular Electronic Device Components App 20190304931 - Malatkar; Pramod ; et al.	2019-10-03
Mechanical Failure Monitoring, Detection, And Classification In Electronic Assemblies App 20190257793 - Yazzie; Kyle ; et al.	2019-08-22
Constrained cure component attach process for improved IC package warpage control Grant 10,290,569 - Yazzie , et al.	2019-05-14
Method of assembling an electronic component using a probe having a fluid thereon Grant 10,278,318 - Yazzie , et al.	2019-04-30
Constrained Cure Component Attach Process For Improved Ic Package Warpage Control App 20190103345 - YAZZIE; Kyle ; et al.	2019-04-04
Methods of forming trenches in packages structures and structures formed thereby Grant 10,231,338 - Yagnamurthy , et al.	2019-03-12
Systems, Methods, And Apparatuses For Implementing An Organic Stiffener With An Emi Shield For Rf Integration App 20190051615 - NAIR; Vijay K. ; et al.	2019-02-14
Flexible Circuit Interconnect Structure And Method Of Making Same App 20190043747 - MALATKAR; Pramod ; et al.	2019-02-07
Systems, Methods, And Apparatuses For Implementing A Thermal Solution For 3d Packaging App 20190043772 - MUTHUR SRINATH; Purushotham Kaushik ; et al.	2019-02-07
Dual-sided Package Assembly Processing App 20190043776 - MALATKAR; Pramod ; et al.	2019-02-07
Magnetic Particle Embedded Flex Or Printed Flex For Magnetic Tray Or Electro-magnetic Carrier App 20180376591 - TOMITA; Yoshihiro ; et al.	2018-12-27
Electronic Package That Includes Lamination Layer App 20180350709 - Malatkar; Pramod ; et al.	2018-12-06
Magnetic Pick And Place Probe App 20180322993 - YAZZIE; Kyle ; et al.	2018-11-08
Non-rectangular electronic device components Grant 10,090,259 - Malatkar , et al. October 2, 2	2018-10-02
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier Grant 10,070,520 - Tomita , et al. September 4, 2	2018-09-04
Device, System And Method For Detecting Degradation Of A Flexible Circuit App 20180089984 - Subramanian; Vijay Krishnan ; et al.	2018-03-29
Bumpless Build-up Layer Package With A Pre-stacked Microelectronic Devices App 20180047702 - MALATKAR; Pramod	2018-02-15
Bumpless build-up layer package with pre-stacked microelectronic devices Grant 9,831,213 - Malatkar November 28, 2	2017-11-28
Bumpless build-up layer package design with an interposer Grant 9,818,719 - Malatkar November 14, 2	2017-11-14
Thermal expansion compensators for controlling microelectronic package warpage Grant 9,793,225 - Malatkar , et al. October 17, 2	2017-10-17
Electronic Assembly Components With Corner Adhesive For Warpage Reduction During Thermal Processing App 20170287873 - Sankarasubramanian; Santosh ; et al.	2017-10-05
Removable Ic Package Stiffener App 20170287799 - Klein; Steven A. ; et al.	2017-10-05
Inflatable Bladder Based Mechanical Testing for Stretchable Electronics App 20170269017 - KLEIN; Steven A. ; et al.	2017-09-21
Membrane test for Mechanical Testing of Stretchable Electronics App 20170268971 - MAHAJAN; Ravindranth V. ; et al.	2017-09-21
Lateral Expansion Apparatus for Mechanical Testing of Stretchable Electronics App 20170268972 - SUBRAMANIAN; Vijay Krishnan ; et al.	2017-09-21
Non-Rectangular Electronic Device Components App 20170186705 - Malatkar; Pramod ; et al.	2017-06-29
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier App 20170188455 - Tomita; Yoshihiro ; et al.	2017-06-29
Assembly Probe Utlizing A Fluid To Assemble Components And Systems And Methods Of Use Thereof App 20170181339 - Yazzie; Kyle ; et al.	2017-06-22
Thermal Head with a Thermal Barrier for Integrated Circuit Die Processing App 20170176516 - Mamodia; Mohit ; et al.	2017-06-22
Universal Pick And Place Head For Handling Components Of Any Shape App 20170166407 - Singh; Kumar Abhishek ; et al.	2017-06-15
Bumpless build-up layer package warpage reduction Grant 9,627,227 - Malatkar , et al. April 18, 2	2017-04-18
Reduced expansion thermal compression bonding process bond head Grant 9,548,284 - Malatkar , et al. January 17, 2	2017-01-17
Methods Of Forming Trenches In Packages Structures And Structures Formed Thereby App 20160381800 - Yagnamurthy; Naga Sivakumar ; et al.	2016-12-29
Thermal Expansion Compensators For Controlling Microelectronic Package Warpage App 20160322311 - Malatkar; Pramod ; et al.	2016-11-03
Bumpless Build-up Layer Package With Pre-stacked Microelectronic Devices App 20160276317 - Malatkar; Pramod	2016-09-22
Thermal expansion compensators for controlling microelectronic package warpage Grant 9,414,484 - Malatkar , et al. August 9, 2	2016-08-09
Bumpless build-up layer package with pre-stacked microelectronic devices Grant 9,362,253 - Malatkar June 7, 2	2016-06-07
Packaged Semiconductor Die with Bumpless Die-Package Interface for Bumpless Build-Up Layer (BBUL) Packages App 20160133590 - MALATKAR; Pramod ; et al.	2016-05-12
Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages Grant 9,224,674 - Malatkar , et al. December 29, 2	2015-12-29
Microelectronic Package And Stacked Microelectronic Assembly And Computing System Containing Same App 20150340312 - Malatkar; Pramod ; et al.	2015-11-26
Microelectronic package and stacked microelectronic assembly and computing system containing same Grant 9,159,649 - Malatkar , et al. October 13, 2	2015-10-13
Reduced Expansion Thermal Compression Bonding Process Bond Head App 20150171047 - Malatkar; Pramod ; et al.	2015-06-18
Bumpless Build-up Layer Package Warpage Reduction App 20140363929 - Malatkar; Pramod ; et al.	2014-12-11
Bumpless build-up layer package warpage reduction Grant 8,848,380 - Malatkar , et al. September 30, 2	2014-09-30
Bumpless Build-up Layer Package With Pre-stacked Microelectronic Devices App 20140239510 - Malatkar; Pramod	2014-08-28
Bumpless build-up layer package with pre-stacked microelectronic devices Grant 8,754,516 - Malatkar June 17, 2	2014-06-17
Microelectronic Structure Having A Microelectronic Device Disposed Between An Interposer And A Substrate App 20140001623 - MALATKAR; PRAMOD	2014-01-02
Bumpless Build-up Layer Package Design With An Interposer App 20130334696 - Malatkar; Pramod	2013-12-19
Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby Grant 8,580,616 - Nalla , et al. November 12, 2	2013-11-12
Microelectronic Package And Stacked Microelectronic Assembly And Computing System Containing Same App 20130270719 - Malatkar; Pramod ; et al.	2013-10-17
Thermal Expansion Compensators For Controlling Microelectronic Package Warpage App 20130271929 - Malatkar; Pramod ; et al.	2013-10-17
Packaged Semiconductor Die With Bumpless Die-package Interface For Bumpless Build-up Layer (bbul) Packages App 20130270715 - Malatkar; Pramod ; et al.	2013-10-17
Methods Of Forming Fully Embedded Bumpless Build-up Layer Packages And Structures Formed Thereby App 20130023088 - Nalla; Ravi K. ; et al.	2013-01-24
Bumpless Build-up Layer Package Warpage Reduction App 20130003319 - MALATKAR; PRAMOD ; et al.	2013-01-03
Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby Grant 8,304,913 - Nalla , et al. November 6, 2	2012-11-06
Methods Of Forming Fully Embedded Bumpless Build-up Layer Packages And Structures Formed Thereby App 20120074580 - Nalla; Ravi K. ; et al.	2012-03-29
Bumpless Build-up Layer Package With Pre-stacked Microelectronic Devices App 20120049382 - Malatkar; Pramod	2012-03-01
Bumpless Build-up Layer Package Design With An Interposer App 20120001339 - Malatkar; Pramod	2012-01-05
Retractable ledge socket Grant 7,179,093 - Holmberg , et al. February 20, 2	2007-02-20
Single unit heat sink, voltage regulator, and package solution for an integrated circuit App 20070023879 - Pandey; Vinayak ; et al.	2007-02-01
Socket features for aligning and orienting components App 20070004242 - Pandey; Vinayak ; et al.	2007-01-04
Retractable Ledge Socket App 20070004246 - Holmberg; Nicholas L. ; et al.	2007-01-04

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