| Patent | Date |
|---|
Microelectronic assemblies having magnetic core inductors
Grant 11,450,560 - Bharath , et al. September 20, 2 | 2022-09-20 |
Microelectronic assemblies with communication networks
Grant 11,437,348 - Elsherbini , et al. September 6, 2 | 2022-09-06 |
Microelectronic Assemblies
App 20220278057 - Elsherbini; Adel A. ; et al. | 2022-09-01 |
Ultra-thin, hyper-density semiconductor packages
Grant 11,430,724 - Mallik , et al. August 30, 2 | 2022-08-30 |
Inorganic piezoelectric materials formed on fibers and applications thereof
Grant 11,421,376 - Liff , et al. August 23, 2 | 2022-08-23 |
Dies with integrated voltage regulators
Grant 11,417,593 - Elsherbini , et al. August 16, 2 | 2022-08-16 |
Microelectronic Assemblies
App 20220254754 - ELSHERBINI; Adel A. ; et al. | 2022-08-11 |
Microelectronic Devices Designed With Compound Semiconductor Devices And Integrated On An Inter Die Fabric
App 20220246554 - KAMGAING; Telesphor ; et al. | 2022-08-04 |
Microelectronic Assemblies
App 20220230964 - Liff; Shawna M. ; et al. | 2022-07-21 |
Microelectronic assemblies
Grant 11,393,777 - Elsherbini , et al. July 19, 2 | 2022-07-19 |
Microelectronic Assemblies
App 20220223561 - Liff; Shawna M. ; et al. | 2022-07-14 |
Microelectronic Assemblies
App 20220223578 - Elsherbini; Adel A. ; et al. | 2022-07-14 |
Antenna Package Using Ball Attach Array To Connect Antenna And Base Substrates
App 20220216611 - Yao; Jimin ; et al. | 2022-07-07 |
Microelectronic Assemblies With Communication Networks
App 20220216182 - Elsherbini; Adel A. ; et al. | 2022-07-07 |
Electromagnetic interference shield created on package using high throughput additive manufacturing
Grant 11,380,624 - Eid , et al. July 5, 2 | 2022-07-05 |
Carrier For Microelectronic Assemblies Having Direct Bonding
App 20220199449 - Baker; Michael J. ; et al. | 2022-06-23 |
Carrier For Microelectronic Assemblies Having Direct Bonding
App 20220199453 - Baker; Michael J. ; et al. | 2022-06-23 |
Carrier For Microelectronic Assemblies Having Direct Bonding
App 20220199450 - Liff; Shawna M. ; et al. | 2022-06-23 |
Shield Structures In Microelectronic Assemblies Having Direct Bonding
App 20220199546 - Elsherbini; Adel A. ; et al. | 2022-06-23 |
Microelectronic assemblies with communication networks
Grant 11,367,689 - Elsherbini , et al. June 21, 2 | 2022-06-21 |
Semiconductor package or structure with dual-sided interposers and memory
Grant 11,367,707 - Liff , et al. June 21, 2 | 2022-06-21 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189839 - Eid; Feras ; et al. | 2022-06-16 |
Hermetic Sealing Structures In Microelectronic Assemblies Having Direct Bonding
App 20220189861 - Aleksov; Aleksandar ; et al. | 2022-06-16 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189850 - Liff; Shawna M. ; et al. | 2022-06-16 |
Antenna package using ball attach array to connect antenna and base substrates
Grant 11,355,849 - Yao , et al. June 7, 2 | 2022-06-07 |
Microelectronic assemblies
Grant 11,348,895 - Liff , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,348,897 - Elsherbini , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,348,912 - Elsherbini , et al. May 31, 2 | 2022-05-31 |
Robust Mold Integrated Substrate
App 20220165686 - Yao; Jimin ; et al. | 2022-05-26 |
Microelectronic assemblies
Grant 11,342,320 - Elsherbini , et al. May 24, 2 | 2022-05-24 |
Microelectronic assemblies
Grant 11,335,665 - Liff , et al. May 17, 2 | 2022-05-17 |
Microelectronic assemblies
Grant 11,335,642 - Liff , et al. May 17, 2 | 2022-05-17 |
Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric
Grant 11,335,651 - Kamgaing , et al. May 17, 2 | 2022-05-17 |
Microelectronic assemblies
Grant 11,335,663 - Liff , et al. May 17, 2 | 2022-05-17 |
Fast-lane routing for multi-chip packages
Grant 11,336,559 - Elsherbini , et al. May 17, 2 | 2022-05-17 |
Robust mold integrated substrate
Grant 11,322,455 - Yao , et al. May 3, 2 | 2022-05-03 |
Microelectronic assemblies having substrate-integrated perovskite layers
Grant 11,302,618 - Eid , et al. April 12, 2 | 2022-04-12 |
TSV-less die stacking using plated pillars/through mold interconnect
Grant 11,296,052 - Meyers , et al. April 5, 2 | 2022-04-05 |
Singulation Of Microelectronic Components With Direct Bonding Interfaces
App 20220102305 - Krishnatreya; Bhaskar Jyoti ; et al. | 2022-03-31 |
Capacitors And Resistors At Direct Bonding Interfaces In Microelectronic Assemblies
App 20220093725 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093492 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093547 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093546 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093517 - Aleksov; Aleksandar ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093561 - Eid; Feras ; et al. | 2022-03-24 |
Microelectronic Assemblies With Communication Networks
App 20220051987 - Elsherbini; Adel A. ; et al. | 2022-02-17 |
Stacked package with electrical connections created using high throughput additive manufacturing
Grant 11,227,859 - Eid , et al. January 18, 2 | 2022-01-18 |
Package integrated security features
Grant 11,223,524 - Liff , et al. January 11, 2 | 2022-01-11 |
Microelectronic assemblies with communication networks
Grant 11,217,535 - Elsherbini , et al. January 4, 2 | 2022-01-04 |
Stacked Die Architectures With Improved Thermal Management
App 20210375719 - Eid; Feras ; et al. | 2021-12-02 |
Methods For Conductively Coating Millimeter Waveguides
App 20210376437 - Aleksov; Aleksandar ; et al. | 2021-12-02 |
Electronic Package With Stud Bump Electrical Connections
App 20210366862 - Li; Zhaozhi ; et al. | 2021-11-25 |
Electronic package with stud bump electrical connections
Grant 11,127,706 - Li , et al. September 21, 2 | 2021-09-21 |
Methods for conductively coating millimeter waveguides
Grant 11,095,012 - Aleksov , et al. August 17, 2 | 2021-08-17 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
Grant 11,075,166 - Li , et al. July 27, 2 | 2021-07-27 |
Scalable Embedded Silicon Bridge Via Pillars In Lithographically Defined Vias, And Methods Of Making Same
App 20210225807 - ELSHERBINI; Adel A. ; et al. | 2021-07-22 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210193519 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Semiconductor Packaging With High Density Interconnects
App 20210193583 - ELSHERBINI; Adel A. ; et al. | 2021-06-24 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric
Grant 11,031,666 - Elsherbini , et al. June 8, 2 | 2021-06-08 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer
Grant 11,024,933 - Rawlings , et al. June 1, 2 | 2021-06-01 |
Adaptable displays using piezoelectric actuators
Grant 11,016,288 - Oster , et al. May 25, 2 | 2021-05-25 |
Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same
Grant 11,004,824 - Elsherbini , et al. May 11, 2 | 2021-05-11 |
Microelectronic Assemblies
App 20210111147 - Liff; Shawna M. ; et al. | 2021-04-15 |
Microelectronic Assemblies With Communication Networks
App 20210111124 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies With Communication Networks
App 20210111154 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111170 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111156 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111155 - Liff; Shawna M. ; et al. | 2021-04-15 |
Piezo actuators for optical beam steering applications
Grant 10,969,576 - Aleksov , et al. April 6, 2 | 2021-04-06 |
Process for creating piezo-electric mirrors in package
Grant 10,969,574 - Oster , et al. April 6, 2 | 2021-04-06 |
Semiconductor packaging with high density interconnects
Grant 10,971,453 - Elsherbini , et al. April 6, 2 | 2021-04-06 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections
Grant 10,950,919 - Kamgaing , et al. March 16, 2 | 2021-03-16 |
Semiconductor package having integrated stiffener region
Grant 10,923,415 - Goh , et al. February 16, 2 | 2021-02-16 |
Piezoelectric package-integrated current sensing devices
Grant 10,921,349 - Dogiamis , et al. February 16, 2 | 2021-02-16 |
Microelectronic Structures Having Multiple Microelectronic Devices Connected With A Microelectronic Bridge Embedded In A Microelectronic Substrate
App 20200395301 - LI; Eric J. ; et al. | 2020-12-17 |
Package architecture for antenna arrays
Grant 10,868,366 - Elsherbini , et al. December 15, 2 | 2020-12-15 |
Coreless package architecture for multi-chip opto-electronics
Grant 10,845,552 - Liff , et al. November 24, 2 | 2020-11-24 |
Quantum Computing Assemblies
App 20200364600 - Elsherbini; Adel A. ; et al. | 2020-11-19 |
Piezoelectric package-integrated sensing devices
Grant 10,840,430 - Eid , et al. November 17, 2 | 2020-11-17 |
Piezoelectrically actuated mirrors for optical communications
Grant 10,816,733 - Oster , et al. October 27, 2 | 2020-10-27 |
Flexible packaging for a wearable electronic device
Grant 10,820,437 - Aleksov , et al. October 27, 2 | 2020-10-27 |
Electromagnetic Interference Shield Created On Package Using High Throughput Additive Manufacturing
App 20200312782 - EID; Feras ; et al. | 2020-10-01 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
Grant 10,790,231 - Li , et al. September 29, 2 | 2020-09-29 |
Microelectronic Package With Radio Frequency (rf) Chiplet
App 20200303329 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Micro-led Displays Including Solder Structures And Methods
App 20200303611 - Sounart; Thomas L. ; et al. | 2020-09-24 |
Antenna Package Using Ball Attach Array To Connect Antenna And Base Substrates
App 20200303822 - YAO; Jimin ; et al. | 2020-09-24 |
Microelectronic Assemblies
App 20200286871 - Liff; Shawna M. ; et al. | 2020-09-10 |
Microelectronic Assemblies
App 20200286745 - Elsherbini; Adel A. ; et al. | 2020-09-10 |
Ultra Small Molded Module Integrated With Die By Module-on-wafer Assembly
App 20200286834 - YOSHIHIRO; Tomita ; et al. | 2020-09-10 |
Microelectronic Assemblies
App 20200279813 - Liff; Shawna M. ; et al. | 2020-09-03 |
Microelectronic Assemblies
App 20200279829 - Elsherbini; Adel A. ; et al. | 2020-09-03 |
Ultra-thin, Hyper-density Semiconductor Packages
App 20200273784 - MALLIK; Debendra ; et al. | 2020-08-27 |
Microelectronic Assemblies
App 20200273839 - ELSHERBINI; Adel A. ; et al. | 2020-08-27 |
Microelectronic Assemblies With Communication Networks
App 20200273840 - Elsherbini; Adel A. ; et al. | 2020-08-27 |
Stress isolation for silicon photonic applications
Grant 10,748,844 - Kumar , et al. A | 2020-08-18 |
Multi-packaging for single-socketing
Grant 10,734,358 - Rosch , et al. | 2020-08-04 |
Microelectronic Assemblies
App 20200235061 - Elsherbini; Adel A. ; et al. | 2020-07-23 |
Stacked Package With Electrical Connections Created Using High Throughput Additive Manufacturing
App 20200235082 - EID; Feras ; et al. | 2020-07-23 |
Piezoelectric package-integrated acoustic transducer devices
Grant 10,721,568 - Dogiamis , et al. | 2020-07-21 |
Microelectronic Assemblies
App 20200227377 - Liff; Shawna M. ; et al. | 2020-07-16 |
Microelectronic Assemblies
App 20200227401 - Elsherbini; Adel A. ; et al. | 2020-07-16 |
Microelectronic Assemblies
App 20200227384 - Liff; Shawna M. ; et al. | 2020-07-16 |
Microelectronic Assemblies With Communication Networks
App 20200219815 - Elsherbini; Adel A. ; et al. | 2020-07-09 |
Ultra small molded module integrated with die by module-on-wafer assembly
Grant 10,707,171 - Yoshihiro , et al. | 2020-07-07 |
Tsv-less Die Stacking Using Plated Pillars/through Mold Interconnect
App 20200212012 - MEYERS; Preston T. ; et al. | 2020-07-02 |
Piezoelectric driven switches integrated in organic, flexible displays
Grant 10,658,566 - Liff , et al. | 2020-05-19 |
Alignment of single and multi-mode optical fibers using piezoelectric actuators
Grant 10,649,158 - Swan , et al. | 2020-05-12 |
Piezoelectric package-integrated motor
Grant 10,644,616 - Liff , et al. | 2020-05-05 |
Piezoelectric package-integrated temperature sensing devices
Grant 10,634,566 - Eid , et al. | 2020-04-28 |
Through-mold structures
Grant 10,636,716 - Oster , et al. | 2020-04-28 |
Improving mechanical and thermal reliability in varying form factors
Grant 10,629,557 - Strong , et al. | 2020-04-21 |
Microelectronic Assemblies Having An Integrated Voltage Regulator Chiplet
App 20200105653 - Elsherbini; Adel A. ; et al. | 2020-04-02 |
Electronic Package With Stud Bump Electrical Connections
App 20200105701 - Li; Zhaozhi ; et al. | 2020-04-02 |
Dies With Integrated Voltage Regulators
App 20200098676 - Elsherbini; Adel A. ; et al. | 2020-03-26 |
Microelectronic Assemblies Having Magnetic Core Inductors
App 20200098621 - Bharath; Krishna ; et al. | 2020-03-26 |
Microelectronic Assemblies Having Non-rectilinear Arrangements
App 20200098692 - Liff; Shawna M. ; et al. | 2020-03-26 |
Semiconductor Package Or Structure With Dual-sided Interposers And Memory
App 20200098724 - Liff; Shawna M. ; et al. | 2020-03-26 |
Semiconductor Package Or Semiconductor Package Structure With Dual-sided Interposer And Memory
App 20200098725 - Liff; Shawna M. ; et al. | 2020-03-26 |
Microelectronic Assemblies
App 20200091128 - Elsherbini; Adel A. ; et al. | 2020-03-19 |
Actuatable and adaptable metamaterials integrated in package
Grant 10,594,029 - Liff , et al. | 2020-03-17 |
Serializer-deserializer Die For High Speed Signal Interconnect
App 20200075521 - Elsherbini; Adel A. ; et al. | 2020-03-05 |
Piezoelectrically Actuated Mirrors For Optical Communications
App 20200064555 - OSTER; Sasha N. ; et al. | 2020-02-27 |
Fast-lane Routing For Multi-chip Packages
App 20200067816 - Elsherbini; Adel A. ; et al. | 2020-02-27 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package
Grant 10,573,608 - Dogiamis , et al. Feb | 2020-02-25 |
Waveguide connector with tapered slot launcher
Grant 10,566,672 - Elsherbini , et al. Feb | 2020-02-18 |
Package Architecture For Antenna Arrays
App 20200036095 - ELSHERBINI; Adel A. ; et al. | 2020-01-30 |
Microelectronic Assemblies
App 20190385977 - Elsherbini; Adel A. ; et al. | 2019-12-19 |
Multi-packaging For Single-socketing
App 20190385979 - Rosch; Jonathan L. ; et al. | 2019-12-19 |
Variable ball height on ball grid array packages by solder paste transfer
Grant 10,504,863 - Li , et al. Dec | 2019-12-10 |
Microelectronic Structures Having Multiple Microelectronic Devices Connected With A Microelectronic Bridge Embedded In A Microel
App 20190355666 - Li; Eric J. ; et al. | 2019-11-21 |
Solder in cavity interconnection structures
Grant 10,468,367 - Hu , et al. No | 2019-11-05 |
Coreless Package Architecture For Multi-chip Opto-electronics
App 20190317285 - LIFF; Shawna M. ; et al. | 2019-10-17 |
Complex cavity formation in molded packaging structures
Grant 10,446,461 - Oster , et al. Oc | 2019-10-15 |
Microelectronic Assemblies Having Substrate-integrated Perovskite Layers
App 20190311980 - Eid; Feras ; et al. | 2019-10-10 |
Improving Mechanical And Thermal Reliability In Varying Form Factors
App 20190312001 - Strong; Veronica A. ; et al. | 2019-10-10 |
Active Venting Garment Using Piezoelectric Elements
App 20190297975 - ALEKSOV; Aleksandar ; et al. | 2019-10-03 |
Thermal management of molded packages
Grant 10,424,559 - Eid , et al. Sept | 2019-09-24 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
Grant 10,418,329 - Li , et al. Sept | 2019-09-17 |
Flexible Packaging For A Wearable Electronic Device
App 20190281717 - Aleksov; Aleksandar ; et al. | 2019-09-12 |
Semiconductor Packaging With High Density Interconnects
App 20190259705 - Elsherbini; Adel A. ; et al. | 2019-08-22 |
Piezoelectric Devices Fabricated In Packaging Build-up Layers
App 20190252597 - EID; Feras ; et al. | 2019-08-15 |
Quantum computing assemblies
Grant 10,380,496 - Elsherbini , et al. A | 2019-08-13 |
Assembly architecture employing organic support for compact and improved assembly throughput
Grant 10,368,439 - Elsherbini , et al. July 30, 2 | 2019-07-30 |
Stacked Die Architectures With Improved Thermal Management
App 20190214328 - Eid; Feras ; et al. | 2019-07-11 |
Semiconductor Package Having Integrated Stiffener Region
App 20190214338 - GOH; Eng Huat ; et al. | 2019-07-11 |
Stress Isolation For Silicon Photonic Applications
App 20190206782 - KUMAR; Siddarth ; et al. | 2019-07-04 |
Co-extrusion Of Multi-material Sets For Millimeter-wave Waveguide Fabrication
App 20190207290 - Rawlings; Brandon M. ; et al. | 2019-07-04 |
Methods For Conductively Coating Millimeter Waveguides
App 20190198961 - Aleksov; Aleksandar ; et al. | 2019-06-27 |
Waveguide Topologies For Rack Scale Architecture Servers
App 20190198965 - Kamgaing; Telesphor ; et al. | 2019-06-27 |
Robust Mold Integrated Substrate
App 20190189567 - Yao; Jimin ; et al. | 2019-06-20 |
Shielded interconnects
Grant 10,319,896 - Falcon , et al. | 2019-06-11 |
Millimeter-wave Holey Waveguides And Multi-material Waveguides
App 20190173149 - Elsherbini; Adel A. ; et al. | 2019-06-06 |
Piezoelectric Package-integrated Pressure Sensing Devices
App 20190165250 - SOUNART; Thomas L. ; et al. | 2019-05-30 |
Piezoelectric devices fabricated in packaging build-up layers
Grant 10,305,019 - Eid , et al. | 2019-05-28 |
Thermocompression bonding using plasma gas
Grant 10,297,567 - Lu , et al. | 2019-05-21 |
Piezoelectric Package-integrated Acoustic Transducer Devices
App 20190141456 - DOGIAMIS; Georgios C. ; et al. | 2019-05-09 |
Piezoelectric Devices Fabricated In Packaging Build-up Layers
App 20190140158 - Eid; Feras ; et al. | 2019-05-09 |
Alignment Of Single And Multi-mode Optical Fibers Using Piezoelectric Actuators
App 20190121038 - SWAN; Johanna M. ; et al. | 2019-04-25 |
Piezoelectric Package-integrated Current Sensing Devices
App 20190113545 - DOGIAMIS; Georgios C. ; et al. | 2019-04-18 |
Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards
Grant 10,263,312 - Oster , et al. | 2019-04-16 |
Waveguide connector with slot launcher
Grant 10,256,521 - Elsherbini , et al. | 2019-04-09 |
Variable ball height on ball grid array packages by solder paste transfer
Grant 10,256,205 - Li , et al. | 2019-04-09 |
Dielectric waveguide bundle including a supporting feature for connecting first and second server boards
Grant 10,249,925 - Dogiamis , et al. | 2019-04-02 |
Variable Ball Height On Ball Grid Array Packages By Solder Paste Transfer
App 20190096838 - Li; Eric J. ; et al. | 2019-03-28 |
Apparatus for interconnecting circuitry
Grant 10,212,827 - Browne , et al. Feb | 2019-02-19 |
Quantum Computing Assemblies
App 20190042964 - Elsherbini; Adel A. ; et al. | 2019-02-07 |
Adaptable Displays Using Piezoelectric Actuators
App 20190033576 - OSTER; Sasha N. ; et al. | 2019-01-31 |
Process For Creating Piezo-electric Mirrors In Package
App 20190033575 - OSTER; Sasha N. ; et al. | 2019-01-31 |
Package-integrated Piezoelectric Optical Grating Switch Array
App 20190033500 - SOUNART; Thomas L. ; et al. | 2019-01-31 |
Inorganic Piezoelectric Materials Formed On Fibers & Applications Thereof
App 20190032272 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Strain Sensitive Piezoelectric System With Optical Indicator
App 20190036004 - EID; Feras ; et al. | 2019-01-31 |
Piezoelectric Driven Switches Integrated In Organic, Flexible Displays
App 20190036002 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Package Integrated Security Features
App 20190036774 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Piezo Actuators For Optical Beam Steering Applications
App 20190025573 - ALEKSOV; Aleksandar ; et al. | 2019-01-24 |
Shielded Interconnects
App 20190006572 - Falcon; Javier A. ; et al. | 2019-01-03 |
Magnetic Particle Embedded Flex Or Printed Flex For Magnetic Tray Or Electro-magnetic Carrier
App 20180376591 - TOMITA; Yoshihiro ; et al. | 2018-12-27 |
Electronic Assembly That Includes A Bridge
App 20180358296 - LI; Eric J. ; et al. | 2018-12-13 |
Ultra Small Molded Module Integrated With Die By Module-on-wafer Assembly
App 20180337135 - YOSHIHIRO; Tomita ; et al. | 2018-11-22 |
Microelectronic Structures Having Multiple Microelectronic Devices Connected With A Microelectronic Bridge Embedded In A Microelectronic Substrate
App 20180337129 - Li; Eric J. ; et al. | 2018-11-22 |
Microelectronic Devices Designed With High Frequency Communication Devices Including Compound Semiconductor Devices Integrated On A Die Fabric On Package
App 20180331051 - DOGIAMIS; Georgios C. ; et al. | 2018-11-15 |
Magnetic nanocomposite materials and passive components formed therewith
Grant 10,122,089 - Nair , et al. November 6, 2 | 2018-11-06 |
Package integrated security features
Grant 10,116,504 - Liff , et al. October 30, 2 | 2018-10-30 |
Through-mold Structures
App 20180277458 - Oster; Sasha ; et al. | 2018-09-27 |
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier
Grant 10,070,520 - Tomita , et al. September 4, 2 | 2018-09-04 |
Integrated circuit package with embedded bridge
Grant 10,068,852 - Mahajan , et al. September 4, 2 | 2018-09-04 |
Microelectronic Devices Designed With Compound Semiconductor Devices And Integrated On An Inter Die Fabric
App 20180240762 - KAMGAING; Telesphor ; et al. | 2018-08-23 |
Optical I/O system using planar light-wave integrated circuit
Grant 10,054,737 - Kobrinsky , et al. August 21, 2 | 2018-08-21 |
Scalable Embedded Silicon Bridge Via Pillars In Lithographically Defined Vias, And Methods Of Making Same
App 20180182707 - Elsherbini; Adel A. ; et al. | 2018-06-28 |
Thermal Management of Molded Packages
App 20180182736 - Eid; Feras ; et al. | 2018-06-28 |
Solder In Cavity Interconnection Structures
App 20180151529 - Hu; Chuan ; et al. | 2018-05-31 |
Actuatable And Adaptable Metamaterials Integrated In Package
App 20180097284 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Complex Cavity Formation In Molded Packaging Structures
App 20180096862 - Oster; Sasha N. ; et al. | 2018-04-05 |
Piezoelectric Package-integrated Motor
App 20180097458 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Waveguide Bundle Fabrication In Suspended Media Targeting Bend-induced Strain Relief
App 20180097269 - Dogiamis; Georgios C. ; et al. | 2018-04-05 |
Fabrication Process For Ribbon Bundled Millimeter-waveguide
App 20180097268 - Oster; Sasha ; et al. | 2018-04-05 |
Package Integrated Security Features
App 20180097693 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Waveguide Connector With Tapered Slot Launcher
App 20180090848 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Waveguide Connector With Slot Launcher
App 20180090803 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Variable Ball Height On Ball Grid Array Packages By Solder Paste Transfer
App 20180068969 - Li; Eric J. ; et al. | 2018-03-08 |
Piezoelectric package-integrated synthetic jet devices
Grant 9,902,152 - Eid , et al. February 27, 2 | 2018-02-27 |
Piezoelectric Package-integrated Chemical Species-sensitive Resonant Devices
App 20180003677 - OSTER; Sasha N. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Synthetic Jet Devices
App 20180001640 - EID; Feras ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Temperature Sensing Devices
App 20180003569 - EID; Feras ; et al. | 2018-01-04 |
Device, Method And System For Forming A Soldered Connection Between Circuit Components
App 20180007796 - BROWNE; John J. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Surface Acoustic Wave Sensing Devices
App 20180004357 - ELSHERBINI; Adel A. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Sensing Devices
App 20180006208 - EID; Feras ; et al. | 2018-01-04 |
Variable ball height on ball grid array packages by solder paste transfer
Grant 9,842,818 - Li , et al. December 12, 2 | 2017-12-12 |
Complex cavity formation in molded packaging structures
Grant 9,824,901 - Oster , et al. November 21, 2 | 2017-11-21 |
Flexible embedded interconnects
Grant 9,822,470 - Manipatruni , et al. November 21, 2 | 2017-11-21 |
Structure To Make Supercapacitor
App 20170316880 - Doyle; Brian S. ; et al. | 2017-11-02 |
Integrated Circuit Package With Embedded Bridge
App 20170301625 - Mahajan; Ravindranath V. ; et al. | 2017-10-19 |
Complex Cavity Formation In Molded Packaging Structures
App 20170287736 - Oster; Sasha ; et al. | 2017-10-05 |
Variable Ball Height On Ball Grid Array Packages By Solder Paste Transfer
App 20170278816 - Li; Eric J. ; et al. | 2017-09-28 |
Modular Squeegee Head Apparatus For Printing Materials
App 20170266948 - Heppner; Joshua D. ; et al. | 2017-09-21 |
Integrated circuit package structures
Grant 9,721,880 - Yao , et al. August 1, 2 | 2017-08-01 |
Integrated circuit package with embedded bridge
Grant 9,716,067 - Mahajan , et al. July 25, 2 | 2017-07-25 |
Structure to make supercapacitor
Grant 9,711,284 - Doyle , et al. July 18, 2 | 2017-07-18 |
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier
App 20170188455 - Tomita; Yoshihiro ; et al. | 2017-06-29 |
Through-mold Structures
App 20170178990 - Oster; Sasha ; et al. | 2017-06-22 |
Thermocompression Bonding Using Plasma Gas
App 20170179070 - Lu; Donglai David ; et al. | 2017-06-22 |
Picture frame stiffeners for microelectronic packages
Grant 9,685,388 - Tomita , et al. June 20, 2 | 2017-06-20 |
Integrated Circuit Package Structures
App 20170170105 - Yao; Jimin ; et al. | 2017-06-15 |
Optical I/o System Using Planar Light-wave Integrated Circuit
App 20170131469 - Kobrinsky; Mauro J. ; et al. | 2017-05-11 |
Picture Frame Stiffeners For Microelectronic Packages
App 20170040238 - Tomita; Yoshihiro ; et al. | 2017-02-09 |
Solder in cavity interconnection structures
Grant 9,530,747 - Hu , et al. December 27, 2 | 2016-12-27 |
Thermal matched composite die
Grant 9,520,378 - Aleksov , et al. December 13, 2 | 2016-12-13 |
Assembly Architecture Employing Organic Support For Compact And Improved Assembly Throughput
App 20160360618 - ELSHERBINI; Adel A. ; et al. | 2016-12-08 |
Optical I/O system using planar light-wave integrated circuit
Grant 9,507,086 - Kobrinsky , et al. November 29, 2 | 2016-11-29 |
Picture frame stiffeners for microelectronic packages
Grant 9,502,368 - Tomita , et al. November 22, 2 | 2016-11-22 |
Magnetic Nanocomposite Materials And Passive Components Formed Therewith
App 20160322707 - Nair; Vijay K. ; et al. | 2016-11-03 |
Method apparatus and material for radio frequency passives and antennas
Grant 9,461,355 - Nair , et al. October 4, 2 | 2016-10-04 |
Optical connection techniques and configurations
Grant 9,435,967 - Braunisch , et al. September 6, 2 | 2016-09-06 |
Thermal management in packaged VCSELs
Grant 9,391,427 - Eid , et al. July 12, 2 | 2016-07-12 |
Picture Frame Stiffeners For Microelectronic Packages
App 20160172323 - TOMITA; YOSHIHIRO ; et al. | 2016-06-16 |
Integrated Circuit Package With Embedded Bridge
App 20160155705 - Mahajan; Ravindranath V. ; et al. | 2016-06-02 |
Solder In Cavity Interconnection Structures
App 20160148892 - Hu; Chuan ; et al. | 2016-05-26 |
Optical Connection Techniques And Configurations
App 20160124166 - Braunisch; Henning ; et al. | 2016-05-05 |
Optical connection techniques and configurations
Grant 9,310,553 - Braunisch , et al. April 12, 2 | 2016-04-12 |
Integrated circuit package with embedded bridge
Grant 9,275,955 - Mahajan , et al. March 1, 2 | 2016-03-01 |
Solder In Cavity Interconnection Structures
App 20150187727 - Hu; Chuan ; et al. | 2015-07-02 |
Integrated Circuit Package With Embedded Bridge
App 20150171015 - Mahajan; Ravindranath V. ; et al. | 2015-06-18 |
Solder in cavity interconnection structures
Grant 9,006,890 - Hu , et al. April 14, 2 | 2015-04-14 |
Solder in cavity interconnection structures
Grant 8,936,967 - Hu , et al. January 20, 2 | 2015-01-20 |
Thermal Management In Packaged Vcsels
App 20140314111 - Eid; Feras ; et al. | 2014-10-23 |
Method Apparatus and Material for Radio Frequency Passives and Antennas
App 20140293529 - Nair; Vijay K. ; et al. | 2014-10-02 |
Optical I/o System Using Planar Light-wave Integrated Circuit
App 20140203175 - Kobrinsky; Mauro J. ; et al. | 2014-07-24 |
Thermal Matched Composite Die
App 20140177158 - Aleksov; Aleksandar ; et al. | 2014-06-26 |
Sensing And Responsive Fabric
App 20140180624 - Nikonov; Dmitri E. ; et al. | 2014-06-26 |
Electrically Functional Fabric For Flexible Electronics
App 20140170920 - Manipatruni; Sasikanth ; et al. | 2014-06-19 |
Flexible Embedded Interconnects
App 20140170919 - Manipatruni; Sasikanth ; et al. | 2014-06-19 |
Structure To Make Supercapacitor
App 20140160628 - Doyle; Brian S. ; et al. | 2014-06-12 |
Poling Structures And Methods For Photonic Devices Employing Electro-optical Polymers
App 20140086523 - BLOCK; Bruce A. ; et al. | 2014-03-27 |
Optical Connection Techniques And Configurations
App 20130272649 - Braunisch; Henning ; et al. | 2013-10-17 |
Solder In Cavity Interconnection Structures
App 20130128484 - Hu; Chaun ; et al. | 2013-05-23 |
Solder In Cavity Interconnection Structures
App 20120241965 - Hu; Chuan ; et al. | 2012-09-27 |
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