| Patent | Date |
|---|
RF front end module including hybrid filter and active circuits in a single package
Grant 11,456,721 - Eid , et al. September 27, 2 | 2022-09-27 |
Microelectronic Devices Designed With Compound Semiconductor Devices And Integrated On An Inter Die Fabric
App 20220246554 - KAMGAING; Telesphor ; et al. | 2022-08-04 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric
Grant 11,387,200 - Dogiamis , et al. July 12, 2 | 2022-07-12 |
Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric
Grant 11,367,708 - Nair , et al. June 21, 2 | 2022-06-21 |
Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric
Grant 11,335,651 - Kamgaing , et al. May 17, 2 | 2022-05-17 |
Hybrid filters and packages therefor
Grant 11,283,427 - Kamgaing , et al. March 22, 2 | 2022-03-22 |
Die with embedded communication cavity
Grant 11,239,186 - Raorane , et al. February 1, 2 | 2022-02-01 |
Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies
Grant 11,206,008 - Dogiamis , et al. December 21, 2 | 2021-12-21 |
Die With Embedded Communication Cavity
App 20210391638 - Nair; Vijay K. ; et al. | 2021-12-16 |
High frequency waveguide structure
Grant 11,195,806 - Nair , et al. December 7, 2 | 2021-12-07 |
Semiconductor package with electromagnetic interference shielding using metal layers and vias
Grant 11,189,573 - Nair , et al. November 30, 2 | 2021-11-30 |
Die with embedded communication cavity
Grant 11,128,029 - Nair , et al. September 21, 2 | 2021-09-21 |
Substrate dielectric waveguides in semiconductor packages
Grant 11,037,892 - Nair , et al. June 15, 2 | 2021-06-15 |
Piezoelectric package-integrated film bulk acoustic resonator devices
Grant 10,903,818 - Nair , et al. January 26, 2 | 2021-01-26 |
Piezoelectric package-integrated contour mode filter devices
Grant 10,897,238 - Eid , et al. January 19, 2 | 2021-01-19 |
Microelectronic devices designed with integrated antennas on a substrate
Grant 10,887,439 - Kamgaing , et al. January 5, 2 | 2021-01-05 |
Microelectronic Devices Designed With Integrated Antennas On A Substrate
App 20200412858 - Dogiamis; Georgios ; et al. | 2020-12-31 |
Single layer low cost wafer level packaging for SFF SiP
Grant 10,867,961 - Hu , et al. December 15, 2 | 2020-12-15 |
Hybrid Filters And Packages Therefor
App 20200287520 - KAMGAING; Telesphor ; et al. | 2020-09-10 |
Hybrid Filter Architecture With Integrated Passives, Acoustic Wave Resonators And Hermetically Sealed Cavities Between Two Reson
App 20200259478 - A1 | 2020-08-13 |
Rf Front End Module Including Hybrid Filter And Active Circuits In A Single Package
App 20200235716 - EID; Feras ; et al. | 2020-07-23 |
Microelectronic Devices Designed With Integrated Antenna On A Substrate
App 20200236205 - Kamgaing; Telesphor ; et al. | 2020-07-23 |
Microelectronic Devices With High Frequency Communication Modules Having Compound Semiconductor Devices Integrated On A Package
App 20200227366 - DOGIAMIS; Georgios C. ; et al. | 2020-07-16 |
Front End System Having An Acoustic Wave Resonator (awr) On An Interposer Substrate
App 20200219861 - KAMGAING; Telesphor ; et al. | 2020-07-09 |
Microelectronic Devices Designed With Efficient Partitioning Of High Frequency Communication Devices Integrated On A Package Fab
App 20200219830 - NAIR; Vijay K. ; et al. | 2020-07-09 |
Architectures And Methods Of Fabricating 3d Stacked Packages
App 20200126921 - Nair; Vijay K. ; et al. | 2020-04-23 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric
Grant 10,629,551 - Dogiamis , et al. | 2020-04-21 |
Enclosure For An Electronic Component
App 20200098655 - Nair; Vijay K. ; et al. | 2020-03-26 |
Piezoelectric package-integrated delay lines
Grant 10,594,294 - Elsherbini , et al. | 2020-03-17 |
Electromagnetic Interference Shielding For Semiconductor Packages Using Bond Wires
App 20200075501 - RAORANE; Digvijay A. ; et al. | 2020-03-05 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package
Grant 10,573,608 - Dogiamis , et al. Feb | 2020-02-25 |
Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric
Grant 10,546,835 - Nair , et al. Ja | 2020-01-28 |
Die With Embedded Communication Cavity
App 20200021007 - Nair; Vijay K. ; et al. | 2020-01-16 |
Multi-layer package
Grant 10,535,634 - Nair , et al. Ja | 2020-01-14 |
Three-dimensional small form factor system in package architecture
Grant 10,483,250 - Nair , et al. Nov | 2019-11-19 |
Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration
Grant 10,475,750 - Nair , et al. Nov | 2019-11-12 |
Microelectronic devices designed with high frequency communication modules having steerable beamforming capability
Grant 10,439,671 - Kamgaing , et al. O | 2019-10-08 |
Piezoelectric package-integrated crystal devices
Grant 10,432,167 - Elsherbini , et al. O | 2019-10-01 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package
Grant 10,410,983 - Kamgaing , et al. Sept | 2019-09-10 |
Die With Embedded Communication Cavity
App 20190267336 - Raorane; Digvijay Ashokkumar ; et al. | 2019-08-29 |
High Frequency Waveguide Structure
App 20190267337 - NAIR; Vijay K. ; et al. | 2019-08-29 |
Tunable radio frequency systems using piezoelectric package-integrated switching devices
Grant 10,291,283 - Kamgaing , et al. | 2019-05-14 |
Systems, Methods, And Apparatuses For Implementing An Organic Stiffener With An Emi Shield For Rf Integration
App 20190051615 - NAIR; Vijay K. ; et al. | 2019-02-14 |
Semiconductor Package With Electromagnetic Interference Shielding Using Metal Layers And Vias
App 20190019764 - NAIR; Vijay K. ; et al. | 2019-01-17 |
Microelectronic Devices Designed With Efficient Partitioning Of High Frequency Communication Devices Integrated On A Package Fabric
App 20180350772 - NAIR; Vijay K. ; et al. | 2018-12-06 |
Method of embedding WLCSP components in E-WLB and E-PLB
Grant 10,147,710 - Nair , et al. De | 2018-12-04 |
Microelectronic Devices With High Frequency Communication Modules Having Compound Semiconductor Devices Integrated On A Package Fabric
App 20180342472 - DOGIAMIS; Georgios C. ; et al. | 2018-11-29 |
Microelectronic Devices Designed With High Frequency Communication Devices Including Compound Semiconductor Devices Integrated On A Die Fabric On Package
App 20180331051 - DOGIAMIS; Georgios C. ; et al. | 2018-11-15 |
Microelectronic Devices Designed With Integrated Antennas On A Substrate
App 20180332151 - KAMGAING; Telesphor ; et al. | 2018-11-15 |
Microelectronic Devices Designed With High Frequency Communication Devices Including Compound Semiconductor Devices Integrated On An Inter Die Fabric On Package
App 20180323159 - KAMGAING; Telesphor ; et al. | 2018-11-08 |
Magnetic nanocomposite materials and passive components formed therewith
Grant 10,122,089 - Nair , et al. November 6, 2 | 2018-11-06 |
Microelectronic Devices Designed With High Frequency Communication Modules Having Steerable Beamforming Capability
App 20180316383 - KAMGAING; Telesphor ; et al. | 2018-11-01 |
Microelectronic Devices With Embedded Substrate Cavities For Device To Device Communications
App 20180310399 - NAIR; Vijay K. ; et al. | 2018-10-25 |
Three-dimensional Small Form Factor System In Package Architecture
App 20180286840 - NAIR; Vijay K. ; et al. | 2018-10-04 |
Method Of Embedding Wlcsp Components In E-wlb And E-plb
App 20180269190 - NAIR; Vijay K. ; et al. | 2018-09-20 |
Microelectronic Devices Designed With Compound Semiconductor Devices And Integrated On An Inter Die Fabric
App 20180240762 - KAMGAING; Telesphor ; et al. | 2018-08-23 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 10,032,052 - Elsherbini , et al. July 24, 2 | 2018-07-24 |
Method of embedding WLCSP components in e-WLB and e-PLB
Grant 9,991,239 - Nair , et al. June 5, 2 | 2018-06-05 |
Piezoelectric Package-integrated Contour Mode Filter Devices
App 20170288642 - EID; Feras ; et al. | 2017-10-05 |
Tunable Radio Frequency Systems Using Piezoelectric Package-integrated Switching Devices
App 20170288724 - KAMGAING; Telesphor ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines For Radio Frequency Identification Tags
App 20170286731 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Film Bulk Acoustic Resonator Devices
App 20170285695 - NAIR; Vijay K. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Switching Devices
App 20170283249 - DOGIAMIS; Georgios C. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines
App 20170288639 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Crystal Devices
App 20170288635 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Multi-layer Package
App 20170207170 - NAIR; Vijay K. ; et al. | 2017-07-20 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 9,647,636 - Elsherbini , et al. May 9, 2 | 2017-05-09 |
Magnetic Nanocomposite Materials And Passive Components Formed Therewith
App 20160322707 - Nair; Vijay K. ; et al. | 2016-11-03 |
Method apparatus and material for radio frequency passives and antennas
Grant 9,461,355 - Nair , et al. October 4, 2 | 2016-10-04 |
Method Of Embedding Wlcsp Components In E-wlb And E-plb
App 20160276325 - NAIR; Vijay K. ; et al. | 2016-09-22 |
Electronic Package And Method Of Forming An Electronic Package
App 20150279824 - Nair; Vijay K. ; et al. | 2015-10-01 |
Ultra slim RF package for ultrabooks and smart phones
Grant 8,890,628 - Nair , et al. November 18, 2 | 2014-11-18 |
System-in-package using embedded-die coreless substrates, and processes of forming same
Grant 8,891,246 - Guzek , et al. November 18, 2 | 2014-11-18 |
Method Apparatus and Material for Radio Frequency Passives and Antennas
App 20140293529 - Nair; Vijay K. ; et al. | 2014-10-02 |
System In Package With Embedded Rf Die In Coreless Substrate
App 20140091440 - NAIR; Vijay K. ; et al. | 2014-04-03 |
Ultra Slim Rf Package For Ultrabooks And Smart Phones
App 20140062607 - Nair; Vijay K. ; et al. | 2014-03-06 |
Multi-band tunable frequency reconfigurable antennas using higher order resonances
Grant 8,369,796 - Pan , et al. February 5, 2 | 2013-02-05 |
Multi-band highly isolated planar antennas integrated with front-end modules for mobile applications
Grant 8,077,095 - Suh , et al. December 13, 2 | 2011-12-13 |
System-in-package Using Embedded-die Coreless Substrates, And Processes Of Forming Same
App 20110228464 - Guzek; John S. ; et al. | 2011-09-22 |
Multi-band Highly Isolated Planar Antennas Integrated With Front-end Modules For Mobile Applications
App 20080238804 - Suh; Seong-youp ; et al. | 2008-10-02 |
Multi-band tunable frequency reconfigurable antennas using higher order resonances
App 20080150830 - Pan; Helen K. ; et al. | 2008-06-26 |
Signal interface for a wireless device
App 20060105720 - Nair; Vijay K. | 2006-05-18 |
System and method for microwave cell lysing of small samples
Grant 6,623,945 - Nair , et al. September 23, 2 | 2003-09-23 |
Electronically tuned active antenna apparatus
Grant 6,509,875 - Nair , et al. January 21, 2 | 2003-01-21 |
Refractory gate heterostructure field effect transistor
Grant 5,739,557 - O'Neil, II , et al. April 14, 1 | 1998-04-14 |
Bias circuit for depletion mode field effect transistors
Grant 5,506,544 - Staudinger , et al. April 9, 1 | 1996-04-09 |
Method for forming a linear heterojunction field effect transistor
Grant 5,482,875 - Vaitkus , et al. January 9, 1 | 1996-01-09 |
Frequency mixing circuit with impedance transforming power combiner
Grant 5,325,000 - Birkeland , et al. June 28, 1 | 1994-06-28 |
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