| Patent | Date |
|---|
Ultra-thin, hyper-density semiconductor packages
Grant 11,430,724 - Mallik , et al. August 30, 2 | 2022-08-30 |
Silicon Groove Architectures And Manufacturing Processes For Passive Alignment In A Photonics Die
App 20220196940 - KARHADE; Omkar ; et al. | 2022-06-23 |
Patch On Interposer Architecture For Low Cost Optical Co-packaging
App 20220196943 - LI; Xiaoqian ; et al. | 2022-06-23 |
Novel Connector Designs For Photonics Packaging Integration
App 20220196935 - LI; Xiaoqian ; et al. | 2022-06-23 |
Micro-lens Array Optically Coupled With A Photonics Die
App 20220196931 - LI; Xiaoqian ; et al. | 2022-06-23 |
Optical Multichip Package With Multiple System-on-chip Dies
App 20220199600 - ZHANG; Zhichao ; et al. | 2022-06-23 |
Faraday Rotator Interconnect As A Through-via Configuration In A Patch Architecture
App 20220187548 - MARIN; Brandon C. ; et al. | 2022-06-16 |
High Bandwidth Optical Interconnection Architectures
App 20220155539 - PIETAMBARAM; Srinivas V. ; et al. | 2022-05-19 |
Dummy Die Structures Of A Packaged Integrated Circuit Device
App 20220102242 - Modi; Mitul ; et al. | 2022-03-31 |
Dummy Die In A Recessed Mold Structure Of A Packaged Integrated Circuit Device
App 20220102231 - Modi; Mitul ; et al. | 2022-03-31 |
Thermally coupled package-on-package semiconductor packages
Grant 11,222,877 - Karhade , et al. January 11, 2 | 2022-01-11 |
Optical Fiber Connector Attach To Die In Wafer Or Panel Level To Enable Known Good Die
App 20210405311 - LI; Xiaoqian ; et al. | 2021-12-30 |
Electronic Package With Stud Bump Electrical Connections
App 20210366862 - Li; Zhaozhi ; et al. | 2021-11-25 |
Open Cavity Bridge Power Delivery Architectures And Processes
App 20210305133 - KARHADE; Omkar ; et al. | 2021-09-30 |
Open Cavity Bridge Co-planar Placement Architectures And Processes
App 20210305132 - KARHADE; Omkar ; et al. | 2021-09-30 |
Electronic package with stud bump electrical connections
Grant 11,127,706 - Li , et al. September 21, 2 | 2021-09-21 |
Package on package thermal transfer systems and methods
Grant 11,056,466 - Karhade , et al. July 6, 2 | 2021-07-06 |
Wideband Multi-pin Edge Connector For Radio Frequency Front End Module
App 20200412041 - Jiang; Zhenguo ; et al. | 2020-12-31 |
Crystalline Carbon Heat Spreading Materials For Ic Die Hot Spot Reduction
App 20200273768 - Karhade; Omkar ; et al. | 2020-08-27 |
Coupled Cooling Fins In Ultra-small Systems
App 20200273772 - Uppal; Aastha ; et al. | 2020-08-27 |
Ic Die Package Thermal Spreader And Emi Shield Comprising Graphite
App 20200273811 - Mallik; Debendra ; et al. | 2020-08-27 |
Ultra-thin, Hyper-density Semiconductor Packages
App 20200273784 - MALLIK; Debendra ; et al. | 2020-08-27 |
Active Package Cooling Structures Using Molded Substrate Packaging Technology
App 20200273775 - Karhade; Omkar ; et al. | 2020-08-27 |
In-package 3d Antenna
App 20200243956 - JIANG; ZHENGUO ; et al. | 2020-07-30 |
Thermal Management Solutions For Integrated Circuit Packages
App 20200227332 - Singh; Kumar Abhishek ; et al. | 2020-07-16 |
Liquid Thermal Interface Material In Electronic Packaging
App 20200203254 - Dhane; Kedar ; et al. | 2020-06-25 |
Electronic Package With Stud Bump Electrical Connections
App 20200105701 - Li; Zhaozhi ; et al. | 2020-04-02 |
Stacked Wire-bond Dice Attached By Pillars Or Bumps Above A Flip-chip Die On A Semiconductor Package Substrate
App 20200098727 - Mallik; Debendra ; et al. | 2020-03-26 |
5g Mmwave Antenna Architecture With Thermal Management
App 20200076046 - KARHADE; Omkar ; et al. | 2020-03-05 |
Wirebond And Leadframe Magnetic Inductors
App 20200066659 - Lambert; William J. ; et al. | 2020-02-27 |
Fine Pitch Z Connections For Flip Chip Memory Architectures With Interposer
App 20200051956 - KARHADE; Omkar ; et al. | 2020-02-13 |
Package On Package Thermal Transfer Systems And Methods
App 20190385983 - KARHADE; OMKAR ; et al. | 2019-12-19 |
Electronic package that includes multiple supports
Grant 10,461,003 - Karhade , et al. Oc | 2019-10-29 |
Package on package thermal transfer systems and methods
Grant 10,438,930 - Karhade , et al. O | 2019-10-08 |
Substrate Architecture For Solder Joint Reliabilty In Microelectronic Package Structures And Methods Of Forming The Same
App 20190104610 - Nickerson; Robert ; et al. | 2019-04-04 |
Thermally Coupled Package-on-package Semiconductor
App 20190103385 - KARHADE; OMKAR ; et al. | 2019-04-04 |
Rigid Adhesive Package-on-package Semiconductors
App 20190006342 - KARHADE; OMKAR ; et al. | 2019-01-03 |
Package On Package Thermal Transfer Systems And Methods
App 20190006319 - KARHADE; OMKAR ; et al. | 2019-01-03 |
Electronic Assembly That Includes A Bridge
App 20180358296 - LI; Eric J. ; et al. | 2018-12-13 |
Electronic Package That Includes Multiple Supports
App 20180358274 - Karhade; Omkar ; et al. | 2018-12-13 |
Flexible Electronic Assembly Method
App 20180263117 - Oster; Sasha N. ; et al. | 2018-09-13 |
Integrated circuit assembly that includes stacked dice
Grant 9,991,243 - Karhade , et al. June 5, 2 | 2018-06-05 |
Flexible electronic assembly method
Grant 9,820,384 - Oster , et al. November 14, 2 | 2017-11-14 |
Integrated Circuit Assembly That Includes Stacked Dice
App 20170323874 - Karhade; Omkar ; et al. | 2017-11-09 |
Electronic package design that facilitates shipping the electronic package
Grant 9,795,038 - Karhade , et al. October 17, 2 | 2017-10-17 |
Methods for high precision microelectronic die integration
Grant 9,685,421 - Aleksov , et al. June 20, 2 | 2017-06-20 |
Magnetic Material Coated Wire Inductor
App 20170169932 - Lambert; William J. ; et al. | 2017-06-15 |
Electronic Package That Includes Multiple Supports
App 20170170087 - Karhade; Omkar ; et al. | 2017-06-15 |
Electronic device with solder pads including projections
Grant 9,583,470 - Karhade , et al. February 28, 2 | 2017-02-28 |
Integrated circuit assembly that includes stacked dice
Grant 9,576,942 - Karhade , et al. February 21, 2 | 2017-02-21 |
Electronic Package Design That Facilitates Shipping The Electronic Package
App 20160095220 - Karhade; Omkar ; et al. | 2016-03-31 |
Methods For High Precision Microelectronic Die Integration
App 20150262968 - Aleksov; Aleksandar ; et al. | 2015-09-17 |
Methods for high precision microelectronic die integration
Grant 9,076,882 - Aleksov , et al. July 7, 2 | 2015-07-07 |
Solder Pad Device And Method
App 20150179622 - Karhade; Omkar ; et al. | 2015-06-25 |
Flexible Electronic Assembly And Method
App 20150163921 - Oster; Sasha ; et al. | 2015-06-11 |
Methods For High Precision Microelectronic Die Integration
App 20140357020 - Aleksov; Aleksandar ; et al. | 2014-12-04 |
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