| Patent | Date |
|---|
RF front end module including hybrid filter and active circuits in a single package
Grant 11,456,721 - Eid , et al. September 27, 2 | 2022-09-27 |
Microelectronic assemblies having magnetic core inductors
Grant 11,450,560 - Bharath , et al. September 20, 2 | 2022-09-20 |
Mmwave waveguides featuring power-over-waveguide technology for automotive applications
Grant 11,437,693 - Dogiamis , et al. September 6, 2 | 2022-09-06 |
Microelectronic assemblies with communication networks
Grant 11,437,348 - Elsherbini , et al. September 6, 2 | 2022-09-06 |
Microelectronic Assemblies
App 20220278057 - Elsherbini; Adel A. ; et al. | 2022-09-01 |
Diodes for package substrate electrostatic discharge (ESD) protection
Grant 11,424,239 - Aleksov , et al. August 23, 2 | 2022-08-23 |
Inorganic piezoelectric materials formed on fibers and applications thereof
Grant 11,421,376 - Liff , et al. August 23, 2 | 2022-08-23 |
Dies with integrated voltage regulators
Grant 11,417,593 - Elsherbini , et al. August 16, 2 | 2022-08-16 |
Microelectronic Assemblies
App 20220254754 - ELSHERBINI; Adel A. ; et al. | 2022-08-11 |
Package With A Highly Conductive Layer Deposited On Die Using Throughput Additive Deposition Prior To Tim1 Dispense
App 20220238411 - EID; Feras ; et al. | 2022-07-28 |
Microelectronic Assemblies
App 20220230964 - Liff; Shawna M. ; et al. | 2022-07-21 |
Microelectronic assemblies
Grant 11,393,777 - Elsherbini , et al. July 19, 2 | 2022-07-19 |
Microelectronic Assemblies
App 20220223578 - Elsherbini; Adel A. ; et al. | 2022-07-14 |
Microelectronic Assemblies
App 20220223561 - Liff; Shawna M. ; et al. | 2022-07-14 |
Microelectronic Assemblies
App 20220216158 - Aleksov; Aleksandar ; et al. | 2022-07-07 |
Microelectronic Assemblies With Communication Networks
App 20220216182 - Elsherbini; Adel A. ; et al. | 2022-07-07 |
Electromagnetic interference shield created on package using high throughput additive manufacturing
Grant 11,380,624 - Eid , et al. July 5, 2 | 2022-07-05 |
Shield Structures In Microelectronic Assemblies Having Direct Bonding
App 20220199546 - Elsherbini; Adel A. ; et al. | 2022-06-23 |
Microelectronic Package With Substrate-integrated Components
App 20220201843 - Dogiamis; Georgios ; et al. | 2022-06-23 |
Carrier For Microelectronic Assemblies Having Direct Bonding
App 20220199450 - Liff; Shawna M. ; et al. | 2022-06-23 |
Semiconductor package or structure with dual-sided interposers and memory
Grant 11,367,707 - Liff , et al. June 21, 2 | 2022-06-21 |
Microelectronic assemblies with communication networks
Grant 11,367,689 - Elsherbini , et al. June 21, 2 | 2022-06-21 |
Multi-filter Die
App 20220190806 - Dogiamis; Georgios ; et al. | 2022-06-16 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189839 - Eid; Feras ; et al. | 2022-06-16 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189850 - Liff; Shawna M. ; et al. | 2022-06-16 |
Hermetic Sealing Structures In Microelectronic Assemblies Having Direct Bonding
App 20220189861 - Aleksov; Aleksandar ; et al. | 2022-06-16 |
Electrostatic Discharge Protection In Integrated Circuits
App 20220181276 - Elsherbini; Adel A. ; et al. | 2022-06-09 |
Dielectric Waveguide Including A Dielectric Material With Cavities Therein Surrounded By A Conductive Coating Forming A Wall For The Cavities
App 20220173489 - Dogiamis; Georgios ; et al. | 2022-06-02 |
Microelectronic assemblies
Grant 11,348,897 - Elsherbini , et al. May 31, 2 | 2022-05-31 |
Package spark gap structure
Grant 11,348,882 - Aleksov , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,348,895 - Liff , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,348,912 - Elsherbini , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,342,320 - Elsherbini , et al. May 24, 2 | 2022-05-24 |
Microelectronic assemblies with communication networks
Grant 11,342,305 - Elsherbini , et al. May 24, 2 | 2022-05-24 |
Microelectronic assemblies
Grant 11,335,641 - Aleksov , et al. May 17, 2 | 2022-05-17 |
Microelectronic assemblies
Grant 11,335,663 - Liff , et al. May 17, 2 | 2022-05-17 |
Microelectronic assemblies
Grant 11,335,665 - Liff , et al. May 17, 2 | 2022-05-17 |
Microelectronic assemblies
Grant 11,335,642 - Liff , et al. May 17, 2 | 2022-05-17 |
Fast-lane routing for multi-chip packages
Grant 11,336,559 - Elsherbini , et al. May 17, 2 | 2022-05-17 |
Die Backend Diodes For Electrostatic Discharge (esd) Protection
App 20220149036 - Aleksov; Aleksandar ; et al. | 2022-05-12 |
Capacitor-wirebond pad structures for integrated circuit packages
Grant 11,328,986 - Aleksov , et al. May 10, 2 | 2022-05-10 |
Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities
Grant 11,329,359 - Dogiamis , et al. May 10, 2 | 2022-05-10 |
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense
Grant 11,328,978 - Eid , et al. May 10, 2 | 2022-05-10 |
Substrate integrated posts and heat spreader customization for enhanced package thermomechanics
Grant 11,328,979 - Eid , et al. May 10, 2 | 2022-05-10 |
Multi-filter die
Grant 11,316,497 - Dogiamis , et al. April 26, 2 | 2022-04-26 |
Microelectronic package with substrate-integrated components
Grant 11,310,907 - Dogiamis , et al. April 19, 2 | 2022-04-19 |
Microelectronic assemblies having substrate-integrated perovskite layers
Grant 11,302,618 - Eid , et al. April 12, 2 | 2022-04-12 |
Electrostatic discharge protection in integrated circuits
Grant 11,296,040 - Elsherbini , et al. April 5, 2 | 2022-04-05 |
TSV-less die stacking using plated pillars/through mold interconnect
Grant 11,296,052 - Meyers , et al. April 5, 2 | 2022-04-05 |
Gallium Nitride (gan) Three-dimensional Integrated Circuit Technology
App 20220102339 - THEN; Han Wui ; et al. | 2022-03-31 |
Conductive Contact Structures For Electrostatic Discharge Protection In Integrated Circuits
App 20220102270 - Elsherbini; Adel A. ; et al. | 2022-03-31 |
Gallium Nitride (gan) Three-dimensional Integrated Circuit Technology
App 20220102344 - THEN; Han Wui ; et al. | 2022-03-31 |
Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity
Grant 11,289,431 - Eid , et al. March 29, 2 | 2022-03-29 |
Package-integrated Bistable Switch For Electrostatic Discharge (esd) Protection
App 20220093531 - Eid; Feras ; et al. | 2022-03-24 |
Capacitors And Resistors At Direct Bonding Interfaces In Microelectronic Assemblies
App 20220093725 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093492 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093547 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093561 - Eid; Feras ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093517 - Aleksov; Aleksandar ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093546 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Hybrid filters and packages therefor
Grant 11,283,427 - Kamgaing , et al. March 22, 2 | 2022-03-22 |
In-package Rf Waveguides As High Bandwidth Chip-to-chip Interconnects And Methods For Using The Same
App 20220084965 - ALEKSOV; Aleksandar ; et al. | 2022-03-17 |
Die backend diodes for electrostatic discharge (ESD) protection
Grant 11,264,373 - Aleksov , et al. March 1, 2 | 2022-03-01 |
Microelectronic Assemblies With Communication Networks
App 20220051987 - Elsherbini; Adel A. ; et al. | 2022-02-17 |
Conductive contact structures for electrostatic discharge protection in integrated circuits
Grant 11,239,155 - Elsherbini , et al. February 1, 2 | 2022-02-01 |
Stacked package with electrical connections created using high throughput additive manufacturing
Grant 11,227,859 - Eid , et al. January 18, 2 | 2022-01-18 |
Package integrated security features
Grant 11,223,524 - Liff , et al. January 11, 2 | 2022-01-11 |
Techniques for die stacking and associated configurations
Grant 11,222,863 - Hua , et al. January 11, 2 | 2022-01-11 |
Package-integrated bistable switch for electrostatic discharge (ESD) protection
Grant 11,222,856 - Eid , et al. January 11, 2 | 2022-01-11 |
Microelectronic assemblies with communication networks
Grant 11,217,535 - Elsherbini , et al. January 4, 2 | 2022-01-04 |
Microelectronic Package Electrostatic Discharge (esd) Protection
App 20210410343 - Strong; Veronica Aleman ; et al. | 2021-12-30 |
In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same
Grant 11,211,345 - Aleksov , et al. December 28, 2 | 2021-12-28 |
Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies
Grant 11,206,008 - Dogiamis , et al. December 21, 2 | 2021-12-21 |
Methods For Conductively Coating Millimeter Waveguides
App 20210376437 - Aleksov; Aleksandar ; et al. | 2021-12-02 |
Stacked Die Architectures With Improved Thermal Management
App 20210375719 - Eid; Feras ; et al. | 2021-12-02 |
Electrostatic discharge protection in integrated circuits
Grant 11,189,580 - Elsherbini , et al. November 30, 2 | 2021-11-30 |
Dual-substrate waveguide filter
Grant 11,158,917 - Aleksov , et al. October 26, 2 | 2021-10-26 |
Microelectronic package electrostatic discharge (ESD) protection
Grant 11,147,197 - Strong , et al. October 12, 2 | 2021-10-12 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210296175 - Aleksov; Aleksandar ; et al. | 2021-09-23 |
Methods for conductively coating millimeter waveguides
Grant 11,095,012 - Aleksov , et al. August 17, 2 | 2021-08-17 |
Microelectronic Package With Mold-integrated Components
App 20210233856 - Dogiamis; Georgios ; et al. | 2021-07-29 |
Inorganic dies with organic interconnect layers and related structures
Grant 11,062,947 - Aleksov , et al. July 13, 2 | 2021-07-13 |
Electrostatic Discharge Protection In Integrated Circuits Using Materials With Optically Controlled Electrical Conductivity
App 20210202403 - Eid; Feras ; et al. | 2021-07-01 |
Electrostatic Discharge Protection In Integrated Circuits Using Positive Temperature Coefficient Material
App 20210202404 - Eid; Feras ; et al. | 2021-07-01 |
Techniques For Die Stacking And Associated Configurations
App 20210193613 - HUA; Fay ; et al. | 2021-06-24 |
Conductive Contact Structures For Electrostatic Discharge Protection In Integrated Circuits
App 20210193571 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210193518 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Diodes For Package Substrate Electrostatic Discharge (esd) Protection
App 20210193644 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Electrostatic Discharge Protection In Integrated Circuits
App 20210193595 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Electrostatic Discharge Protection In Integrated Circuits
App 20210193596 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Die Backend Diodes For Electrostatic Discharge (esd) Protection
App 20210193645 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Low-weight Single Mm-wave Dielectric Waveguide Interconnect Architecture In Autonomous Cars
App 20210194966 - DOGIAMIS; Georgios C. ; et al. | 2021-06-24 |
Semiconductor Packaging With High Density Interconnects
App 20210193583 - ELSHERBINI; Adel A. ; et al. | 2021-06-24 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210193519 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Package-integrated Bistable Switch For Electrostatic Discharge (esd) Protection
App 20210193597 - Eid; Feras ; et al. | 2021-06-24 |
Substrate dielectric waveguides in semiconductor packages
Grant 11,037,892 - Nair , et al. June 15, 2 | 2021-06-15 |
Multi-filter Die
App 20210175873 - Dogiamis; Georgios ; et al. | 2021-06-10 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric
Grant 11,031,666 - Elsherbini , et al. June 8, 2 | 2021-06-08 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer
Grant 11,024,933 - Rawlings , et al. June 1, 2 | 2021-06-01 |
Microelectronic Package With Substrate-integrated Components
App 20210160999 - Dogiamis; Georgios ; et al. | 2021-05-27 |
Adaptable displays using piezoelectric actuators
Grant 11,016,288 - Oster , et al. May 25, 2 | 2021-05-25 |
Microelectronic package with mold-integrated components
Grant 11,011,470 - Dogiamis , et al. May 18, 2 | 2021-05-18 |
Package Spark Gap Structure
App 20210143111 - Aleksov; Aleksandar ; et al. | 2021-05-13 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20210134726 - BRAUNISCH; Henning ; et al. | 2021-05-06 |
Monolithic die with acoustic wave resonators and active circuitry
Grant 10,998,879 - Kamgaing , et al. May 4, 2 | 2021-05-04 |
Microelectronic Package With Mold-integrated Components
App 20210125931 - Dogiamis; Georgios ; et al. | 2021-04-29 |
Microelectronic Package Electrostatic Discharge (esd) Protection
App 20210120708 - Strong; Veronica Aleman ; et al. | 2021-04-22 |
Microelectronic Assemblies With Communication Networks
App 20210111124 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111155 - Liff; Shawna M. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111170 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111147 - Liff; Shawna M. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111156 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies With Communication Networks
App 20210111154 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems
Grant 10,976,822 - Dogiamis , et al. April 13, 2 | 2021-04-13 |
Piezo actuators for optical beam steering applications
Grant 10,969,576 - Aleksov , et al. April 6, 2 | 2021-04-06 |
Semiconductor packaging with high density interconnects
Grant 10,971,453 - Elsherbini , et al. April 6, 2 | 2021-04-06 |
Process for creating piezo-electric mirrors in package
Grant 10,969,574 - Oster , et al. April 6, 2 | 2021-04-06 |
Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide
Grant 10,964,992 - Dogiamis , et al. March 30, 2 | 2021-03-30 |
Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems
Grant 10,964,178 - Aleksov , et al. March 30, 2 | 2021-03-30 |
Dual-substrate Waveguide Filter
App 20210091443 - Aleksov; Aleksandar ; et al. | 2021-03-25 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections
Grant 10,950,919 - Kamgaing , et al. March 16, 2 | 2021-03-16 |
Radio frequency (RF) module with shared inductor
Grant 10,951,248 - Kamgaing , et al. March 16, 2 | 2021-03-16 |
Tunable Capacitor Arrangements In Integrated Circuit Package Substrates
App 20210066265 - Eid; Feras ; et al. | 2021-03-04 |
Capacitor-wirebond Pad Structures For Integrated Circuit Packages
App 20210066184 - Aleksov; Aleksandar ; et al. | 2021-03-04 |
Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates
Grant 10,937,594 - Sounart , et al. March 2, 2 | 2021-03-02 |
Piezoelectric package-integrated current sensing devices
Grant 10,921,349 - Dogiamis , et al. February 16, 2 | 2021-02-16 |
Crimped mm-wave waveguide tap connector
Grant 10,921,524 - Elsherbini , et al. February 16, 2 | 2021-02-16 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,923,429 - Braunisch , et al. February 16, 2 | 2021-02-16 |
Thermal Management In Integrated Circuit Packages
App 20210041182 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043544 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043543 - Eid; Feras ; et al. | 2021-02-11 |
Bridge For Radio Frequency (rf) Multi-chip Modules
App 20210044030 - Aleksov; Aleksandar ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043573 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043541 - Eid; Feras ; et al. | 2021-02-11 |
Integrated Radio Frequency (rf) Front-end Module (fem)
App 20210036682 - Kamgaing; Telesphor ; et al. | 2021-02-04 |
Integrated Filter Stack For A Radio Frequency (rf) Front-end Module (fem)
App 20210036685 - Kamgaing; Telesphor ; et al. | 2021-02-04 |
Piezoelectric package-integrated film bulk acoustic resonator devices
Grant 10,903,818 - Nair , et al. January 26, 2 | 2021-01-26 |
Piezoelectric package-integrated contour mode filter devices
Grant 10,897,238 - Eid , et al. January 19, 2 | 2021-01-19 |
Mmwave Waveguides Featuring Power-over-waveguide Technology For Automotive Applications
App 20200388898 - DOGIAMIS; Georgios C. ; et al. | 2020-12-10 |
Piezoelectric package-integrated sensing devices
Grant 10,840,430 - Eid , et al. November 17, 2 | 2020-11-17 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200357747 - BRAUNISCH; Henning ; et al. | 2020-11-12 |
Piezoelectrically actuated mirrors for optical communications
Grant 10,816,733 - Oster , et al. October 27, 2 | 2020-10-27 |
Stacked Platforms With Waveguide Interconnects
App 20200315052 - Kamgaing; Telesphor ; et al. | 2020-10-01 |
Electromagnetic Interference Shield Created On Package Using High Throughput Additive Manufacturing
App 20200312782 - EID; Feras ; et al. | 2020-10-01 |
Contactless High-frequency Interconnect
App 20200303328 - Braunisch; Henning ; et al. | 2020-09-24 |
Waveguide Fan-out
App 20200303327 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Microelectronic Package With Radio Frequency (rf) Chiplet
App 20200303329 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Waveguide Interconnect For Packages
App 20200294940 - Dogiamis; Georgios ; et al. | 2020-09-17 |
Multi-package On-board Waveguide Interconnects
App 20200296823 - Kamgaing; Telesphor ; et al. | 2020-09-17 |
System on package architecture including structures on die back side
Grant 10,777,538 - Hua , et al. Sept | 2020-09-15 |
Hybrid Filters And Packages Therefor
App 20200287520 - KAMGAING; Telesphor ; et al. | 2020-09-10 |
Microelectronic Assemblies
App 20200286871 - Liff; Shawna M. ; et al. | 2020-09-10 |
Microelectronic Assemblies
App 20200286745 - Elsherbini; Adel A. ; et al. | 2020-09-10 |
Microelectronic Assemblies
App 20200279829 - Elsherbini; Adel A. ; et al. | 2020-09-03 |
Microelectronic Assemblies
App 20200279813 - Liff; Shawna M. ; et al. | 2020-09-03 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,763,216 - Braunisch , et al. Sep | 2020-09-01 |
Microelectronic Assemblies
App 20200273839 - ELSHERBINI; Adel A. ; et al. | 2020-08-27 |
Microelectronic Assemblies With Communication Networks
App 20200273840 - Elsherbini; Adel A. ; et al. | 2020-08-27 |
Hybrid Filter Architecture With Integrated Passives, Acoustic Wave Resonators And Hermetically Sealed Cavities Between Two Reson
App 20200259478 - A1 | 2020-08-13 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,734,236 - Oster , et al. | 2020-08-04 |
Stacked Package With Electrical Connections Created Using High Throughput Additive Manufacturing
App 20200235082 - EID; Feras ; et al. | 2020-07-23 |
Rf Front End Module Including Hybrid Filter And Active Circuits In A Single Package
App 20200235716 - EID; Feras ; et al. | 2020-07-23 |
Microelectronic Assemblies
App 20200235061 - Elsherbini; Adel A. ; et al. | 2020-07-23 |
Package With A Highly Conductive Layer Deposited On Die Using Throughput Additive Deposition Prior To Tim1 Dispense
App 20200227335 - EID; Feras ; et al. | 2020-07-16 |
Microelectronic Assemblies
App 20200227401 - Elsherbini; Adel A. ; et al. | 2020-07-16 |
Microelectronic Assemblies
App 20200227377 - Liff; Shawna M. ; et al. | 2020-07-16 |
Microelectronic Assemblies
App 20200227384 - Liff; Shawna M. ; et al. | 2020-07-16 |
Front End System Having An Acoustic Wave Resonator (awr) On An Interposer Substrate
App 20200219861 - KAMGAING; Telesphor ; et al. | 2020-07-09 |
Microelectronic Assemblies
App 20200219816 - Aleksov; Aleksandar ; et al. | 2020-07-09 |
Microelectronic Assemblies With Communication Networks
App 20200219815 - Elsherbini; Adel A. ; et al. | 2020-07-09 |
Tsv-less Die Stacking Using Plated Pillars/through Mold Interconnect
App 20200212012 - MEYERS; Preston T. ; et al. | 2020-07-02 |
Substrate Integrated Posts And Heat Spreader Customization For Enhanced Package Thermomechanics
App 20200194335 - EID; Feras ; et al. | 2020-06-18 |
Thin electronic package elements using laser spallation
Grant 10,672,701 - Raghunathan , et al. | 2020-06-02 |
Microelectronic Devices Designed With Package Integrated Variable Capacitors Having Piezoelectric Actuation
App 20200168402 - EID; Feras ; et al. | 2020-05-28 |
Piezoelectric driven switches integrated in organic, flexible displays
Grant 10,658,566 - Liff , et al. | 2020-05-19 |
Alignment of single and multi-mode optical fibers using piezoelectric actuators
Grant 10,649,158 - Swan , et al. | 2020-05-12 |
Piezoelectric package-integrated motor
Grant 10,644,616 - Liff , et al. | 2020-05-05 |
Packaged-integrated Lithium Ion Thin Film Battery And Methods For Fabricating The Same
App 20200136099 - SOUNART; Thomas L. ; et al. | 2020-04-30 |
Piezoelectric package-integrated temperature sensing devices
Grant 10,634,566 - Eid , et al. | 2020-04-28 |
In-package Rf Waveguides As High Bandwidth Chip-to-chip Interconnects And Methods For Using The Same
App 20200118951 - ALEKSOV; Aleksandar ; et al. | 2020-04-16 |
Microelectronic Assemblies Having An Integrated Voltage Regulator Chiplet
App 20200105653 - Elsherbini; Adel A. ; et al. | 2020-04-02 |
Microelectronic Assemblies Having Magnetic Core Inductors
App 20200098621 - Bharath; Krishna ; et al. | 2020-03-26 |
Microelectronic Assemblies Having Non-rectilinear Arrangements
App 20200098692 - Liff; Shawna M. ; et al. | 2020-03-26 |
Dies With Integrated Voltage Regulators
App 20200098676 - Elsherbini; Adel A. ; et al. | 2020-03-26 |
Substrate Dielectric Waveguides In Semiconductor Packages
App 20200098710 - NAIR; VIYAY K. ; et al. | 2020-03-26 |
Semiconductor Package Or Structure With Dual-sided Interposers And Memory
App 20200098724 - Liff; Shawna M. ; et al. | 2020-03-26 |
Semiconductor Package Or Semiconductor Package Structure With Dual-sided Interposer And Memory
App 20200098725 - Liff; Shawna M. ; et al. | 2020-03-26 |
Microelectronic Assemblies
App 20200091128 - Elsherbini; Adel A. ; et al. | 2020-03-19 |
Actuatable and adaptable metamaterials integrated in package
Grant 10,594,029 - Liff , et al. | 2020-03-17 |
Piezoelectric package-integrated delay lines
Grant 10,594,294 - Elsherbini , et al. | 2020-03-17 |
Serializer-deserializer Die For High Speed Signal Interconnect
App 20200075521 - Elsherbini; Adel A. ; et al. | 2020-03-05 |
Microelectronic Devices Designed With Package Integrated Tunable Ferroelectric Capacitors
App 20200075491 - DOGIAMIS; Georgios C. ; et al. | 2020-03-05 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200075493 - BRAUNISCH; Henning ; et al. | 2020-03-05 |
Piezoelectrically Actuated Mirrors For Optical Communications
App 20200064555 - OSTER; Sasha N. ; et al. | 2020-02-27 |
Package-integrated Piezoelectric Device For Blood-pressure Monitoring Using Wearable Package Systems
App 20200060558 - ALEKSOV; Aleksandar ; et al. | 2020-02-27 |
Fast-lane Routing For Multi-chip Packages
App 20200067816 - Elsherbini; Adel A. ; et al. | 2020-02-27 |
Waveguide connector with tapered slot launcher
Grant 10,566,672 - Elsherbini , et al. Feb | 2020-02-18 |
Microelectronic Devices Designed With Ultra-high-k Dielectric Capacitors Integrated With Package Substrates
App 20200051743 - SOUNART; Thomas L. ; et al. | 2020-02-13 |
Microelectronic Assemblies Having Interposers
App 20200006235 - Aleksov; Aleksandar ; et al. | 2020-01-02 |
Microelectronic Assemblies
App 20190385977 - Elsherbini; Adel A. ; et al. | 2019-12-19 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,510,669 - Braunisch , et al. Dec | 2019-12-17 |
Reduced Dispersion Dielectric Waveguides
App 20190356033 - Dogiamis; Georgios ; et al. | 2019-11-21 |
Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle
Grant 10,484,120 - Oster , et al. Nov | 2019-11-19 |
Three-dimensional small form factor system in package architecture
Grant 10,483,250 - Nair , et al. Nov | 2019-11-19 |
Via architecture for increased density interface
Grant 10,475,736 - Aleksov , et al. Nov | 2019-11-12 |
System On Package Architecture Including Structures On Die Back Side
App 20190326258 - HUA; Fay ; et al. | 2019-10-24 |
Microelectronic Assemblies Having Substrate-integrated Perovskite Layers
App 20190311980 - Eid; Feras ; et al. | 2019-10-10 |
Active Venting Garment Using Piezoelectric Elements
App 20190297975 - ALEKSOV; Aleksandar ; et al. | 2019-10-03 |
Piezoelectric package-integrated crystal devices
Grant 10,432,167 - Elsherbini , et al. O | 2019-10-01 |
Thermal management of molded packages
Grant 10,424,559 - Eid , et al. Sept | 2019-09-24 |
Waveguide Interconnect Bridges
App 20190287908 - Dogiamis; Georgios ; et al. | 2019-09-19 |
Superconducting Qubit Device Packages
App 20190273197 - Roberts; Jeanette M. ; et al. | 2019-09-05 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20190259622 - OSTER; Sasha N. ; et al. | 2019-08-22 |
Semiconductor Packaging With High Density Interconnects
App 20190259705 - Elsherbini; Adel A. ; et al. | 2019-08-22 |
Dual-sided die packages
Grant 10,361,142 - Braunisch , et al. | 2019-07-23 |
Stacked Die Architectures With Improved Thermal Management
App 20190214328 - Eid; Feras ; et al. | 2019-07-11 |
Co-extrusion Of Multi-material Sets For Millimeter-wave Waveguide Fabrication
App 20190207290 - Rawlings; Brandon M. ; et al. | 2019-07-04 |
Crimped Mm-wave Waveguide Tap Connector
App 20190204508 - ELSHERBINI; Adel A. ; et al. | 2019-07-04 |
Methods For Conductively Coating Millimeter Waveguides
App 20190198961 - Aleksov; Aleksandar ; et al. | 2019-06-27 |
Waveguide Topologies For Rack Scale Architecture Servers
App 20190198965 - Kamgaing; Telesphor ; et al. | 2019-06-27 |
Systems, Methods, And Apparatuses For Implementing Increased Human Perception Of Haptic Feedback Systems
App 20190187798 - DOGIAMIS; Georgios C. ; et al. | 2019-06-20 |
Systems, Methods And Apparatuses For Implementing Increased Human Perception Of Haptic Feedback Systems
App 20190188976 - ALEKSOV; Aleksandar ; et al. | 2019-06-20 |
Shielded interconnects
Grant 10,319,896 - Falcon , et al. | 2019-06-11 |
Millimeter-wave Holey Waveguides And Multi-material Waveguides
App 20190173149 - Elsherbini; Adel A. ; et al. | 2019-06-06 |
Package assembly with hermetic cavity
Grant 10,314,171 - Aleksov , et al. | 2019-06-04 |
Piezoelectric Package-integrated Pressure Sensing Devices
App 20190165250 - SOUNART; Thomas L. ; et al. | 2019-05-30 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,304,686 - Oster , et al. | 2019-05-28 |
System on package architecture including structures on die back side
Grant 10,304,804 - Hua , et al. | 2019-05-28 |
Tunable radio frequency systems using piezoelectric package-integrated switching devices
Grant 10,291,283 - Kamgaing , et al. | 2019-05-14 |
Alignment Of Single And Multi-mode Optical Fibers Using Piezoelectric Actuators
App 20190121038 - SWAN; Johanna M. ; et al. | 2019-04-25 |
Piezoelectric Package-integrated Current Sensing Devices
App 20190113545 - DOGIAMIS; Georgios C. ; et al. | 2019-04-18 |
Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards
Grant 10,263,312 - Oster , et al. | 2019-04-16 |
Waveguide connector with slot launcher
Grant 10,256,521 - Elsherbini , et al. | 2019-04-09 |
Waveguide Couplers And Junctions To Enable Frequency Division Multiplexed Sensor Systems In Autonomous Vehicle
App 20190103932 - Oster; Sasha N. ; et al. | 2019-04-04 |
Dielectric waveguide bundle including a supporting feature for connecting first and second server boards
Grant 10,249,925 - Dogiamis , et al. | 2019-04-02 |
Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates
Grant 10,251,272 - Aleksov , et al. | 2019-04-02 |
Multiband Waveguide Interconnect
App 20190097293 - Dogiamis; Georgios ; et al. | 2019-03-28 |
Via Architecture For Increased Density Interface
App 20190096798 - Aleksov; Aleksandar ; et al. | 2019-03-28 |
Multimode Waveguide
App 20190081705 - Braunisch; Henning ; et al. | 2019-03-14 |
Inorganic Piezoelectric Materials Formed On Fibers & Applications Thereof
App 20190032272 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Package-integrated Piezoelectric Optical Grating Switch Array
App 20190033500 - SOUNART; Thomas L. ; et al. | 2019-01-31 |
Strain Sensitive Piezoelectric System With Optical Indicator
App 20190036004 - EID; Feras ; et al. | 2019-01-31 |
Package Integrated Security Features
App 20190036774 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Adaptable Displays Using Piezoelectric Actuators
App 20190033576 - OSTER; Sasha N. ; et al. | 2019-01-31 |
Process For Creating Piezo-electric Mirrors In Package
App 20190033575 - OSTER; Sasha N. ; et al. | 2019-01-31 |
Piezoelectric Driven Switches Integrated In Organic, Flexible Displays
App 20190036002 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Piezo Actuators For Optical Beam Steering Applications
App 20190025573 - ALEKSOV; Aleksandar ; et al. | 2019-01-24 |
Microelectronic Devices Designed With Ultra-high-k Dielectric Capacitors Integrated With Package Substrates
App 20190008046 - ALEKSOV; Aleksandar ; et al. | 2019-01-03 |
Shielded Interconnects
App 20190006572 - Falcon; Javier A. ; et al. | 2019-01-03 |
Method of making an accelerometer
Grant 10,156,583 - Ma , et al. Dec | 2018-12-18 |
Package integrated security features
Grant 10,116,504 - Liff , et al. October 30, 2 | 2018-10-30 |
Thin Electronic Package Elements Using Laser Spallation
App 20180308792 - Raghunathan; Vivek ; et al. | 2018-10-25 |
Three-dimensional Small Form Factor System In Package Architecture
App 20180286840 - NAIR; Vijay K. ; et al. | 2018-10-04 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20180286687 - OSTER; Sasha N. ; et al. | 2018-10-04 |
System On Package Architecture Including Structures On Die Back Side
App 20180286834 - HUA; Fay ; et al. | 2018-10-04 |
Flexible Electronic Assembly Method
App 20180263117 - Oster; Sasha N. ; et al. | 2018-09-13 |
Method of making glass core substrate for integrated circuit devices
Grant 10,070,524 - Ma , et al. September 4, 2 | 2018-09-04 |
Optical I/O system using planar light-wave integrated circuit
Grant 10,054,737 - Kobrinsky , et al. August 21, 2 | 2018-08-21 |
Stretchable and flexible electrical substrate interconnections
Grant 10,039,186 - Baxi , et al. July 31, 2 | 2018-07-31 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 10,032,052 - Elsherbini , et al. July 24, 2 | 2018-07-24 |
Thermal Management of Molded Packages
App 20180182736 - Eid; Feras ; et al. | 2018-06-28 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Grant 10,008,452 - Ma , et al. June 26, 2 | 2018-06-26 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20180145031 - BRAUNISCH; Henning ; et al. | 2018-05-24 |
Package Mems Switch And Method
App 20180138001 - Ma; Qing ; et al. | 2018-05-17 |
Patch system for in-situ therapeutic treatment
Grant 9,967,040 - Aleksov , et al. May 8, 2 | 2018-05-08 |
Architecture for seamless integrated display system
Grant 9,952,823 - Swan , et al. April 24, 2 | 2018-04-24 |
Magnetic detachable electrical connections between circuits
Grant 9,954,309 - Eid , et al. April 24, 2 | 2018-04-24 |
Waveguide Bundle Fabrication In Suspended Media Targeting Bend-induced Strain Relief
App 20180097269 - Dogiamis; Georgios C. ; et al. | 2018-04-05 |
Actuatable And Adaptable Metamaterials Integrated In Package
App 20180097284 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Fabrication Process For Ribbon Bundled Millimeter-waveguide
App 20180097268 - Oster; Sasha ; et al. | 2018-04-05 |
Piezoelectric Package-integrated Motor
App 20180097458 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Package Integrated Security Features
App 20180097693 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Waveguide Connector With Tapered Slot Launcher
App 20180090848 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Waveguide Connector With Slot Launcher
App 20180090803 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Cloaking system with waveguides
Grant 9,927,211 - Young , et al. March 27, 2 | 2018-03-27 |
Stretchable And Flexible Electrical Substrate Interconnections
App 20180084643 - Baxi; Amit Sudhir ; et al. | 2018-03-22 |
Piezoelectric package-integrated synthetic jet devices
Grant 9,902,152 - Eid , et al. February 27, 2 | 2018-02-27 |
Electrical connectors for high density attach to stretchable boards
Grant 9,893,438 - Oster , et al. February 13, 2 | 2018-02-13 |
Wellness Monitoring Using A Patch System
App 20180020982 - Elsherbini; Adel A. ; et al. | 2018-01-25 |
Patch System For In-situ Therapeutic Treatment
App 20180026730 - Aleksov; Aleksandar ; et al. | 2018-01-25 |
Magnetic Detachable Electrical Connections Between Circuits
App 20180026393 - Eid; Feras ; et al. | 2018-01-25 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 9,875,969 - Braunisch , et al. January 23, 2 | 2018-01-23 |
Copper nanorod-based thermal interface material (TIM)
Grant 9,865,521 - Jha , et al. January 9, 2 | 2018-01-09 |
Piezoelectric Package-integrated Temperature Sensing Devices
App 20180003569 - EID; Feras ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Synthetic Jet Devices
App 20180001640 - EID; Feras ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Chemical Species-sensitive Resonant Devices
App 20180003677 - OSTER; Sasha N. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Surface Acoustic Wave Sensing Devices
App 20180004357 - ELSHERBINI; Adel A. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Sensing Devices
App 20180006208 - EID; Feras ; et al. | 2018-01-04 |
High density interconnection of microelectronic devices
Grant 9,842,832 - Karhade , et al. December 12, 2 | 2017-12-12 |
Cloaking System With Waveguides
App 20170299342 - Young; Ian A. ; et al. | 2017-10-19 |
Glass clad microelectronic substrate
Grant 9,793,201 - Ma , et al. October 17, 2 | 2017-10-17 |
Piezoelectric Package-integrated Crystal Devices
App 20170288635 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines
App 20170288639 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Tunable Radio Frequency Systems Using Piezoelectric Package-integrated Switching Devices
App 20170288724 - KAMGAING; Telesphor ; et al. | 2017-10-05 |
Dual-sided Die Packages
App 20170287808 - BRAUNISCH; Henning ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Film Bulk Acoustic Resonator Devices
App 20170285695 - NAIR; Vijay K. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Switching Devices
App 20170283249 - DOGIAMIS; Georgios C. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines For Radio Frequency Identification Tags
App 20170286731 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Contour Mode Filter Devices
App 20170288642 - EID; Feras ; et al. | 2017-10-05 |
Patch system for in-situ therapeutic treatment
Grant 9,735,893 - Aleksov , et al. August 15, 2 | 2017-08-15 |
Dual-sided die packages
Grant 9,711,428 - Braunisch , et al. July 18, 2 | 2017-07-18 |
Microelectronic Structures Having Laminated Or Embedded Glass Routing Structures For High Density Packaging
App 20170200677 - Ma; Qing ; et al. | 2017-07-13 |
Glass core substrate for integrated circuit devices and methods of making the same
Grant 9,686,861 - Ma , et al. June 20, 2 | 2017-06-20 |
Copper Nanorod-based Thermal Interface Material (tim)
App 20170133296 - Jha; Chandra M. ; et al. | 2017-05-11 |
Optical I/o System Using Planar Light-wave Integrated Circuit
App 20170131469 - Kobrinsky; Mauro J. ; et al. | 2017-05-11 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 9,647,636 - Elsherbini , et al. May 9, 2 | 2017-05-09 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Grant 9,642,248 - Ma , et al. May 2, 2 | 2017-05-02 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
Grant 9,617,148 - Ma , et al. April 11, 2 | 2017-04-11 |
Copper nanorod-based thermal interface material (TIM)
Grant 9,601,406 - Jha , et al. March 21, 2 | 2017-03-21 |
Space transformer
Grant 9,564,408 - Aleksov , et al. February 7, 2 | 2017-02-07 |
Optical I/O system using planar light-wave integrated circuit
Grant 9,507,086 - Kobrinsky , et al. November 29, 2 | 2016-11-29 |
Glass Clad Microelectronic Substrate
App 20160343650 - Ma; Qing ; et al. | 2016-11-24 |
High Density Interconnection Of Microelectronic Devices
App 20160300824 - Karhade; Omkar G. ; et al. | 2016-10-13 |
Glass Core Substrate For Integrated Circuit Devices And Methods Of Making The Same
App 20160284637 - Ma; Qing ; et al. | 2016-09-29 |
Glass clad microelectronic substrate
Grant 9,445,496 - Ma , et al. September 13, 2 | 2016-09-13 |
Inductive inertial sensor architecture and fabrication in packaging build-up layers
Grant 9,429,427 - Ma , et al. August 30, 2 | 2016-08-30 |
Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
Grant 9,406,618 - Guzek , et al. August 2, 2 | 2016-08-02 |
High density interconnection of microelectronic devices
Grant 9,397,071 - Karhade , et al. July 19, 2 | 2016-07-19 |
Semiconductor package with optical port
Grant 9,374,162 - Sankman , et al. June 21, 2 | 2016-06-21 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
Grant 9,368,429 - Ma , et al. June 14, 2 | 2016-06-14 |
Cloaking system with waveguides
Grant 9,310,565 - Young , et al. April 12, 2 | 2016-04-12 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Grant 9,001,520 - Ma , et al. April 7, 2 | 2015-04-07 |
Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
Grant 8,786,066 - Guzek , et al. July 22, 2 | 2014-07-22 |
Probes formed from semiconductor region vias
Grant 8,513,966 - Ma , et al. August 20, 2 | 2013-08-20 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 8,227,904 - Braunisch , et al. July 24, 2 | 2012-07-24 |
Glass core substrate for integrated circuit devices and methods of making the same
Grant 8,207,453 - Ma , et al. June 26, 2 | 2012-06-26 |
Multi-chip package and method of providing die-to-die interconnects in same
App 20100327424A1 - | 2010-12-30 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
Grant 7,112,887 - Swan , et al. September 26, 2 | 2006-09-26 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
Grant 6,908,845 - Swan , et al. June 21, 2 | 2005-06-21 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
Grant 6,848,177 - Swan , et al. February 1, 2 | 2005-02-01 |
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