| Patent | Date |
|---|
RF front end module including hybrid filter and active circuits in a single package
Grant 11,456,721 - Eid , et al. September 27, 2 | 2022-09-27 |
Package With Thermal Interface Material Retaining Structures On Die And Heat Spreader
App 20220301972 - EID; Feras | 2022-09-22 |
Inorganic piezoelectric materials formed on fibers and applications thereof
Grant 11,421,376 - Liff , et al. August 23, 2 | 2022-08-23 |
Diodes for package substrate electrostatic discharge (ESD) protection
Grant 11,424,239 - Aleksov , et al. August 23, 2 | 2022-08-23 |
Thermal management solutions for substrates in integrated circuit packages
Grant 11,417,586 - Elsherbini , et al. August 16, 2 | 2022-08-16 |
Package With A Highly Conductive Layer Deposited On Die Using Throughput Additive Deposition Prior To Tim1 Dispense
App 20220238411 - EID; Feras ; et al. | 2022-07-28 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20220231394 - ELSHERBINI; Adel A. ; et al. | 2022-07-21 |
Package with thermal interface material retaining structures on die and heat spreader
Grant 11,387,161 - Eid July 12, 2 | 2022-07-12 |
Electromagnetic interference shield created on package using high throughput additive manufacturing
Grant 11,380,624 - Eid , et al. July 5, 2 | 2022-07-05 |
Microelectronic Package With Substrate-integrated Components
App 20220201843 - Dogiamis; Georgios ; et al. | 2022-06-23 |
Carrier For Microelectronic Assemblies Having Direct Bonding
App 20220199450 - Liff; Shawna M. ; et al. | 2022-06-23 |
Shield Structures In Microelectronic Assemblies Having Direct Bonding
App 20220199546 - Elsherbini; Adel A. ; et al. | 2022-06-23 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189850 - Liff; Shawna M. ; et al. | 2022-06-16 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189839 - Eid; Feras ; et al. | 2022-06-16 |
Hermetic Sealing Structures In Microelectronic Assemblies Having Direct Bonding
App 20220189861 - Aleksov; Aleksandar ; et al. | 2022-06-16 |
Multi-filter Die
App 20220190806 - Dogiamis; Georgios ; et al. | 2022-06-16 |
Electrostatic Discharge Protection In Integrated Circuits
App 20220181276 - Elsherbini; Adel A. ; et al. | 2022-06-09 |
Package spark gap structure
Grant 11,348,882 - Aleksov , et al. May 31, 2 | 2022-05-31 |
Thermal management solutions for embedded integrated circuit devices
Grant 11,342,243 - Eid , et al. May 24, 2 | 2022-05-24 |
Die Backend Diodes For Electrostatic Discharge (esd) Protection
App 20220149036 - Aleksov; Aleksandar ; et al. | 2022-05-12 |
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense
Grant 11,328,978 - Eid , et al. May 10, 2 | 2022-05-10 |
Low loss and low cross talk transmission lines having l-shaped cross sections
Grant 11,329,358 - Elsherbini , et al. May 10, 2 | 2022-05-10 |
Capacitor-wirebond pad structures for integrated circuit packages
Grant 11,328,986 - Aleksov , et al. May 10, 2 | 2022-05-10 |
Substrate integrated posts and heat spreader customization for enhanced package thermomechanics
Grant 11,328,979 - Eid , et al. May 10, 2 | 2022-05-10 |
Die back side structures for warpage control
Grant 11,322,456 - Eid , et al. May 3, 2 | 2022-05-03 |
Multi-filter die
Grant 11,316,497 - Dogiamis , et al. April 26, 2 | 2022-04-26 |
Microelectronic package with substrate-integrated components
Grant 11,310,907 - Dogiamis , et al. April 19, 2 | 2022-04-19 |
Heat dissipation device having a thermally conductive structure and a thermal isolation structure in the thermally conductive structure
Grant 11,302,599 - Eid , et al. April 12, 2 | 2022-04-12 |
Microelectronic assemblies having substrate-integrated perovskite layers
Grant 11,302,618 - Eid , et al. April 12, 2 | 2022-04-12 |
Electrostatic discharge protection in integrated circuits
Grant 11,296,040 - Elsherbini , et al. April 5, 2 | 2022-04-05 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20220102261 - ELSHERBINI; Adel A. ; et al. | 2022-03-31 |
Conductive Contact Structures For Electrostatic Discharge Protection In Integrated Circuits
App 20220102270 - Elsherbini; Adel A. ; et al. | 2022-03-31 |
Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity
Grant 11,289,431 - Eid , et al. March 29, 2 | 2022-03-29 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093547 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093517 - Aleksov; Aleksandar ; et al. | 2022-03-24 |
Package-integrated Bistable Switch For Electrostatic Discharge (esd) Protection
App 20220093531 - Eid; Feras ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093492 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093561 - Eid; Feras ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093546 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Capacitors And Resistors At Direct Bonding Interfaces In Microelectronic Assemblies
App 20220093725 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Thermal management solutions for stacked integrated circuit devices using jumping drops vapor chambers
Grant 11,282,812 - Elsherbini , et al. March 22, 2 | 2022-03-22 |
Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials
Grant 11,282,800 - Braunisch , et al. March 22, 2 | 2022-03-22 |
Hybrid filters and packages therefor
Grant 11,283,427 - Kamgaing , et al. March 22, 2 | 2022-03-22 |
Die backend diodes for electrostatic discharge (ESD) protection
Grant 11,264,373 - Aleksov , et al. March 1, 2 | 2022-03-01 |
Heat Dissipation Device Having Anisotropic Thermally Conductive Sections And Isotropic Thermally Conductive Sections
App 20220042750 - Eid; Feras ; et al. | 2022-02-10 |
Conductive contact structures for electrostatic discharge protection in integrated circuits
Grant 11,239,155 - Elsherbini , et al. February 1, 2 | 2022-02-01 |
Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices
Grant 11,234,343 - Eid , et al. January 25, 2 | 2022-01-25 |
Warpage mitigation structures created on substrate using high throughput additive manufacturing
Grant 11,233,015 - Eid January 25, 2 | 2022-01-25 |
High performance integrated RF passives using dual lithography process
Grant 11,227,825 - Elsherbini , et al. January 18, 2 | 2022-01-18 |
Stacked package with electrical connections created using high throughput additive manufacturing
Grant 11,227,859 - Eid , et al. January 18, 2 | 2022-01-18 |
Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections
Grant 11,226,162 - Eid , et al. January 18, 2 | 2022-01-18 |
Switched closed loop read-out methods and systems for resonant sensing platforms
Grant 11,221,354 - Dogiamis , et al. January 11, 2 | 2022-01-11 |
Package integrated security features
Grant 11,223,524 - Liff , et al. January 11, 2 | 2022-01-11 |
Package-integrated bistable switch for electrostatic discharge (ESD) protection
Grant 11,222,856 - Eid , et al. January 11, 2 | 2022-01-11 |
High-throughput Additively Manufactured Power Delivery Vias And Traces
App 20210407903 - Elsherbini; Adel ; et al. | 2021-12-30 |
Integrated Circuit Die Thermal Solutions With A Contiguously Integrated Heat Pipe
App 20210410331 - Eid; Feras ; et al. | 2021-12-30 |
Integrated Circuit Die Packages Including A Contiguous Heat Spreader
App 20210407877 - Eid; Feras ; et al. | 2021-12-30 |
Modular Microchannel Thermal Solutions For Integrated Circuit Devices
App 20210407888 - Elsherbini; Adel ; et al. | 2021-12-30 |
Additively Manufactured Structures For Heat Dissipation From Integrated Circuit Devices
App 20210407884 - Eid; Feras ; et al. | 2021-12-30 |
Microelectronic Package Electrostatic Discharge (esd) Protection
App 20210410343 - Strong; Veronica Aleman ; et al. | 2021-12-30 |
Additive Manufacturing For Integrated Circuit Assembly Connectors
App 20210398922 - Dogiamis; Georgios ; et al. | 2021-12-23 |
Additive Manufacturing For Integrated Circuit Assembly Cables
App 20210400856 - Dogiamis; Georgios ; et al. | 2021-12-23 |
Physically Unclonable Function Circuitry Of A Package Substrate And Method Of Providing Same
App 20210398909 - Dogiamis; Georgios ; et al. | 2021-12-23 |
Additive Manufacturing For Integrated Circuit Assembly Connector Support Structures
App 20210398715 - Elsherbini; Adel ; et al. | 2021-12-23 |
Power Delivery Structures
App 20210398895 - Elsherbini; Adel ; et al. | 2021-12-23 |
Integrated Circuit Heat Spreader Including Sealant Interface Material
App 20210398871 - Eid; Feras ; et al. | 2021-12-23 |
Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies
Grant 11,206,008 - Dogiamis , et al. December 21, 2 | 2021-12-21 |
Stacked Die Architectures With Improved Thermal Management
App 20210375719 - Eid; Feras ; et al. | 2021-12-02 |
Magnetic Induced Heating For Solder Interconnects
App 20210375820 - Eid; Feras ; et al. | 2021-12-02 |
Electrostatic discharge protection in integrated circuits
Grant 11,189,580 - Elsherbini , et al. November 30, 2 | 2021-11-30 |
Dual-substrate waveguide filter
Grant 11,158,917 - Aleksov , et al. October 26, 2 | 2021-10-26 |
Microelectronic package electrostatic discharge (ESD) protection
Grant 11,147,197 - Strong , et al. October 12, 2 | 2021-10-12 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210296175 - Aleksov; Aleksandar ; et al. | 2021-09-23 |
Microelectronic Devices Designed With Mold Patterning To Create Package-level Components For High Frequency Communication Systems
App 20210265732 - EID; Feras ; et al. | 2021-08-26 |
Hybrid Backside Thermal Structures For Enhanced Ic Packages
App 20210249375 - Eid; Feras ; et al. | 2021-08-12 |
Microelectronic Package With Mold-integrated Components
App 20210233856 - Dogiamis; Georgios ; et al. | 2021-07-29 |
Inorganic dies with organic interconnect layers and related structures
Grant 11,062,947 - Aleksov , et al. July 13, 2 | 2021-07-13 |
Electrostatic Discharge Protection In Integrated Circuits Using Materials With Optically Controlled Electrical Conductivity
App 20210202403 - Eid; Feras ; et al. | 2021-07-01 |
Electrostatic Discharge Protection In Integrated Circuits Using Positive Temperature Coefficient Material
App 20210202404 - Eid; Feras ; et al. | 2021-07-01 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems
Grant 11,050,155 - Eid , et al. June 29, 2 | 2021-06-29 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210193519 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Package-integrated Bistable Switch For Electrostatic Discharge (esd) Protection
App 20210193597 - Eid; Feras ; et al. | 2021-06-24 |
Die Backend Diodes For Electrostatic Discharge (esd) Protection
App 20210193645 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Electrostatic Discharge Protection In Integrated Circuits
App 20210193596 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Electrostatic Discharge Protection In Integrated Circuits
App 20210193595 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Package Wrap-around Heat Spreader
App 20210193549 - EID; Feras ; et al. | 2021-06-24 |
Diodes For Package Substrate Electrostatic Discharge (esd) Protection
App 20210193644 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Inorganic Dies With Organic Interconnect Layers And Related Structures
App 20210193518 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Conductive Contact Structures For Electrostatic Discharge Protection In Integrated Circuits
App 20210193571 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Multi-filter Die
App 20210175873 - Dogiamis; Georgios ; et al. | 2021-06-10 |
Microelectronic Package With Substrate-integrated Components
App 20210160999 - Dogiamis; Georgios ; et al. | 2021-05-27 |
Adaptable displays using piezoelectric actuators
Grant 11,016,288 - Oster , et al. May 25, 2 | 2021-05-25 |
Microelectronic package with mold-integrated components
Grant 11,011,470 - Dogiamis , et al. May 18, 2 | 2021-05-18 |
Package Spark Gap Structure
App 20210143111 - Aleksov; Aleksandar ; et al. | 2021-05-13 |
Monolithic die with acoustic wave resonators and active circuitry
Grant 10,998,879 - Kamgaing , et al. May 4, 2 | 2021-05-04 |
Microelectronic Package With Mold-integrated Components
App 20210125931 - Dogiamis; Georgios ; et al. | 2021-04-29 |
Microelectronic Package Electrostatic Discharge (esd) Protection
App 20210120708 - Strong; Veronica Aleman ; et al. | 2021-04-22 |
Microelectronic Assemblies
App 20210111156 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Lateral Heat Removal For 3d Stack Thermal Management
App 20210104448 - EID; Feras ; et al. | 2021-04-08 |
Package power delivery using plane and shaped vias
Grant 10,971,416 - Bharath , et al. April 6, 2 | 2021-04-06 |
Process for creating piezo-electric mirrors in package
Grant 10,969,574 - Oster , et al. April 6, 2 | 2021-04-06 |
Piezo actuators for optical beam steering applications
Grant 10,969,576 - Aleksov , et al. April 6, 2 | 2021-04-06 |
Wearable sensing patch technologies
Grant 10,959,633 - Baxi , et al. March 30, 2 | 2021-03-30 |
Dual-substrate Waveguide Filter
App 20210091443 - Aleksov; Aleksandar ; et al. | 2021-03-25 |
Radio frequency (RF) module with shared inductor
Grant 10,951,248 - Kamgaing , et al. March 16, 2 | 2021-03-16 |
Tunable Capacitor Arrangements In Integrated Circuit Package Substrates
App 20210066265 - Eid; Feras ; et al. | 2021-03-04 |
Capacitor-wirebond Pad Structures For Integrated Circuit Packages
App 20210066184 - Aleksov; Aleksandar ; et al. | 2021-03-04 |
Monolithic Die With Acoustic Wave Resonators And Active Circuitry
App 20210067132A1 - | 2021-03-04 |
Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates
Grant 10,937,594 - Sounart , et al. March 2, 2 | 2021-03-02 |
Warpage Mitigation Structures Created On Substrate Using High Throughput Additive Manufacturing
App 20210057354 - EID; Feras | 2021-02-25 |
Semiconductor package having integrated stiffener region
Grant 10,923,415 - Goh , et al. February 16, 2 | 2021-02-16 |
Piezoelectric package-integrated current sensing devices
Grant 10,921,349 - Dogiamis , et al. February 16, 2 | 2021-02-16 |
Thermal Management In Integrated Circuit Packages
App 20210043541 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210041182 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043543 - Eid; Feras ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043544 - Eid; Feras ; et al. | 2021-02-11 |
Bridge For Radio Frequency (rf) Multi-chip Modules
App 20210044030 - Aleksov; Aleksandar ; et al. | 2021-02-11 |
Thermal Management In Integrated Circuit Packages
App 20210043573 - Eid; Feras ; et al. | 2021-02-11 |
Integrated Radio Frequency (rf) Front-end Module (fem)
App 20210036682 - Kamgaing; Telesphor ; et al. | 2021-02-04 |
Integrated Filter Stack For A Radio Frequency (rf) Front-end Module (fem)
App 20210036685 - Kamgaing; Telesphor ; et al. | 2021-02-04 |
Piezoelectric package-integrated film bulk acoustic resonator devices
Grant 10,903,818 - Nair , et al. January 26, 2 | 2021-01-26 |
Piezoelectric package-integrated contour mode filter devices
Grant 10,897,238 - Eid , et al. January 19, 2 | 2021-01-19 |
Microelectronic devices for isolating drive and sense signals of sensing devices
Grant 10,845,380 - Eid , et al. November 24, 2 | 2020-11-24 |
Piezoelectric package-integrated sensing devices
Grant 10,840,430 - Eid , et al. November 17, 2 | 2020-11-17 |
Piezoelectrically actuated mirrors for optical communications
Grant 10,816,733 - Oster , et al. October 27, 2 | 2020-10-27 |
Microelectronic bond pads having integrated spring structures
Grant 10,811,366 - Eid , et al. October 20, 2 | 2020-10-20 |
Substrate Integrated Inductors Using High Throughput Additive Deposition Of Hybrid Magnetic Materials
App 20200312796 - BRAUNISCH; Henning ; et al. | 2020-10-01 |
Electromagnetic Interference Shield Created On Package Using High Throughput Additive Manufacturing
App 20200312782 - EID; Feras ; et al. | 2020-10-01 |
Hybrid Filters And Packages Therefor
App 20200287520 - KAMGAING; Telesphor ; et al. | 2020-09-10 |
Hybrid Filter Architecture With Integrated Passives, Acoustic Wave Resonators And Hermetically Sealed Cavities Between Two Reson
App 20200259478 - A1 | 2020-08-13 |
Stacked Package With Electrical Connections Created Using High Throughput Additive Manufacturing
App 20200235082 - EID; Feras ; et al. | 2020-07-23 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20200235449 - ELSHERBINI; Adel A. ; et al. | 2020-07-23 |
Rf Front End Module Including Hybrid Filter And Active Circuits In A Single Package
App 20200235716 - EID; Feras ; et al. | 2020-07-23 |
Piezoelectric package-integrated acoustic transducer devices
Grant 10,721,568 - Dogiamis , et al. | 2020-07-21 |
Package With A Highly Conductive Layer Deposited On Die Using Throughput Additive Deposition Prior To Tim1 Dispense
App 20200227335 - EID; Feras ; et al. | 2020-07-16 |
Package With Thermal Interface Material Retaining Structures On Die And Heat Spreader
App 20200227336 - EID; Feras | 2020-07-16 |
Front End System Having An Acoustic Wave Resonator (awr) On An Interposer Substrate
App 20200219861 - KAMGAING; Telesphor ; et al. | 2020-07-09 |
Package With Improved Thermals
App 20200203298 - Eid; Feras ; et al. | 2020-06-25 |
Substrate Integrated Posts And Heat Spreader Customization For Enhanced Package Thermomechanics
App 20200194335 - EID; Feras ; et al. | 2020-06-18 |
Die Backside Structures For Enhancing Liquid Cooling Of High Power Multi-chip Package (mcp) Dice
App 20200176352 - CHANG; Je-Young ; et al. | 2020-06-04 |
Microelectronic Devices Designed With Package Integrated Variable Capacitors Having Piezoelectric Actuation
App 20200168402 - EID; Feras ; et al. | 2020-05-28 |
Piezoelectric driven switches integrated in organic, flexible displays
Grant 10,658,566 - Liff , et al. | 2020-05-19 |
Alignment of single and multi-mode optical fibers using piezoelectric actuators
Grant 10,649,158 - Swan , et al. | 2020-05-12 |
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs
Grant 10,651,525 - Elsherbini , et al. | 2020-05-12 |
Piezoelectric package-integrated motor
Grant 10,644,616 - Liff , et al. | 2020-05-05 |
Piezoelectric package-integrated temperature sensing devices
Grant 10,634,566 - Eid , et al. | 2020-04-28 |
Architectures And Methods Of Fabricating 3d Stacked Packages
App 20200126921 - Nair; Vijay K. ; et al. | 2020-04-23 |
Thermal Management Solutions For Embedded Integrated Circuit Devices
App 20200098668 - Eid; Feras ; et al. | 2020-03-26 |
Liquid Metal Tim With Stim-like Performance With No Bsm And Bga Compatible
App 20200098661 - LOFGREEN; Kelly ; et al. | 2020-03-26 |
Thermal Management Solutions For Substrates In Integrated Circuit Packages
App 20200098669 - Elsherbini; Adel ; et al. | 2020-03-26 |
Actuatable and adaptable metamaterials integrated in package
Grant 10,594,029 - Liff , et al. | 2020-03-17 |
Piezoelectric package-integrated delay lines
Grant 10,594,294 - Elsherbini , et al. | 2020-03-17 |
Platform with thermally stable wireless interconnects
Grant 10,593,636 - Dogiamis , et al. | 2020-03-17 |
Thermal Management Solutions For Embedded Integrated Circuit Devices
App 20200083135 - Swan; Johanna ; et al. | 2020-03-12 |
Microelectronic Devices Designed With Package Integrated Tunable Ferroelectric Capacitors
App 20200075491 - DOGIAMIS; Georgios C. ; et al. | 2020-03-05 |
Package-integrated Piezoelectric Device For Blood-pressure Monitoring Using Wearable Package Systems
App 20200060558 - ALEKSOV; Aleksandar ; et al. | 2020-02-27 |
Die Back Side Structures For Warpage Control
App 20200066655 - EID; Feras ; et al. | 2020-02-27 |
Piezoelectrically Actuated Mirrors For Optical Communications
App 20200064555 - OSTER; Sasha N. ; et al. | 2020-02-27 |
Microelectronic Devices Designed With Ultra-high-k Dielectric Capacitors Integrated With Package Substrates
App 20200051743 - SOUNART; Thomas L. ; et al. | 2020-02-13 |
Microelectronic Devices Designed With Mold Patterning To Create Package-level Components For High Frequency Communication System
App 20200052404 - EID; Feras ; et al. | 2020-02-13 |
Thermal Management Solutions For Stacked Integrated Circuit Devices
App 20200043829 - Elsherbini; Adel ; et al. | 2020-02-06 |
Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices
App 20200027812 - Eid; Feras ; et al. | 2020-01-23 |
Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices
App 20200027811 - Eid; Feras ; et al. | 2020-01-23 |
Thermal Management Solutions For Stacked Integrated Circuit Devices Using Jumping Drops Vapor Chambers
App 20190393131 - Eid; Feras ; et al. | 2019-12-26 |
Thermal Management Solutions For Stacked Integrated Circuit Devices Using Jumping Drops Vapor Chambers
App 20190393193 - Eid; Feras ; et al. | 2019-12-26 |
Thermal Management Solutions For Stacked Integrated Circuit Devices Using Jumping Drops Vapor Chambers
App 20190393192 - Eid; Feras ; et al. | 2019-12-26 |
Semiconductor Package With Sealed Thermal Interface Cavity With Low Thermal Resistance Liquid Thermal Interface Material
App 20190393118 - RAWLINGS; Brandon M. ; et al. | 2019-12-26 |
Microelectronic Assemblies
App 20190385977 - Elsherbini; Adel A. ; et al. | 2019-12-19 |
Thermal Management Solutions For Stacked Integrated Circuit Devices
App 20190385932 - Eid; Feras ; et al. | 2019-12-19 |
Thermal Management Solutions For Stacked Integrated Circuit Devices
App 20190385931 - Eid; Feras ; et al. | 2019-12-19 |
Thermal Management Solutions For Stacked Integrated Circuit Devices
App 20190385933 - Eid; Feras ; et al. | 2019-12-19 |
Semiconductor package with air pressure sensor
Grant 10,508,961 - Lin , et al. Dec | 2019-12-17 |
Display for stretchable computing device
Grant 10,492,267 - Elsherbini , et al. Nov | 2019-11-26 |
Package Power Delivery Using Plane And Shaped Vias
App 20190355636 - Bharath; Krishna ; et al. | 2019-11-21 |
Via architecture for increased density interface
Grant 10,475,736 - Aleksov , et al. Nov | 2019-11-12 |
Thermal Management Solutions For Stacked Integrated Circuit Devices Using Unidirectional Heat Transfer Devices
App 20190343017 - Eid; Feras ; et al. | 2019-11-07 |
Heat Dissipation Device Having A Thermally Conductive Structure And A Thermal Isolation Structure In The Thermally Conductive St
App 20190326192 - Eid; Feras ; et al. | 2019-10-24 |
Heat Dissipation Device Having Anisotropic Thermally Conductive Sections And Isotropic Thermally Conductive Sections
App 20190323785 - Eid; Feras ; et al. | 2019-10-24 |
Package MEMS switch and method
Grant 10,453,635 - Ma , et al. Oc | 2019-10-22 |
Microelectronic Assemblies Having Substrate-integrated Perovskite Layers
App 20190311980 - Eid; Feras ; et al. | 2019-10-10 |
Active Venting Garment Using Piezoelectric Elements
App 20190297975 - ALEKSOV; Aleksandar ; et al. | 2019-10-03 |
Piezoelectric package-integrated crystal devices
Grant 10,432,167 - Elsherbini , et al. O | 2019-10-01 |
Thermal management of molded packages
Grant 10,424,559 - Eid , et al. Sept | 2019-09-24 |
Embedded formation of wearable and flexible batteries
Grant 10,418,605 - Strong , et al. Sept | 2019-09-17 |
Package power delivery using plane and shaped vias
Grant 10,410,939 - Bharath , et al. Sept | 2019-09-10 |
Integrated sensor and homologous calibration structure for resonant devices
Grant 10,386,204 - Oster , et al. A | 2019-08-20 |
Piezoelectric Devices Fabricated In Packaging Build-up Layers
App 20190252597 - EID; Feras ; et al. | 2019-08-15 |
Lithographacally defined vias for organic package substrate scaling
Grant 10,381,291 - Elsherbini , et al. A | 2019-08-13 |
Dual-sided die packages
Grant 10,361,142 - Braunisch , et al. | 2019-07-23 |
Stacked Die Architectures With Improved Thermal Management
App 20190214328 - Eid; Feras ; et al. | 2019-07-11 |
Semiconductor Package Having Integrated Stiffener Region
App 20190214338 - GOH; Eng Huat ; et al. | 2019-07-11 |
Microelectronic bond pads having integrated spring structures
Grant 10,325,860 - Eid , et al. | 2019-06-18 |
Package Substrate Integrated Devices
App 20190169020 - ALEKSOV; Aleksandar ; et al. | 2019-06-06 |
Package assembly with hermetic cavity
Grant 10,314,171 - Aleksov , et al. | 2019-06-04 |
Piezoelectric Package-integrated Pressure Sensing Devices
App 20190165250 - SOUNART; Thomas L. ; et al. | 2019-05-30 |
Piezoelectric devices fabricated in packaging build-up layers
Grant 10,305,019 - Eid , et al. | 2019-05-28 |
Microelectronic Bond Pads Having Integrated Spring Structures
App 20190148311 - Eid; Feras ; et al. | 2019-05-16 |
Tunable radio frequency systems using piezoelectric package-integrated switching devices
Grant 10,291,283 - Kamgaing , et al. | 2019-05-14 |
Piezoelectric Devices Fabricated In Packaging Build-up Layers
App 20190140158 - Eid; Feras ; et al. | 2019-05-09 |
Piezoelectric Package-integrated Acoustic Transducer Devices
App 20190141456 - DOGIAMIS; Georgios C. ; et al. | 2019-05-09 |
Synthetic jet delivering controlled flow to sensor system
Grant 10,282,965 - Gullbrand , et al. | 2019-05-07 |
Alignment Of Single And Multi-mode Optical Fibers Using Piezoelectric Actuators
App 20190121038 - SWAN; Johanna M. ; et al. | 2019-04-25 |
Piezoelectric Package-integrated Current Sensing Devices
App 20190113545 - DOGIAMIS; Georgios C. ; et al. | 2019-04-18 |
Microelectronic devices designed with modular substrates having integrated fuses
Grant 10,264,671 - Eid | 2019-04-16 |
Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates
Grant 10,251,272 - Aleksov , et al. | 2019-04-02 |
Via Architecture For Increased Density Interface
App 20190096798 - Aleksov; Aleksandar ; et al. | 2019-03-28 |
Fabric-based piezoelectric energy harvesting
Grant 10,215,164 - Dabby , et al. Feb | 2019-02-26 |
Wearable Sensing Patch Technologies
App 20190038170 - Baxi; Amit ; et al. | 2019-02-07 |
Strain Sensitive Piezoelectric System With Optical Indicator
App 20190036004 - EID; Feras ; et al. | 2019-01-31 |
Piezoelectric Driven Switches Integrated In Organic, Flexible Displays
App 20190036002 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Adaptable Displays Using Piezoelectric Actuators
App 20190033576 - OSTER; Sasha N. ; et al. | 2019-01-31 |
Process For Creating Piezo-electric Mirrors In Package
App 20190033575 - OSTER; Sasha N. ; et al. | 2019-01-31 |
Package-integrated Piezoelectric Optical Grating Switch Array
App 20190033500 - SOUNART; Thomas L. ; et al. | 2019-01-31 |
Inorganic Piezoelectric Materials Formed On Fibers & Applications Thereof
App 20190032272 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Package Integrated Security Features
App 20190036774 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Piezo Actuators For Optical Beam Steering Applications
App 20190025573 - ALEKSOV; Aleksandar ; et al. | 2019-01-24 |
Package-integrated microchannels
Grant 10,186,465 - Eid , et al. Ja | 2019-01-22 |
Hermetic encapsulation for microelectromechanical systems (MEMS) devices
Grant 10,179,729 - Haney , et al. Ja | 2019-01-15 |
Microelectronic Devices Designed With Modular Substrates Having Integrated Fuses
App 20190006282 - EID; Feras | 2019-01-03 |
Integrated Sensor And Homologous Calibration Structure For Resonant Devices
App 20190003854 - Oster; Sasha ; et al. | 2019-01-03 |
Microelectronic Devices Designed With Ultra-high-k Dielectric Capacitors Integrated With Package Substrates
App 20190008046 - ALEKSOV; Aleksandar ; et al. | 2019-01-03 |
Platform With Thermally Stable Wireless Interconnects
App 20190006298 - DOGIAMIS; Georgios C. ; et al. | 2019-01-03 |
Method of making an accelerometer
Grant 10,156,583 - Ma , et al. Dec | 2018-12-18 |
Package integrated synthetic jet device
Grant 10,134,656 - Eid , et al. November 20, 2 | 2018-11-20 |
Microelectronic Devices For Isolating Drive And Sense Signals Of Sensing Devices
App 20180328957 - EID; Feras ; et al. | 2018-11-15 |
Improved Package Power Delivery Using Plane And Shaped Vias
App 20180331003 - BHARATH; Krishna ; et al. | 2018-11-15 |
Package integrated synthetic jet device
Grant 10,121,730 - Eid , et al. November 6, 2 | 2018-11-06 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20180315690 - ELSHERBINI; Adel A. ; et al. | 2018-11-01 |
Package integrated security features
Grant 10,116,504 - Liff , et al. October 30, 2 | 2018-10-30 |
Microelectronic Devices With Embedded Substrate Cavities For Device To Device Communications
App 20180310399 - NAIR; Vijay K. ; et al. | 2018-10-25 |
Embedded Formation Of Wearable And Flexible Batteries
App 20180287115 - Strong; Veronica A. ; et al. | 2018-10-04 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20180288868 - ELSHERBINI; Adel A. ; et al. | 2018-10-04 |
Platform with thermally stable wireless interconnects
Grant 10,083,923 - Dogiamis , et al. September 25, 2 | 2018-09-25 |
Flexible Electronic Assembly Method
App 20180263117 - Oster; Sasha N. ; et al. | 2018-09-13 |
Integrated circuit package with embedded bridge
Grant 10,068,852 - Mahajan , et al. September 4, 2 | 2018-09-04 |
Lithographacally Defined Vias For Organic Package Substrate Scaling
App 20180233431 - ELSHERBINI; Adel A. ; et al. | 2018-08-16 |
Package-integrated Microchannels
App 20180226310 - EID; Feras ; et al. | 2018-08-09 |
Stretchable and flexible electrical substrate interconnections
Grant 10,039,186 - Baxi , et al. July 31, 2 | 2018-07-31 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 10,032,052 - Elsherbini , et al. July 24, 2 | 2018-07-24 |
Thermal Management of Molded Packages
App 20180182736 - Eid; Feras ; et al. | 2018-06-28 |
Optical Micro Mirror Arrays
App 20180164580 - Grover; Ginni ; et al. | 2018-06-14 |
Low loss and low cross talk transmission lines using shaped vias
Grant 9,992,859 - Elsherbini , et al. June 5, 2 | 2018-06-05 |
Package Mems Switch And Method
App 20180138001 - Ma; Qing ; et al. | 2018-05-17 |
Patch system for in-situ therapeutic treatment
Grant 9,967,040 - Aleksov , et al. May 8, 2 | 2018-05-08 |
Magnetic detachable electrical connections between circuits
Grant 9,954,309 - Eid , et al. April 24, 2 | 2018-04-24 |
Package Integrated Security Features
App 20180097693 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Actuatable And Adaptable Metamaterials Integrated In Package
App 20180097284 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Piezoelectric Package-integrated Motor
App 20180097458 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Stretchable And Flexible Electrical Substrate Interconnections
App 20180084643 - Baxi; Amit Sudhir ; et al. | 2018-03-22 |
Piezoelectric package-integrated synthetic jet devices
Grant 9,902,152 - Eid , et al. February 27, 2 | 2018-02-27 |
Electrical connectors for high density attach to stretchable boards
Grant 9,893,438 - Oster , et al. February 13, 2 | 2018-02-13 |
Patch System For In-situ Therapeutic Treatment
App 20180026730 - Aleksov; Aleksandar ; et al. | 2018-01-25 |
Magnetic Detachable Electrical Connections Between Circuits
App 20180026393 - Eid; Feras ; et al. | 2018-01-25 |
Wellness Monitoring Using A Patch System
App 20180020982 - Elsherbini; Adel A. ; et al. | 2018-01-25 |
Copper nanorod-based thermal interface material (TIM)
Grant 9,865,521 - Jha , et al. January 9, 2 | 2018-01-09 |
Piezoelectric Package-integrated Sensing Devices
App 20180006208 - EID; Feras ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Surface Acoustic Wave Sensing Devices
App 20180004357 - ELSHERBINI; Adel A. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Chemical Species-sensitive Resonant Devices
App 20180003677 - OSTER; Sasha N. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Synthetic Jet Devices
App 20180001640 - EID; Feras ; et al. | 2018-01-04 |
Switched Closed Loop Read-out Methods And Systems For Resonant Sensing Platforms
App 20180003749 - DOGIAMIS; Georgios C. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Temperature Sensing Devices
App 20180003569 - EID; Feras ; et al. | 2018-01-04 |
High density interconnection of microelectronic devices
Grant 9,842,832 - Karhade , et al. December 12, 2 | 2017-12-12 |
Flexible electronic assembly method
Grant 9,820,384 - Oster , et al. November 14, 2 | 2017-11-14 |
Microelectronic Bond Pads Having Integrated Spring Structures
App 20170309578 - Eid; Feras ; et al. | 2017-10-26 |
Optical interconnect on bumpless build-up layer package
Grant 9,800,015 - Eid , et al. October 24, 2 | 2017-10-24 |
Integrated Circuit Package With Embedded Bridge
App 20170301625 - Mahajan; Ravindranath V. ; et al. | 2017-10-19 |
Textile that includes an electronic system
Grant 9,788,581 - Aleksov , et al. October 17, 2 | 2017-10-17 |
Magnet placement for integrated sensor packages
Grant 9,791,470 - Eid , et al. October 17, 2 | 2017-10-17 |
Tunable Radio Frequency Systems Using Piezoelectric Package-integrated Switching Devices
App 20170288724 - KAMGAING; Telesphor ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Contour Mode Filter Devices
App 20170288642 - EID; Feras ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines
App 20170288639 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Dual-sided Die Packages
App 20170287808 - BRAUNISCH; Henning ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines For Radio Frequency Identification Tags
App 20170286731 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Switching Devices
App 20170283249 - DOGIAMIS; Georgios C. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Film Bulk Acoustic Resonator Devices
App 20170285695 - NAIR; Vijay K. ; et al. | 2017-10-05 |
Thermally Activated Switch
App 20170287664 - Elsherbini; Adel A. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Crystal Devices
App 20170288635 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Patch system for in-situ therapeutic treatment
Grant 9,735,893 - Aleksov , et al. August 15, 2 | 2017-08-15 |
Integrated circuit package with embedded bridge
Grant 9,716,067 - Mahajan , et al. July 25, 2 | 2017-07-25 |
Dual-sided die packages
Grant 9,711,428 - Braunisch , et al. July 18, 2 | 2017-07-18 |
Package MEMS switch and method
Grant 9,691,579 - Ma , et al. June 27, 2 | 2017-06-27 |
Physiological Characteristic Measurement System
App 20170172421 - Dabby; Nadine L. ; et al. | 2017-06-22 |
Fabric-based Piezoelectric Energy Harvesting
App 20170163178 - Dabby; Nadine L. ; et al. | 2017-06-08 |
Heterogeneous integration of microfluidic devices in package structures
Grant 9,674,945 - Teh , et al. June 6, 2 | 2017-06-06 |
Copper Nanorod-based Thermal Interface Material (tim)
App 20170133296 - Jha; Chandra M. ; et al. | 2017-05-11 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 9,647,636 - Elsherbini , et al. May 9, 2 | 2017-05-09 |
Package Integrated Synthetic Jet Device
App 20170098594 - EID; FERAS ; et al. | 2017-04-06 |
Package Integrated Synthetic Jet Device
App 20170098593 - EID; Feras ; et al. | 2017-04-06 |
Low Loss and Low Cross Talk Transmission Lines using Shaped Vias
App 20170093007 - ELSHERBINI; Adel A. ; et al. | 2017-03-30 |
Display For Stretchable Computing Device
App 20170094749 - Elsherbini; Adel ; et al. | 2017-03-30 |
Thermal Management Solutions For Microelectronic Devices Using Jumping Drops Vapor Chambers
App 20170092561 - Eid; Feras ; et al. | 2017-03-30 |
Package Integrated Power Inductors Using Lithographically Defined Vias
App 20170092412 - Manusharow; Mathew J. ; et al. | 2017-03-30 |
Textile That Includes An Electronic System
App 20170086510 - Aleksov; Aleksandar ; et al. | 2017-03-30 |
Integrated Molecular Sensor System
App 20170089865 - OSTER; SASHA N. ; et al. | 2017-03-30 |
Platform With Thermally Stable Wireless Interconnects
App 20170084554 - Dogiamis; Georgios C. ; et al. | 2017-03-23 |
Copper nanorod-based thermal interface material (TIM)
Grant 9,601,406 - Jha , et al. March 21, 2 | 2017-03-21 |
Package integrated synthetic jet device
Grant 9,559,037 - Eid , et al. January 31, 2 | 2017-01-31 |
Hermetic Encapsulation For Microelectromechanical Systems (mems) Devices
App 20170022050 - HANEY; Sarah K. ; et al. | 2017-01-26 |
Package Integrated Synthetic Jet Device
App 20160358841 - EID; Feras ; et al. | 2016-12-08 |
Methods of forming sensor integrated packages and structures formed thereby
Grant 9,505,607 - Lee , et al. November 29, 2 | 2016-11-29 |
Integration of pressure sensors into integrated circuit fabrication and packaging
Grant 9,501,068 - Lee , et al. November 22, 2 | 2016-11-22 |
High Density Interconnection Of Microelectronic Devices
App 20160300824 - Karhade; Omkar G. ; et al. | 2016-10-13 |
Methods Of Forming Sensor Integrated Packages And Structures Formed Thereby
App 20160280535 - Lee; Kyu Oh ; et al. | 2016-09-29 |
Optical Interconnect On Bumpless Build-up Layer Package
App 20160254641 - Eid; Feras ; et al. | 2016-09-01 |
Inductive inertial sensor architecture and fabrication in packaging build-up layers
Grant 9,429,427 - Ma , et al. August 30, 2 | 2016-08-30 |
Accelerometer And Method Of Making Same
App 20160245841 - MA; Qing ; et al. | 2016-08-25 |
High density interconnection of microelectronic devices
Grant 9,397,071 - Karhade , et al. July 19, 2 | 2016-07-19 |
Thermal management in packaged VCSELs
Grant 9,391,427 - Eid , et al. July 12, 2 | 2016-07-12 |
Magnetic field shielding for packaging build-up architectures
Grant 9,345,184 - Oster , et al. May 17, 2 | 2016-05-17 |
Techniques, systems and devices related to acceleration measurement
Grant 9,297,824 - Ma , et al. March 29, 2 | 2016-03-29 |
Optical interconnect on bumpless build-up layer package
Grant 9,275,969 - Eid , et al. March 1, 2 | 2016-03-01 |
Integrated circuit package with embedded bridge
Grant 9,275,955 - Mahajan , et al. March 1, 2 | 2016-03-01 |
Integration of pressure or inertial sensors into integrated circuit fabrication and packaging
Grant 9,260,294 - Lee , et al. February 16, 2 | 2016-02-16 |
Method, apparatus and system for providing metering of acceleration
Grant 9,250,261 - Lin , et al. February 2, 2 | 2016-02-02 |
Hermetic encapsulation for microelectromechanical systems (MEMS) devices
Grant 9,242,854 - Haney , et al. January 26, 2 | 2016-01-26 |
Semiconductor package with air pressure sensor
Grant 9,200,973 - Lin , et al. December 1, 2 | 2015-12-01 |
Heat removal in an integrated circuit assembly using a jumping-drops vapor chamber
Grant 9,147,633 - Eid , et al. September 29, 2 | 2015-09-29 |
Semiconductor package with mechanical fuse
Grant 8,633,551 - Teh , et al. January 21, 2 | 2014-01-21 |
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