| Patent | Date |
|---|
Architecture and processes to enable high capacity memory packages through memory die stacking
Grant 11,456,281 - Li , et al. September 27, 2 | 2022-09-27 |
Intra-semiconductor die communication via waveguide in a multi-die semiconductor package
Grant 11,450,629 - Aygun , et al. September 20, 2 | 2022-09-20 |
Tunable passive semiconductor elements
Grant 11,437,366 - Zhang , et al. September 6, 2 | 2022-09-06 |
Dielectric-filled Trench Isolation Of Vias
App 20220270974 - Aygun; Kemal ; et al. | 2022-08-25 |
High density interconnect structures configured for manufacturing and performance
Grant 11,387,188 - Braunisch , et al. July 12, 2 | 2022-07-12 |
Optical Multichip Package With Multiple System-on-chip Dies
App 20220199600 - ZHANG; Zhichao ; et al. | 2022-06-23 |
Selective Ground Flood Around Reduced Land Pad On Package Base Layer To Enable High Speed Land Grid Array (lga) Socket
App 20220183177 - ZHANG; Zhichao ; et al. | 2022-06-09 |
High Bandwidth Optical Interconnection Architectures
App 20220155539 - PIETAMBARAM; Srinivas V. ; et al. | 2022-05-19 |
Horizontal Pitch Translation Using Embedded Bridge Dies
App 20220157706 - SHARAN; Sujit ; et al. | 2022-05-19 |
EMIB copper layer for signal and power routing
Grant 11,322,445 - Mekonnen , et al. May 3, 2 | 2022-05-03 |
Enabling Long Interconnect Bridges
App 20220130763 - Mahajan; Ravindranath V. ; et al. | 2022-04-28 |
Ground Via Clustering For Crosstalk Mitigation
App 20220130742 - QIAN; Zhiguo ; et al. | 2022-04-28 |
Stiffener and package substrate for a semiconductor package
Grant 11,295,998 - Christianson , et al. April 5, 2 | 2022-04-05 |
Dielectric-filled trench isolation of vias
Grant 11,296,031 - Aygun , et al. April 5, 2 | 2022-04-05 |
Electrical And Optical Interfaces At Different Heights Along An Edge Of A Package To Increase Bandwidth Along The Edge
App 20220100692 - SUBBAREDDY; Dheeraj ; et al. | 2022-03-31 |
Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
Grant 11,291,133 - Zhang , et al. March 29, 2 | 2022-03-29 |
Power Delivery For Embedded Bridge Die Utilizing Trench Structures
App 20220093516 - AYGUN; Kemal ; et al. | 2022-03-24 |
Horizontal pitch translation using embedded bridge dies
Grant 11,276,635 - Sharan , et al. March 15, 2 | 2022-03-15 |
Ground via clustering for crosstalk mitigation
Grant 11,244,890 - Qian , et al. February 8, 2 | 2022-02-08 |
Slow Wave Structure For Millimeter Wave Antennas
App 20220037803 - Zhang; Zhichao ; et al. | 2022-02-03 |
Power delivery for embedded bridge die utilizing trench structures
Grant 11,222,848 - Aygun , et al. January 11, 2 | 2022-01-11 |
Enabling long interconnect bridges
Grant 11,222,847 - Mahajan , et al. January 11, 2 | 2022-01-11 |
Pin count socket having reduced pin count and pattern transformation
Grant 11,212,932 - Nekkanty , et al. December 28, 2 | 2021-12-28 |
Fine Feature Formation Techniques For Printed Circuit Boards
App 20210352807 - Li; Eric ; et al. | 2021-11-11 |
Package Substrates With Magnetic Build-up Layers
App 20210327795 - QIAN; Zhiguo ; et al. | 2021-10-21 |
Package Land Pad In Closed-loop Trace For High Speed Data Signaling
App 20210305138 - ZHANG; Zhichao ; et al. | 2021-09-30 |
Emib Copper Layer For Signal And Power Routing
App 20210296240 - Mekonnen; Yidnekachew S. ; et al. | 2021-09-23 |
Multi-layered Adhesion Promotion Films
App 20210257309 - Pietambaram; Srinivas V. ; et al. | 2021-08-19 |
Bridge die design for high bandwidth memory interface
Grant 11,094,633 - Qian , et al. August 17, 2 | 2021-08-17 |
Slow wave structure for millimeter wave antennas
Grant 11,095,045 - Zhang , et al. August 17, 2 | 2021-08-17 |
Fine feature formation techniques for printed circuit boards
Grant 11,089,689 - Li , et al. August 10, 2 | 2021-08-10 |
Package substrates with magnetic build-up layers
Grant 11,081,434 - Qian , et al. August 3, 2 | 2021-08-03 |
Die Interconnect Structures And Methods
App 20210167015 - Qian; Zhiguo ; et al. | 2021-06-03 |
Minimizing Package Impedance Discontinuity Through Dielectric Structure Optimizations
App 20210125912 - QIAN; Zhiguo ; et al. | 2021-04-29 |
Simplified multimode signaling techniques
Grant 10,992,342 - Mekonnen , et al. April 27, 2 | 2021-04-27 |
Interconnect Loss Of High Density Package With Magnetic Material
App 20210104476 - QIAN; Zhiguo ; et al. | 2021-04-08 |
Semiconductor package with through bridge die connections
Grant 10,950,550 - Qian , et al. March 16, 2 | 2021-03-16 |
High Density Interconnect Structures Configured For Manufacturing And Performance
App 20210057345 - Braunisch; Henning ; et al. | 2021-02-25 |
Ground Via Clustering For Crosstalk Mitigation
App 20210057321 - Qian; Zhiguo ; et al. | 2021-02-25 |
Conductive coating for a microelectronics package
Grant 10,910,314 - Weng , et al. February 2, 2 | 2021-02-02 |
Die interconnect structures and methods
Grant 10,892,225 - Qian , et al. January 12, 2 | 2021-01-12 |
Rlink-on-die interconnect features to enable signaling
Grant 10,886,171 - Zhang , et al. January 5, 2 | 2021-01-05 |
High density interconnect structures configured for manufacturing and performance
Grant 10,867,926 - Braunisch , et al. December 15, 2 | 2020-12-15 |
Dielectric-filled Trench Isolation Of Vias
App 20200388572 - Aygun; Kemal ; et al. | 2020-12-10 |
Horizontal Pitch Translation Using Embedded Bridge Dies
App 20200381350 - SHARAN; Sujit ; et al. | 2020-12-03 |
Ground via clustering for crosstalk mitigation
Grant 10,854,539 - Qian , et al. December 1, 2 | 2020-12-01 |
Package Substrates With Magnetic Build-up Layers
App 20200373232 - QIAN; Zhiguo ; et al. | 2020-11-26 |
Density-graded Adhesion Layer For Conductors
App 20200365533 - MANEPALLI; RAHUL N. ; et al. | 2020-11-19 |
High density interconnect structures configured for manufacturing and performance
Grant 10,833,020 - Braunisch , et al. November 10, 2 | 2020-11-10 |
Optimal Signal Routing Performance Through Dielectric Material Configuration Designs In Package Substrate
App 20200343175 - QIAN; Zhiguo ; et al. | 2020-10-29 |
Package Design Scheme For Enabling High-speed Low-loss Signaling And Mitigation Of Manufacturing Risk And Cost
App 20200343202 - WANG; Lijiang ; et al. | 2020-10-29 |
Electrical connector having offset contacts for minimizing or cancelling crosstalk
Grant 10,804,650 - Lee , et al. October 13, 2 | 2020-10-13 |
Rlink--die to die channel interconnect configurations to improve signaling
Grant 10,784,204 - Aygun , et al. Sept | 2020-09-22 |
Pin Count Socket Having Reduced Pin Count And Pattern Transformation
App 20200296852 - Nekkanty; Srikant ; et al. | 2020-09-17 |
MINIMIZATION OF INSERTION LOSS VARIATION IN THROUGH-SILICON VIAS (TSVs)
App 20200279793 - XIE; Jianyong ; et al. | 2020-09-03 |
Package substrates with magnetic build-up layers
Grant 10,748,842 - Qian , et al. A | 2020-08-18 |
Semiconductor Package With Through Bridge Die Connections
App 20200243448 - Qian; Zhiguo ; et al. | 2020-07-30 |
Power Delivery For Embedded Bridge Die Utilizing Trench Structures
App 20200235053 - AYGUN; Kemal ; et al. | 2020-07-23 |
Pin count socket having reduced pin count and pattern transformation
Grant 10,716,231 - Nekkanty , et al. | 2020-07-14 |
Tunable Passive Semiconductor Elements
App 20200203337 - Zhang; Zhichao ; et al. | 2020-06-25 |
Intra-semiconductor Die Communication Via Waveguide In A Multi-die Semiconductor Package
App 20200203293 - Aygun; Kemal ; et al. | 2020-06-25 |
Inorganic interposer for multi-chip packaging
Grant 10,692,847 - Sobieski , et al. | 2020-06-23 |
High Density Interconnect Structures Configured For Manufacturing And Performance
App 20200168553 - Braunisch; Henning ; et al. | 2020-05-28 |
Conductive Coating For A Microelectronics Package
App 20200118930 - Weng; Li-Sheng ; et al. | 2020-04-16 |
Architecture And Processes To Enable High Capacity Memory Packages Through Memory Die Stacking
App 20200105719 - LI; Yi ; et al. | 2020-04-02 |
Pin Count Socket Having Reduced Pin Count And Pattern Transformation
App 20200107463 - Nekkanty; Srikant ; et al. | 2020-04-02 |
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
Grant 10,607,951 - Zhang , et al. | 2020-03-31 |
Electrical Connector Having Offset Contacts For Minimizing Or Cancelling Crosstalk
App 20200083645 - LEE; Jeffrey ; et al. | 2020-03-12 |
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
Grant 10,580,734 - Zhang , et al. | 2020-03-03 |
Rlink - Die To Die Channel Interconnect Configurations To Improve Signaling
App 20200066641 - AYGUN; Kemal ; et al. | 2020-02-27 |
Simplified Multimode Signaling Techniques
App 20200021330 - Mekonnen; Yidnekachew S. ; et al. | 2020-01-16 |
Slow Wave Structure For Millimeter Wave Antennas
App 20200014122 - Zhang; Zhichao ; et al. | 2020-01-09 |
Conductive coating for a microelectronics package
Grant 10,510,667 - Weng , et al. Dec | 2019-12-17 |
Ground Via Clustering For Crosstalk Mitigation
App 20190333848 - QIAN; Zhiguo ; et al. | 2019-10-31 |
Microprocessor package with first level die bump ground webbing structure
Grant 10,453,795 - Zhang , et al. Oc | 2019-10-22 |
Enabling Long Interconnect Bridges
App 20190318993 - Mahajan; Ravindranath V. ; et al. | 2019-10-17 |
Stiffener And Package Substrate For A Semiconductor Package
App 20190311963 - CHRISTIANSON; Stephen ; et al. | 2019-10-10 |
Transmission Line - Land Grid Array (tl-lga) Socket With Cascaded Transmission Line Structures For Maximum Bandwidth And Data Ra
App 20190307010 - ZHANG; Zhichao ; et al. | 2019-10-03 |
Selective Ground Flood Around Reduced Land Pad On Package Base Layer To Enable High Speed Land Grid Array (lga) Socket
App 20190307009 - ZHANG; Zhichao ; et al. | 2019-10-03 |
Package Substrates With Magnetic Build-up Layers
App 20190295936 - QIAN; ZHIGUO ; et al. | 2019-09-26 |
Chip-to-chip interconnect with embedded electro-optical bridge structures
Grant 10,416,378 - Zhang , et al. Sept | 2019-09-17 |
Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contact
Grant 10,396,036 - Zhang , et al. A | 2019-08-27 |
Ground via clustering for crosstalk mitigation
Grant 10,396,022 - Qian , et al. A | 2019-08-27 |
Interconnector With Bundled Interconnects
App 20190252321 - Braunisch; Henning ; et al. | 2019-08-15 |
Method of forming an interference shield on a substrate
Grant 10,375,832 - Raorane , et al. | 2019-08-06 |
Die Interconnect Structures And Methods
App 20190229058 - Qian; Zhiguo ; et al. | 2019-07-25 |
Bridge Die Design For High Bandwidth Memory Interface
App 20190229056 - Qian; Zhiguo ; et al. | 2019-07-25 |
Capacitive structures for crosstalk reduction
Grant 10,317,932 - Zhang , et al. | 2019-06-11 |
Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby
Grant 10,303,225 - Aygun , et al. | 2019-05-28 |
Rlink-on-die Interconnect Features To Enable Signaling
App 20190148227 - ZHANG; Yu Amos ; et al. | 2019-05-16 |
Interconnect routing configurations and associated techniques
Grant 10,283,453 - Qian , et al. | 2019-05-07 |
Methods Of Forming Hybrid Socket Structures For Package Interconnect Applications And Structures Formed Thereby
App 20190101961 - Aygun; Kemal ; et al. | 2019-04-04 |
Fine Feature Formation Techniques For Printed Circuit Boards
App 20190098764 - LI; ERIC ; et al. | 2019-03-28 |
Socket contact techniques and configurations
Grant 10,205,292 - Athreya , et al. Feb | 2019-02-12 |
Chip-to-chip Interconnect With Embedded Electro-optical Bridge Structures
App 20180372952 - ZHANG; ZHICHAO ; et al. | 2018-12-27 |
Ground Plane Vertical Isolation Of, Ground Line Coaxial Isolation Of, And Impedance Tuning Of Horizontal Data Signal Transmission Lines Routed Through Package Devices
App 20180374804 - ZHANG; Yu Amos ; et al. | 2018-12-27 |
Microprocessor Package With First Level Die Bump Ground Webbing Structure
App 20180331035 - ZHANG; Yu Amos ; et al. | 2018-11-15 |
Ground Plane Vertical Isolation Of, Ground Line Coaxial Isolation Of, And Impedance Tuning Of Horizontal Data Signal Transmission Lines Routed Through Package Devices
App 20180331036 - ZHANG; Yu Amos ; et al. | 2018-11-15 |
Rlink-ground Shielding Attachment Structures And Shadow Voiding For Data Signal Contacts Of Package Devices; Vertical Ground Shielding Structures And Shield Fencing Of Vertical Data Signal Interconnects Of Package Devices; And Ground Shielding For Electro Optical Module Connector Data Signal Contact
App 20180331043 - ZHANG; Yu Amos ; et al. | 2018-11-15 |
Ground Via Clustering For Crosstalk Mitigation
App 20180315688 - Qian; Zhiguo ; et al. | 2018-11-01 |
Coupled vias for channel cross-talk reduction
Grant 10,103,054 - Zhang , et al. October 16, 2 | 2018-10-16 |
Flexible Electronic Assembly Method
App 20180263117 - Oster; Sasha N. ; et al. | 2018-09-13 |
Shielding Mold For Electric And Magnetic Emi Mitigation
App 20180263107 - Zhang; Zhichao ; et al. | 2018-09-13 |
Inorganic Interposer For Multi-chip Packaging
App 20180240788 - Sobieski; Daniel ; et al. | 2018-08-23 |
Interposer structures, semiconductor assembly and methods for forming interposer structures
Grant 10,056,528 - Qian , et al. August 21, 2 | 2018-08-21 |
Ground via clustering for crosstalk mitigation
Grant 10,026,682 - Qian , et al. July 17, 2 | 2018-07-17 |
Conductive Coating For A Microelectronics Package
App 20180174972 - Weng; Li-Sheng ; et al. | 2018-06-21 |
Chip-to-chip interconnect with embedded electro-optical bridge structures
Grant 9,971,089 - Zhang , et al. May 15, 2 | 2018-05-15 |
Rlink-on-die inductor structures to improve signaling
Grant 9,935,063 - Zhang , et al. April 3, 2 | 2018-04-03 |
Helically insulated twinax cable systems and methods
Grant 9,922,751 - Zhang , et al. March 20, 2 | 2018-03-20 |
Inductors for circuit board through hole structures
Grant 9,894,752 - Zhang , et al. February 13, 2 | 2018-02-13 |
Socket Contact Techniques And Configurations
App 20180019558 - Athreya; Dhanya ; et al. | 2018-01-18 |
Capacitive Structures For Crosstalk Reduction
App 20180007782 - ZHANG; ZHICHAO ; et al. | 2018-01-04 |
Rlink - On-die Inductor Structures To Improve Signaling
App 20180005965 - ZHANG; Yu Amos ; et al. | 2018-01-04 |
High density interconnection of microelectronic devices
Grant 9,842,832 - Karhade , et al. December 12, 2 | 2017-12-12 |
Flexible electronic assembly method
Grant 9,820,384 - Oster , et al. November 14, 2 | 2017-11-14 |
Non-uniform substrate stackup
Grant 9,806,011 - Zhang , et al. October 31, 2 | 2017-10-31 |
Shielding mold for electric and magnetic EMI mitigation
Grant 9,807,866 - Zhang , et al. October 31, 2 | 2017-10-31 |
Electrical Cable
App 20170288290 - Oster; Sasha N. ; et al. | 2017-10-05 |
Helically Insulated Twinax Cable Systems And Methods
App 20170287591 - Zhang; Zhichao ; et al. | 2017-10-05 |
Socket contact techniques and configurations
Grant 9,780,510 - Athreya , et al. October 3, 2 | 2017-10-03 |
Non-uniform Substrate Stackup
App 20170221727 - Zhang; Zhichao ; et al. | 2017-08-03 |
Shielded bundle interconnect
App 20170187419 - Zhang; Yu ; et al. | 2017-06-29 |
Chip-to-chip Interconnect With Embedded Electro-optical Bridge Structures
App 20170168235 - ZHANG; ZHICHAO ; et al. | 2017-06-15 |
Shielding Mold For Electric And Magnetic Emi Mitigation
App 20170156202 - Zhang; Zhichao ; et al. | 2017-06-01 |
Ground Via Clustering For Crosstalk Mitigation
App 20170148714 - Qian; Zhiguo ; et al. | 2017-05-25 |
Routing design for high speed input/output links
Grant 9,622,339 - Qian , et al. April 11, 2 | 2017-04-11 |
Impedance Matching Interconnect
App 20170085243 - LEE; BEOM-TAEK ; et al. | 2017-03-23 |
Interconnect Routing Configurations And Associated Techniques
App 20170040264 - Qian; Zhiguo ; et al. | 2017-02-09 |
Crosstalk polarity reversal and cancellation through substrate material
Grant 9,564,407 - Zhang , et al. February 7, 2 | 2017-02-07 |
Interconnect routing configurations and associated techniques
Grant 9,542,522 - Qian , et al. January 10, 2 | 2017-01-10 |
Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects
Grant 9,515,031 - Altunyurt , et al. December 6, 2 | 2016-12-06 |
Ground via clustering for crosstalk mitigation
Grant 9,515,017 - Qian , et al. December 6, 2 | 2016-12-06 |
Snap connector for socket assembly and associated techniques and configurations
Grant 9,478,881 - Zhang , et al. October 25, 2 | 2016-10-25 |
High Density Interconnection Of Microelectronic Devices
App 20160300824 - Karhade; Omkar G. ; et al. | 2016-10-13 |
Crosstalk Polarity Reversal And Cancellation Through Substrate Material
App 20160300803 - Zhang; Zhichao ; et al. | 2016-10-13 |
Inductors For Circuit Board Through Hole Structures
App 20160276092 - Zhang; Zhichao ; et al. | 2016-09-22 |
Inductors For Circuit Board Through Hole Structures
App 20160276091 - Zhang; Zhichao ; et al. | 2016-09-22 |
Snap Connector For Socket Assembly And Associated Techniques And Configurations
App 20160268710 - Zhang; Zhichao ; et al. | 2016-09-15 |
Socket Contact Techniques And Configurations
App 20160254629 - Athreya; Dhanya ; et al. | 2016-09-01 |
High density interconnection of microelectronic devices
Grant 9,397,071 - Karhade , et al. July 19, 2 | 2016-07-19 |
Crosstalk polarity reversal and cancellation through substrate material tuning
Grant 9,391,018 - Zhang , et al. July 12, 2 | 2016-07-12 |
Ground Via Clustering For Crosstalk Mitigation
App 20160181189 - Qian; Zhiguo ; et al. | 2016-06-23 |
Non-uniform Substrate Stackup
App 20160104632 - Zhang; Zhichao ; et al. | 2016-04-14 |
Interconnect Routing Configurations And Associated Techniques
App 20160085899 - Qian; Zhiguo ; et al. | 2016-03-24 |
Thin Film Based Electromagnetic Interference Shielding With Bbul/coreless Packages
App 20160088738 - RAORANE; Digvijay A. ; et al. | 2016-03-24 |
X-line routing for dense multi-chip-package interconnects
Grant 9,240,377 - Qian , et al. January 19, 2 | 2016-01-19 |
Ground via clustering for crosstalk mitigation
Grant 9,230,900 - Qian , et al. January 5, 2 | 2016-01-05 |
Non-uniform substrate stackup
Grant 9,232,639 - Zhang , et al. January 5, 2 | 2016-01-05 |
Thin film based electromagnetic interference shielding with BBUL/coreless packages
Grant 9,232,686 - Raorane , et al. January 5, 2 | 2016-01-05 |
Thin Film Based Electromagnetic Interference Shielding With Bbul/coreless Packages
App 20150282395 - RAORANE; Digvijay A. ; et al. | 2015-10-01 |
Stubby pads for channel cross-talk reduction
Grant 9,105,635 - Altunyurt , et al. August 11, 2 | 2015-08-11 |
Mechanism for facilitating dynamic cancellation of signal crosstalk in differential input/output channels
Grant 9,069,910 - Zhang , et al. June 30, 2 | 2015-06-30 |
High Density Interconnection Of Microelectronic Devices
App 20150163904 - Karhade; Omkar G. ; et al. | 2015-06-11 |
Flexible Electronic Assembly And Method
App 20150163921 - Oster; Sasha ; et al. | 2015-06-11 |
X-line Routing For Dense Multi-chip-package Interconnects
App 20150102477 - Qian; Zhiguo ; et al. | 2015-04-16 |
X-line routing for dense multi-chip-package interconnects
Grant 8,946,900 - Qian , et al. February 3, 2 | 2015-02-03 |
Stubby Pads For Channel Cross-talk Reduction
App 20140264907 - ALTUNYURT; Nevin ; et al. | 2014-09-18 |
Coupled Vias For Channel Cross-talk Reduction
App 20140268614 - ZHANG; Zhichao ; et al. | 2014-09-18 |
Mitigation Of Far-end Crosstalk Induced By Routing And Out-of-plane Interconnects
App 20140203417 - Altunyurt; Nevin ; et al. | 2014-07-24 |
Mechanism For Facilitating Dynamic Cancellation Of Signal Crosstalk In Differential Input/output Channels
App 20140189190 - ZHANG; ZHICHAO ; et al. | 2014-07-03 |
Non-uniform Substrate Stackup
App 20140160707 - Zhang; Zhichao ; et al. | 2014-06-12 |
Crosstalk Polarity Reversal And Cancellation Through Substrate Material Tuning
App 20140151875 - ZHANG; Zhichao ; et al. | 2014-06-05 |
X-line Routing For Dense Multi-chip-package Interconnects
App 20140117552 - Qian; Zhiguo ; et al. | 2014-05-01 |
Routing Design For High Speed Input/output Links
App 20140071646 - Qian; Zhiguo ; et al. | 2014-03-13 |
Crosstalk polarity reversal and cancellation through substrate material tuning
Grant 8,643,184 - Zhang , et al. February 4, 2 | 2014-02-04 |
Package embedded equalizer
Grant 8,558,636 - Shin , et al. October 15, 2 | 2013-10-15 |
Flex cable and method for making the same
Grant 8,508,947 - Ganesan , et al. August 13, 2 | 2013-08-13 |
Multimode signaling on decoupled input/output and power channels
Grant 8,450,201 - Braunisch , et al. May 28, 2 | 2013-05-28 |
Core Via For Chip Package And Interconnect
App 20120180312 - Zhang; Zhichao ; et al. | 2012-07-19 |
Input/output package architectures
Grant 8,188,594 - Ganesan , et al. May 29, 2 | 2012-05-29 |
Flex Cable And Method For Making The Same
App 20120081858 - Ganesan; Sanka ; et al. | 2012-04-05 |
Multimode Signaling on Decoupled Input/Output and Power Channels
App 20110247195 - Braunisch; Henning ; et al. | 2011-10-13 |
Shielded socket housing
Grant 8,025,531 - Zhang , et al. September 27, 2 | 2011-09-27 |
Multimode signaling on decoupled input/output and power channels
Grant 7,989,946 - Braunisch , et al. August 2, 2 | 2011-08-02 |
Multimode Signaling on Decoupled Input/Output and Power Channels
App 20110019386 - Braunisch; Henning ; et al. | 2011-01-27 |
Core via for chip package and interconnect
App 20100326716 - Zhang; Zhichao ; et al. | 2010-12-30 |
Multimode signaling on decoupled input/output and power channels
Grant 7,816,779 - Braunisch , et al. October 19, 2 | 2010-10-19 |
Input/output package architectures, and methods of using same
Grant 7,705,447 - Ganesan , et al. April 27, 2 | 2010-04-27 |
Input/output package architectures, and methods of using same
App 20100096743 - Ganesan; Sanka ; et al. | 2010-04-22 |
Package using array capacitor core
Grant 7,692,284 - Eilert , et al. April 6, 2 | 2010-04-06 |
Input/output Package Architectures, And Methods Of Using Same
App 20100078781 - Ganesan; Sanka ; et al. | 2010-04-01 |
Multimode signaling on decoupled input/output and power channels
App 20100002398 - Braunisch; Henning ; et al. | 2010-01-07 |
Printed Circuit Assembly And Method For Measuring Characteristic Impedance
App 20090322350 - Aygun; Kemal ; et al. | 2009-12-31 |
Package Embedded Equalizer
App 20080238587 - Shin; Jaemin ; et al. | 2008-10-02 |
Controlled equivalent series resistance capacitor
Grant 7,361,969 - Hill , et al. April 22, 2 | 2008-04-22 |
Package using array capacitor core
App 20070134925 - Eilert; Kimberly D. ; et al. | 2007-06-14 |
Controlled equivalent series resistance capacitor
App 20070007573 - Hill; Michael J. ; et al. | 2007-01-11 |
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