| Patent | Date |
|---|
Microelectronic assemblies having magnetic core inductors
Grant 11,450,560 - Bharath , et al. September 20, 2 | 2022-09-20 |
Microelectronic assemblies with communication networks
Grant 11,437,348 - Elsherbini , et al. September 6, 2 | 2022-09-06 |
Mmwave waveguides featuring power-over-waveguide technology for automotive applications
Grant 11,437,693 - Dogiamis , et al. September 6, 2 | 2022-09-06 |
Microelectronic Assemblies
App 20220278057 - Elsherbini; Adel A. ; et al. | 2022-09-01 |
Diodes for package substrate electrostatic discharge (ESD) protection
Grant 11,424,239 - Aleksov , et al. August 23, 2 | 2022-08-23 |
Dies with integrated voltage regulators
Grant 11,417,593 - Elsherbini , et al. August 16, 2 | 2022-08-16 |
Microelectronic Assemblies
App 20220254754 - ELSHERBINI; Adel A. ; et al. | 2022-08-11 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20220231394 - ELSHERBINI; Adel A. ; et al. | 2022-07-21 |
Microelectronic Assemblies
App 20220230964 - Liff; Shawna M. ; et al. | 2022-07-21 |
Multi-chip package with high density interconnects
Grant 11,393,766 - Aleksov , et al. July 19, 2 | 2022-07-19 |
Microelectronic assemblies
Grant 11,393,777 - Elsherbini , et al. July 19, 2 | 2022-07-19 |
Microelectronic Assemblies
App 20220223561 - Liff; Shawna M. ; et al. | 2022-07-14 |
Microelectronic Assemblies
App 20220223578 - Elsherbini; Adel A. ; et al. | 2022-07-14 |
Microelectronic Assemblies With Communication Networks
App 20220216182 - Elsherbini; Adel A. ; et al. | 2022-07-07 |
Carrier For Microelectronic Assemblies Having Direct Bonding
App 20220199450 - Liff; Shawna M. ; et al. | 2022-06-23 |
Shield Structures In Microelectronic Assemblies Having Direct Bonding
App 20220199546 - Elsherbini; Adel A. ; et al. | 2022-06-23 |
Semiconductor package or structure with dual-sided interposers and memory
Grant 11,367,707 - Liff , et al. June 21, 2 | 2022-06-21 |
Microelectronic assemblies with communication networks
Grant 11,367,689 - Elsherbini , et al. June 21, 2 | 2022-06-21 |
Hermetic Sealing Structures In Microelectronic Assemblies Having Direct Bonding
App 20220189861 - Aleksov; Aleksandar ; et al. | 2022-06-16 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189839 - Eid; Feras ; et al. | 2022-06-16 |
Inter-component Material In Microelectronic Assemblies Having Direct Bonding
App 20220189850 - Liff; Shawna M. ; et al. | 2022-06-16 |
Hermetic Sealing Structures In Microelectronic Assemblies Having Direct Bonding
App 20220192042 - Kabir; Mohammad Enamul ; et al. | 2022-06-16 |
Electrostatic Discharge Protection In Integrated Circuits
App 20220181276 - Elsherbini; Adel A. ; et al. | 2022-06-09 |
Dielectric Waveguide Including A Dielectric Material With Cavities Therein Surrounded By A Conductive Coating Forming A Wall For The Cavities
App 20220173489 - Dogiamis; Georgios ; et al. | 2022-06-02 |
Package spark gap structure
Grant 11,348,882 - Aleksov , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,348,912 - Elsherbini , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,348,895 - Liff , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies
Grant 11,348,897 - Elsherbini , et al. May 31, 2 | 2022-05-31 |
Microelectronic assemblies with communication networks
Grant 11,342,305 - Elsherbini , et al. May 24, 2 | 2022-05-24 |
Microelectronic assemblies
Grant 11,342,320 - Elsherbini , et al. May 24, 2 | 2022-05-24 |
Microelectronic assemblies
Grant 11,335,642 - Liff , et al. May 17, 2 | 2022-05-17 |
Fast-lane routing for multi-chip packages
Grant 11,336,559 - Elsherbini , et al. May 17, 2 | 2022-05-17 |
Microelectronic assemblies
Grant 11,335,663 - Liff , et al. May 17, 2 | 2022-05-17 |
Microelectronic assemblies
Grant 11,335,665 - Liff , et al. May 17, 2 | 2022-05-17 |
Microelectronic Assemblies With Substrate Integrated Waveguide
App 20220149500 - Dogiamis; Georgios ; et al. | 2022-05-12 |
Die Backend Diodes For Electrostatic Discharge (esd) Protection
App 20220149036 - Aleksov; Aleksandar ; et al. | 2022-05-12 |
Low loss and low cross talk transmission lines having l-shaped cross sections
Grant 11,329,358 - Elsherbini , et al. May 10, 2 | 2022-05-10 |
Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities
Grant 11,329,359 - Dogiamis , et al. May 10, 2 | 2022-05-10 |
Quantum Computing Assemblies
App 20220140085 - Roberts; Jeanette M. ; et al. | 2022-05-05 |
Electrostatic discharge protection in integrated circuits
Grant 11,296,040 - Elsherbini , et al. April 5, 2 | 2022-04-05 |
TSV-less die stacking using plated pillars/through mold interconnect
Grant 11,296,052 - Meyers , et al. April 5, 2 | 2022-04-05 |
Conductive Contact Structures For Electrostatic Discharge Protection In Integrated Circuits
App 20220102270 - Elsherbini; Adel A. ; et al. | 2022-03-31 |
Gallium Nitride (gan) Three-dimensional Integrated Circuit Technology
App 20220102339 - THEN; Han Wui ; et al. | 2022-03-31 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20220102261 - ELSHERBINI; Adel A. ; et al. | 2022-03-31 |
Gallium Nitride (gan) Three-dimensional Integrated Circuit Technology
App 20220102344 - THEN; Han Wui ; et al. | 2022-03-31 |
Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity
Grant 11,289,431 - Eid , et al. March 29, 2 | 2022-03-29 |
Direct Bonding In Microelectronic Assemblies
App 20220093561 - Eid; Feras ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093492 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Package-integrated Bistable Switch For Electrostatic Discharge (esd) Protection
App 20220093531 - Eid; Feras ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093546 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Capacitors And Resistors At Direct Bonding Interfaces In Microelectronic Assemblies
App 20220093725 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Direct Bonding In Microelectronic Assemblies
App 20220093517 - Aleksov; Aleksandar ; et al. | 2022-03-24 |
Microelectronic Assemblies With Inductors In Direct Bonding Regions
App 20220093547 - Elsherbini; Adel A. ; et al. | 2022-03-24 |
Tandem Magnetics In Package
App 20220084736 - CHOI; Beomseok ; et al. | 2022-03-17 |
Embedded Cooling Channel In Magnetics
App 20220084740 - CHOI; Beomseok ; et al. | 2022-03-17 |
Microelectronic assemblies comprising a package substrate portion integrated with a substrate integrated waveguide filter
Grant 11,264,687 - Dogiamis , et al. March 1, 2 | 2022-03-01 |
Die backend diodes for electrostatic discharge (ESD) protection
Grant 11,264,373 - Aleksov , et al. March 1, 2 | 2022-03-01 |
Microelectronic Assemblies With Communication Networks
App 20220051987 - Elsherbini; Adel A. ; et al. | 2022-02-17 |
Conductive contact structures for electrostatic discharge protection in integrated circuits
Grant 11,239,155 - Elsherbini , et al. February 1, 2 | 2022-02-01 |
High performance integrated RF passives using dual lithography process
Grant 11,227,825 - Elsherbini , et al. January 18, 2 | 2022-01-18 |
Package integrated security features
Grant 11,223,524 - Liff , et al. January 11, 2 | 2022-01-11 |
Package-integrated bistable switch for electrostatic discharge (ESD) protection
Grant 11,222,856 - Eid , et al. January 11, 2 | 2022-01-11 |
Microelectronic assemblies with communication networks
Grant 11,217,535 - Elsherbini , et al. January 4, 2 | 2022-01-04 |
Microelectronic Package Electrostatic Discharge (esd) Protection
App 20210410343 - Strong; Veronica Aleman ; et al. | 2021-12-30 |
Methods For Conductively Coating Millimeter Waveguides
App 20210376437 - Aleksov; Aleksandar ; et al. | 2021-12-02 |
Electrostatic discharge protection in integrated circuits
Grant 11,189,580 - Elsherbini , et al. November 30, 2 | 2021-11-30 |
Quantum circuit assemblies with on-chip demultiplexers
Grant 11,177,912 - Elsherbini , et al. November 16, 2 | 2021-11-16 |
Microelectronic package electrostatic discharge (ESD) protection
Grant 11,147,197 - Strong , et al. October 12, 2 | 2021-10-12 |
Methods for conductively coating millimeter waveguides
Grant 11,095,012 - Aleksov , et al. August 17, 2 | 2021-08-17 |
Scalable Embedded Silicon Bridge Via Pillars In Lithographically Defined Vias, And Methods Of Making Same
App 20210225807 - ELSHERBINI; Adel A. ; et al. | 2021-07-22 |
Electrostatic Discharge Protection In Integrated Circuits Using Positive Temperature Coefficient Material
App 20210202404 - Eid; Feras ; et al. | 2021-07-01 |
Electrostatic Discharge Protection In Integrated Circuits Using Materials With Optically Controlled Electrical Conductivity
App 20210202403 - Eid; Feras ; et al. | 2021-07-01 |
Electrostatic Discharge Protection In Integrated Circuits
App 20210193596 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Package-integrated Bistable Switch For Electrostatic Discharge (esd) Protection
App 20210193597 - Eid; Feras ; et al. | 2021-06-24 |
Die Backend Diodes For Electrostatic Discharge (esd) Protection
App 20210193645 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Semiconductor Packaging With High Density Interconnects
App 20210193583 - ELSHERBINI; Adel A. ; et al. | 2021-06-24 |
Diodes For Package Substrate Electrostatic Discharge (esd) Protection
App 20210193644 - Aleksov; Aleksandar ; et al. | 2021-06-24 |
Electrostatic Discharge Protection In Integrated Circuits
App 20210193595 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Low-weight Single Mm-wave Dielectric Waveguide Interconnect Architecture In Autonomous Cars
App 20210194966 - DOGIAMIS; Georgios C. ; et al. | 2021-06-24 |
Conductive Contact Structures For Electrostatic Discharge Protection In Integrated Circuits
App 20210193571 - Elsherbini; Adel A. ; et al. | 2021-06-24 |
Substrate dielectric waveguides in semiconductor packages
Grant 11,037,892 - Nair , et al. June 15, 2 | 2021-06-15 |
Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric
Grant 11,031,666 - Elsherbini , et al. June 8, 2 | 2021-06-08 |
Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer
Grant 11,024,933 - Rawlings , et al. June 1, 2 | 2021-06-01 |
Package Spark Gap Structure
App 20210143111 - Aleksov; Aleksandar ; et al. | 2021-05-13 |
Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same
Grant 11,004,824 - Elsherbini , et al. May 11, 2 | 2021-05-11 |
Cross talk and interference reduction for high frequency wireless interconnects
Grant 10,992,021 - Elsherbini , et al. April 27, 2 | 2021-04-27 |
Microelectronic Package Electrostatic Discharge (esd) Protection
App 20210120708 - Strong; Veronica Aleman ; et al. | 2021-04-22 |
Microelectronic Assemblies
App 20210111156 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111155 - Liff; Shawna M. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111147 - Liff; Shawna M. ; et al. | 2021-04-15 |
Microelectronic Assemblies With Communication Networks
App 20210111154 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies With Communication Networks
App 20210111124 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Microelectronic Assemblies
App 20210111170 - Elsherbini; Adel A. ; et al. | 2021-04-15 |
Package power delivery using plane and shaped vias
Grant 10,971,416 - Bharath , et al. April 6, 2 | 2021-04-06 |
Semiconductor packaging with high density interconnects
Grant 10,971,453 - Elsherbini , et al. April 6, 2 | 2021-04-06 |
Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide
Grant 10,964,992 - Dogiamis , et al. March 30, 2 | 2021-03-30 |
System comprising first and second servers interconnected by a plurality of joined waveguide sections
Grant 10,950,919 - Kamgaing , et al. March 16, 2 | 2021-03-16 |
Piezoelectric package-integrated current sensing devices
Grant 10,921,349 - Dogiamis , et al. February 16, 2 | 2021-02-16 |
Crimped mm-wave waveguide tap connector
Grant 10,921,524 - Elsherbini , et al. February 16, 2 | 2021-02-16 |
Microelectronic Package Communication Using Radio Interfaces Connected Through Wiring
App 20210041647 - LIFF; Shawna ; et al. | 2021-02-11 |
Piezoelectric package-integrated film bulk acoustic resonator devices
Grant 10,903,818 - Nair , et al. January 26, 2 | 2021-01-26 |
Piezoelectric package-integrated contour mode filter devices
Grant 10,897,238 - Eid , et al. January 19, 2 | 2021-01-19 |
Package architecture for antenna arrays
Grant 10,868,366 - Elsherbini , et al. December 15, 2 | 2020-12-15 |
Mmwave Waveguides Featuring Power-over-waveguide Technology For Automotive Applications
App 20200388898 - DOGIAMIS; Georgios C. ; et al. | 2020-12-10 |
Inter-die passive interconnects approaching monolithic performance
Grant 10,854,548 - Wu , et al. December 1, 2 | 2020-12-01 |
Microelectronic package communication using radio interfaces connected through wiring
Grant 10,852,495 - Liff , et al. December 1, 2 | 2020-12-01 |
Substrate Engineering For Qubits
App 20200373351 - Roberts; Jeanette M. ; et al. | 2020-11-26 |
Reducing crosstalk from flux bias lines in qubit devices
Grant 10,847,705 - Lampert , et al. November 24, 2 | 2020-11-24 |
Quantum Computing Assemblies
App 20200364600 - Elsherbini; Adel A. ; et al. | 2020-11-19 |
Piezoelectric package-integrated sensing devices
Grant 10,840,430 - Eid , et al. November 17, 2 | 2020-11-17 |
Semiconductor packages with antennas
Grant 10,804,227 - Kamgaing , et al. October 13, 2 | 2020-10-13 |
Quantum circuit assemblies with Josephson junctions utilizing resistive switching materials
Grant 10,803,396 - Yoscovits , et al. October 13, 2 | 2020-10-13 |
Multi-chip Package With High Density Interconnects
App 20200321281 - Aleksov; Aleksandar ; et al. | 2020-10-08 |
Stacked Platforms With Waveguide Interconnects
App 20200315052 - Kamgaing; Telesphor ; et al. | 2020-10-01 |
Distributed On-package Millimeter-wave Radio
App 20200313306 - Kamgaing; Telesphor ; et al. | 2020-10-01 |
Microelectronic Package With Radio Frequency (rf) Chiplet
App 20200303329 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Contactless High-frequency Interconnect
App 20200303328 - Braunisch; Henning ; et al. | 2020-09-24 |
Waveguide Fan-out
App 20200303327 - Elsherbini; Adel A. ; et al. | 2020-09-24 |
Waveguide Interconnect For Packages
App 20200294940 - Dogiamis; Georgios ; et al. | 2020-09-17 |
Multi-package On-board Waveguide Interconnects
App 20200296823 - Kamgaing; Telesphor ; et al. | 2020-09-17 |
Microelectronic Assemblies
App 20200286745 - Elsherbini; Adel A. ; et al. | 2020-09-10 |
Semiconductor Packages With Antennas
App 20200286841 - Kamgaing; Telesphor ; et al. | 2020-09-10 |
Microelectronic Assemblies
App 20200286871 - Liff; Shawna M. ; et al. | 2020-09-10 |
Microelectronic Assemblies
App 20200279829 - Elsherbini; Adel A. ; et al. | 2020-09-03 |
Microelectronic Assemblies
App 20200279813 - Liff; Shawna M. ; et al. | 2020-09-03 |
Microelectronic Assemblies
App 20200273839 - ELSHERBINI; Adel A. ; et al. | 2020-08-27 |
Microelectronic Assemblies With Communication Networks
App 20200273840 - Elsherbini; Adel A. ; et al. | 2020-08-27 |
Quantum computing assemblies with through-hole dies
Grant 10,756,004 - Elsherbini , et al. A | 2020-08-25 |
Quantum dot device packages
Grant 10,756,202 - Roberts , et al. A | 2020-08-25 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,734,236 - Oster , et al. | 2020-08-04 |
Multi-chip package with high density interconnects
Grant 10,727,185 - Aleksov , et al. | 2020-07-28 |
Microelectronic Assemblies
App 20200235061 - Elsherbini; Adel A. ; et al. | 2020-07-23 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20200235449 - ELSHERBINI; Adel A. ; et al. | 2020-07-23 |
Piezoelectric package-integrated acoustic transducer devices
Grant 10,721,568 - Dogiamis , et al. | 2020-07-21 |
Microelectronic Assemblies
App 20200227401 - Elsherbini; Adel A. ; et al. | 2020-07-16 |
Microelectronic Assemblies
App 20200227384 - Liff; Shawna M. ; et al. | 2020-07-16 |
Microelectronic Assemblies
App 20200227377 - Liff; Shawna M. ; et al. | 2020-07-16 |
Microelectronic Assemblies With Communication Networks
App 20200219815 - Elsherbini; Adel A. ; et al. | 2020-07-09 |
Tsv-less Die Stacking Using Plated Pillars/through Mold Interconnect
App 20200212012 - MEYERS; Preston T. ; et al. | 2020-07-02 |
Inter-die Passive Interconnects Approaching Monolithic Performance
App 20200211965 - Wu; Zuoguo ; et al. | 2020-07-02 |
Quantum circuit assemblies with at least partially buried transmission lines and capacitors
Grant 10,686,007 - George , et al. | 2020-06-16 |
Thin electronic package elements using laser spallation
Grant 10,672,701 - Raghunathan , et al. | 2020-06-02 |
Piezoelectric driven switches integrated in organic, flexible displays
Grant 10,658,566 - Liff , et al. | 2020-05-19 |
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs
Grant 10,651,525 - Elsherbini , et al. | 2020-05-12 |
Piezoelectric package-integrated motor
Grant 10,644,616 - Liff , et al. | 2020-05-05 |
Through-mold structures
Grant 10,636,716 - Oster , et al. | 2020-04-28 |
Piezoelectric package-integrated temperature sensing devices
Grant 10,634,566 - Eid , et al. | 2020-04-28 |
Microelectronic Assemblies Having An Integrated Voltage Regulator Chiplet
App 20200105653 - Elsherbini; Adel A. ; et al. | 2020-04-02 |
Microelectronic Assemblies Having Non-rectilinear Arrangements
App 20200098692 - Liff; Shawna M. ; et al. | 2020-03-26 |
Semiconductor Package Or Structure With Dual-sided Interposers And Memory
App 20200098724 - Liff; Shawna M. ; et al. | 2020-03-26 |
Microelectronic Assemblies Having Magnetic Core Inductors
App 20200098621 - Bharath; Krishna ; et al. | 2020-03-26 |
Dies With Integrated Voltage Regulators
App 20200098676 - Elsherbini; Adel A. ; et al. | 2020-03-26 |
Substrate Dielectric Waveguides In Semiconductor Packages
App 20200098710 - NAIR; VIYAY K. ; et al. | 2020-03-26 |
Semiconductor Package Or Semiconductor Package Structure With Dual-sided Interposer And Memory
App 20200098725 - Liff; Shawna M. ; et al. | 2020-03-26 |
Microelectronic Assemblies
App 20200091128 - Elsherbini; Adel A. ; et al. | 2020-03-19 |
Piezoelectric package-integrated delay lines
Grant 10,594,294 - Elsherbini , et al. | 2020-03-17 |
Actuatable and adaptable metamaterials integrated in package
Grant 10,594,029 - Liff , et al. | 2020-03-17 |
Electro-magnetic interference (EMI) shielding techniques and configurations
Grant 10,595,409 - Elsherbini , et al. | 2020-03-17 |
Platform with thermally stable wireless interconnects
Grant 10,593,636 - Dogiamis , et al. | 2020-03-17 |
Serializer-deserializer Die For High Speed Signal Interconnect
App 20200075521 - Elsherbini; Adel A. ; et al. | 2020-03-05 |
Microelectronic Package Communication Using Radio Interfaces Connected Through Wiring
App 20200065263 - LIFF; Shawna ; et al. | 2020-02-27 |
Fast-lane Routing For Multi-chip Packages
App 20200067816 - Elsherbini; Adel A. ; et al. | 2020-02-27 |
Waveguide connector with tapered slot launcher
Grant 10,566,672 - Elsherbini , et al. Feb | 2020-02-18 |
Package Architecture For Antenna Arrays
App 20200036095 - ELSHERBINI; Adel A. ; et al. | 2020-01-30 |
Conductive base embedded interconnect
Grant 10,535,595 - Sankman , et al. Ja | 2020-01-14 |
Microelectronic Assemblies
App 20190385977 - Elsherbini; Adel A. ; et al. | 2019-12-19 |
Package Power Delivery Using Plane And Shaped Vias
App 20190355636 - Bharath; Krishna ; et al. | 2019-11-21 |
Reduced Dispersion Dielectric Waveguides
App 20190356033 - Dogiamis; Georgios ; et al. | 2019-11-21 |
Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle
Grant 10,484,120 - Oster , et al. Nov | 2019-11-19 |
Three-dimensional small form factor system in package architecture
Grant 10,483,250 - Nair , et al. Nov | 2019-11-19 |
Communication between integrated circuit packages using a millimeter-wave wireless radio fabric
Grant 10,476,545 - Elsherbini , et al. Nov | 2019-11-12 |
Package substrates with top superconductor layers for qubit devices
Grant 10,468,578 - Elsherbini , et al. No | 2019-11-05 |
Assembly and manufacturing friendly waveguide launchers
Grant 10,468,737 - Dogiamis , et al. No | 2019-11-05 |
Semiconductor Packages With Antennas
App 20190333882 - KAMGAING; Telesphor ; et al. | 2019-10-31 |
Microelectronic package communication using radio interfaces connected through waveguides
Grant 10,452,571 - Oster , et al. Oc | 2019-10-22 |
Complex cavity formation in molded packaging structures
Grant 10,446,461 - Oster , et al. Oc | 2019-10-15 |
Quantum Dot Device Packages
App 20190312128 - Roberts; Jeanette M. ; et al. | 2019-10-10 |
Microelectronic Assemblies With Substrate Integrated Waveguide
App 20190305396 - Dogiamis; Georgios ; et al. | 2019-10-03 |
Piezoelectric package-integrated crystal devices
Grant 10,432,167 - Elsherbini , et al. O | 2019-10-01 |
Distributed On-package Millimeter-wave Radio
App 20190288404 - Kamgaing; Telesphor ; et al. | 2019-09-19 |
Package power delivery using plane and shaped vias
Grant 10,410,939 - Bharath , et al. Sept | 2019-09-10 |
Superconducting Qubit Device Packages
App 20190273197 - Roberts; Jeanette M. ; et al. | 2019-09-05 |
Semiconductor Packaging With High Density Interconnects
App 20190259705 - Elsherbini; Adel A. ; et al. | 2019-08-22 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20190259622 - OSTER; Sasha N. ; et al. | 2019-08-22 |
Lithographacally defined vias for organic package substrate scaling
Grant 10,381,291 - Elsherbini , et al. A | 2019-08-13 |
Quantum computing assemblies
Grant 10,380,496 - Elsherbini , et al. A | 2019-08-13 |
Assembly architecture employing organic support for compact and improved assembly throughput
Grant 10,368,439 - Elsherbini , et al. July 30, 2 | 2019-07-30 |
Dual-sided die packages
Grant 10,361,142 - Braunisch , et al. | 2019-07-23 |
Flexible and stretchable optical interconnect in wearable systems
Grant 10,353,146 - Aleksov , et al. July 16, 2 | 2019-07-16 |
Crimped Mm-wave Waveguide Tap Connector
App 20190204508 - ELSHERBINI; Adel A. ; et al. | 2019-07-04 |
Assembly And Manufacturing Friendly Waveguide Launchers
App 20190207287 - DOGIAMIS; Georgios C. ; et al. | 2019-07-04 |
Co-extrusion Of Multi-material Sets For Millimeter-wave Waveguide Fabrication
App 20190207290 - Rawlings; Brandon M. ; et al. | 2019-07-04 |
Waveguide Topologies For Rack Scale Architecture Servers
App 20190198965 - Kamgaing; Telesphor ; et al. | 2019-06-27 |
Multi-chip Package With High Density Interconnects
App 20190198447 - Aleksov; Aleksandar ; et al. | 2019-06-27 |
Methods For Conductively Coating Millimeter Waveguides
App 20190198961 - Aleksov; Aleksandar ; et al. | 2019-06-27 |
Quantum Computing Assemblies
App 20190194016 - Roberts; Jeanette M. ; et al. | 2019-06-27 |
Stretchable electronic assembly
Grant 10,327,330 - Aleksov , et al. | 2019-06-18 |
Stretchable computing device
Grant 10,327,331 - Dabby , et al. | 2019-06-18 |
Microelectronic package with wireless interconnect
Grant 10,327,268 - Kamgaing , et al. | 2019-06-18 |
Shielded interconnects
Grant 10,319,896 - Falcon , et al. | 2019-06-11 |
Millimeter-wave Holey Waveguides And Multi-material Waveguides
App 20190173149 - Elsherbini; Adel A. ; et al. | 2019-06-06 |
Piezoelectric Package-integrated Pressure Sensing Devices
App 20190165250 - SOUNART; Thomas L. ; et al. | 2019-05-30 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,304,686 - Oster , et al. | 2019-05-28 |
Tunable radio frequency systems using piezoelectric package-integrated switching devices
Grant 10,291,283 - Kamgaing , et al. | 2019-05-14 |
Piezoelectric Package-integrated Acoustic Transducer Devices
App 20190141456 - DOGIAMIS; Georgios C. ; et al. | 2019-05-09 |
Piezoelectric Package-integrated Current Sensing Devices
App 20190113545 - DOGIAMIS; Georgios C. ; et al. | 2019-04-18 |
Single-package phased array module with interleaved sub-arrays
Grant 10,263,346 - Kamgaing , et al. | 2019-04-16 |
Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards
Grant 10,263,312 - Oster , et al. | 2019-04-16 |
Waveguide connector with slot launcher
Grant 10,256,521 - Elsherbini , et al. | 2019-04-09 |
Qubit die attachment using preforms
Grant 10,256,206 - Falcon , et al. | 2019-04-09 |
Waveguide Couplers And Junctions To Enable Frequency Division Multiplexed Sensor Systems In Autonomous Vehicle
App 20190103932 - Oster; Sasha N. ; et al. | 2019-04-04 |
Dielectric waveguide bundle including a supporting feature for connecting first and second server boards
Grant 10,249,925 - Dogiamis , et al. | 2019-04-02 |
Multiband Waveguide Interconnect
App 20190097293 - Dogiamis; Georgios ; et al. | 2019-03-28 |
Multimode Waveguide
App 20190081705 - Braunisch; Henning ; et al. | 2019-03-14 |
Fabric-based piezoelectric energy harvesting
Grant 10,215,164 - Dabby , et al. Feb | 2019-02-26 |
Package Substrates With Top Superconductor Layers For Qubit Devices
App 20190044047 - Elsherbini; Adel A. ; et al. | 2019-02-07 |
Quantum Circuit Assemblies With On-chip Demultiplexers
App 20190044668 - Elsherbini; Adel A. ; et al. | 2019-02-07 |
Qubit Die Attachment Using Preforms
App 20190043822 - Falcon; Javier A. ; et al. | 2019-02-07 |
Quantum Computing Assemblies
App 20190042964 - Elsherbini; Adel A. ; et al. | 2019-02-07 |
Quantum Circuit Assemblies With Josephson Junctions Utilizing Resistive Switching Materials
App 20190042967 - Yoscovits; Zachary R. ; et al. | 2019-02-07 |
Reducing Crosstalk From Flux Bias Lines In Qubit Devices
App 20190044044 - Lampert; Lester ; et al. | 2019-02-07 |
Quantum Circuit Assemblies With At Least Partially Buried Transmission Lines And Capacitors
App 20190043919 - George; Hubert C. ; et al. | 2019-02-07 |
Package Integrated Security Features
App 20190036774 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Piezoelectric Driven Switches Integrated In Organic, Flexible Displays
App 20190036002 - LIFF; Shawna M. ; et al. | 2019-01-31 |
Package-integrated microchannels
Grant 10,186,465 - Eid , et al. Ja | 2019-01-22 |
Flexible And Stretchable Optical Interconnect In Wearable Systems
App 20190003882 - Aleksov; Aleksandar ; et al. | 2019-01-03 |
Shielded Interconnects
App 20190006572 - Falcon; Javier A. ; et al. | 2019-01-03 |
Platform With Thermally Stable Wireless Interconnects
App 20190006298 - DOGIAMIS; Georgios C. ; et al. | 2019-01-03 |
Improved Package Power Delivery Using Plane And Shaped Vias
App 20180331003 - BHARATH; Krishna ; et al. | 2018-11-15 |
Multi-layer package with integrated antenna
Grant 10,128,177 - Kamgaing , et al. November 13, 2 | 2018-11-13 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20180315690 - ELSHERBINI; Adel A. ; et al. | 2018-11-01 |
Package integrated security features
Grant 10,116,504 - Liff , et al. October 30, 2 | 2018-10-30 |
Microelectronic Devices With Embedded Substrate Cavities For Device To Device Communications
App 20180310399 - NAIR; Vijay K. ; et al. | 2018-10-25 |
Thin Electronic Package Elements Using Laser Spallation
App 20180308792 - Raghunathan; Vivek ; et al. | 2018-10-25 |
Conductive Base Embedded Interconnect
App 20180301405 - SANKMAN; Robert L. ; et al. | 2018-10-18 |
Stretchable Electronic Assembly
App 20180295720 - Aleksov; Aleksandar ; et al. | 2018-10-11 |
Three-dimensional Small Form Factor System In Package Architecture
App 20180286840 - NAIR; Vijay K. ; et al. | 2018-10-04 |
Low Loss And Low Cross Talk Transmission Lines Using Shaped Vias
App 20180288868 - ELSHERBINI; Adel A. ; et al. | 2018-10-04 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20180286687 - OSTER; Sasha N. ; et al. | 2018-10-04 |
Through-mold Structures
App 20180277458 - Oster; Sasha ; et al. | 2018-09-27 |
Platform with thermally stable wireless interconnects
Grant 10,083,923 - Dogiamis , et al. September 25, 2 | 2018-09-25 |
Flexible Electronic Assembly Method
App 20180263117 - Oster; Sasha N. ; et al. | 2018-09-13 |
Shielding Mold For Electric And Magnetic Emi Mitigation
App 20180263107 - Zhang; Zhichao ; et al. | 2018-09-13 |
Stretchable Computing Device
App 20180255635 - Dabby; Nadine L. ; et al. | 2018-09-06 |
Dual polarized antenna array
Grant 10,057,796 - Elsherbini , et al. August 21, 2 | 2018-08-21 |
Communication Between Integrated Circuit Packages Using A Millimeter-wave Wireless Radio Fabric
App 20180234128 - ELSHERBINI; Adel A. ; et al. | 2018-08-16 |
Lithographacally Defined Vias For Organic Package Substrate Scaling
App 20180233431 - ELSHERBINI; Adel A. ; et al. | 2018-08-16 |
Package-integrated Microchannels
App 20180226310 - EID; Feras ; et al. | 2018-08-09 |
Microelectronic Package Communication Using Radio Interfaces Connected Through Waveguides
App 20180217949 - OSTER; Sasha N. ; et al. | 2018-08-02 |
Stretchable and flexible electrical substrate interconnections
Grant 10,039,186 - Baxi , et al. July 31, 2 | 2018-07-31 |
Antennas For Platform Level Wireless Interconnects
App 20180212306 - ELSHERBINI; Adel A. ; et al. | 2018-07-26 |
Cross Talk And Interference Reduction For High Frequency Wireless Interconnects
App 20180212322 - ELSHERBINI; Adel A. ; et al. | 2018-07-26 |
Microelectronic Package With Wireless Interconnect
App 20180212645 - KAMGAING; Telesphor ; et al. | 2018-07-26 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 10,032,052 - Elsherbini , et al. July 24, 2 | 2018-07-24 |
mmWave antennas and transmission lines on standard substrate materials
Grant 10,033,093 - Elsherbini , et al. July 24, 2 | 2018-07-24 |
Scalable Embedded Silicon Bridge Via Pillars In Lithographically Defined Vias, And Methods Of Making Same
App 20180182707 - Elsherbini; Adel A. ; et al. | 2018-06-28 |
Low loss and low cross talk transmission lines using shaped vias
Grant 9,992,859 - Elsherbini , et al. June 5, 2 | 2018-06-05 |
Patch system for in-situ therapeutic treatment
Grant 9,967,040 - Aleksov , et al. May 8, 2 | 2018-05-08 |
Magnetic detachable electrical connections between circuits
Grant 9,954,309 - Eid , et al. April 24, 2 | 2018-04-24 |
Wavy interconnect for bendable and stretchable devices
Grant 9,942,980 - Hu , et al. April 10, 2 | 2018-04-10 |
Waveguide Bundle Fabrication In Suspended Media Targeting Bend-induced Strain Relief
App 20180097269 - Dogiamis; Georgios C. ; et al. | 2018-04-05 |
Fabrication Process For Ribbon Bundled Millimeter-waveguide
App 20180097268 - Oster; Sasha ; et al. | 2018-04-05 |
Complex Cavity Formation In Molded Packaging Structures
App 20180096862 - Oster; Sasha N. ; et al. | 2018-04-05 |
Piezoelectric Package-integrated Motor
App 20180097458 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Package Integrated Security Features
App 20180097693 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Actuatable And Adaptable Metamaterials Integrated In Package
App 20180097284 - LIFF; Shawna M. ; et al. | 2018-04-05 |
Waveguide Connector With Tapered Slot Launcher
App 20180090848 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Waveguide Connector With Slot Launcher
App 20180090803 - ELSHERBINI; ADEL A. ; et al. | 2018-03-29 |
Stretchable And Flexible Electrical Substrate Interconnections
App 20180084643 - Baxi; Amit Sudhir ; et al. | 2018-03-22 |
Piezoelectric package-integrated synthetic jet devices
Grant 9,902,152 - Eid , et al. February 27, 2 | 2018-02-27 |
Method Of Fabricating A Stretchable Computing Device
App 20180049309 - Elsherbini; Adel A. ; et al. | 2018-02-15 |
Electrical connectors for high density attach to stretchable boards
Grant 9,893,438 - Oster , et al. February 13, 2 | 2018-02-13 |
Wellness Monitoring Using A Patch System
App 20180020982 - Elsherbini; Adel A. ; et al. | 2018-01-25 |
Magnetic Detachable Electrical Connections Between Circuits
App 20180026393 - Eid; Feras ; et al. | 2018-01-25 |
Patch System For In-situ Therapeutic Treatment
App 20180026730 - Aleksov; Aleksandar ; et al. | 2018-01-25 |
Embedded Millimeter-wave Phased Array Module
App 20180012852 - Kamgaing; Telesphor ; et al. | 2018-01-11 |
Piezoelectric Package-integrated Surface Acoustic Wave Sensing Devices
App 20180004357 - ELSHERBINI; Adel A. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Synthetic Jet Devices
App 20180001640 - EID; Feras ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Chemical Species-sensitive Resonant Devices
App 20180003677 - OSTER; Sasha N. ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Sensing Devices
App 20180006208 - EID; Feras ; et al. | 2018-01-04 |
Piezoelectric Package-integrated Temperature Sensing Devices
App 20180003569 - EID; Feras ; et al. | 2018-01-04 |
Antenna integrated in a package substrate
Grant 9,853,359 - Elsherbini , et al. December 26, 2 | 2017-12-26 |
Complex cavity formation in molded packaging structures
Grant 9,824,901 - Oster , et al. November 21, 2 | 2017-11-21 |
Local dense patch for board assembly utilizing laser structuring metallization process
Grant 9,824,962 - Hua , et al. November 21, 2 | 2017-11-21 |
Electronic package that includes finned vias
Grant 9,795,026 - Mahanta , et al. October 17, 2 | 2017-10-17 |
Piezoelectric Package-integrated Contour Mode Filter Devices
App 20170288642 - EID; Feras ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Crystal Devices
App 20170288635 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Complex Cavity Formation In Molded Packaging Structures
App 20170287736 - Oster; Sasha ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Film Bulk Acoustic Resonator Devices
App 20170285695 - NAIR; Vijay K. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Switching Devices
App 20170283249 - DOGIAMIS; Georgios C. ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines For Radio Frequency Identification Tags
App 20170286731 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Thermally Activated Switch
App 20170287664 - Elsherbini; Adel A. ; et al. | 2017-10-05 |
Dual-sided Die Packages
App 20170287808 - BRAUNISCH; Henning ; et al. | 2017-10-05 |
Piezoelectric Package-integrated Delay Lines
App 20170288639 - ELSHERBINI; Adel A. ; et al. | 2017-10-05 |
Tunable Radio Frequency Systems Using Piezoelectric Package-integrated Switching Devices
App 20170288724 - KAMGAING; Telesphor ; et al. | 2017-10-05 |
Electrical Cable
App 20170288290 - Oster; Sasha N. ; et al. | 2017-10-05 |
Electro-magnetic Interference (emi) Shielding Techniques And Configurations
App 20170290155 - Elsherbini; Adel A. ; et al. | 2017-10-05 |
Patch system for in-situ therapeutic treatment
Grant 9,735,893 - Aleksov , et al. August 15, 2 | 2017-08-15 |
Dual-sided die packages
Grant 9,711,428 - Braunisch , et al. July 18, 2 | 2017-07-18 |
Electro-magnetic interference (EMI) shielding techniques and configurations
Grant 9,713,255 - Elsherbini , et al. July 18, 2 | 2017-07-18 |
Shielded bundle interconnect
App 20170187419 - Zhang; Yu ; et al. | 2017-06-29 |
Method of making an electromagnetic interference shield for semiconductor chip packages
Grant 9,691,711 - Mahajan , et al. June 27, 2 | 2017-06-27 |
Through-mold Structures
App 20170178990 - Oster; Sasha ; et al. | 2017-06-22 |
Physiological Characteristic Measurement System
App 20170172421 - Dabby; Nadine L. ; et al. | 2017-06-22 |
Electronic Package That Includes Finned Vias
App 20170171957 - Mahanta; Nayandeep K. ; et al. | 2017-06-15 |
Fabric-based Piezoelectric Energy Harvesting
App 20170163178 - Dabby; Nadine L. ; et al. | 2017-06-08 |
Piezoelectric package-integrated delay lines for radio frequency identification tags
Grant 9,647,636 - Elsherbini , et al. May 9, 2 | 2017-05-09 |
Package Integrated Power Inductors Using Lithographically Defined Vias
App 20170092412 - Manusharow; Mathew J. ; et al. | 2017-03-30 |
Low Loss and Low Cross Talk Transmission Lines using Shaped Vias
App 20170093007 - ELSHERBINI; Adel A. ; et al. | 2017-03-30 |
Single-package phased array module with interleaved sub-arrays
Grant 9,413,079 - Kamgaing , et al. August 9, 2 | 2016-08-09 |
Electromagnetic interference shield for semiconductor chip packages
Grant 9,368,455 - Mahajan , et al. June 14, 2 | 2016-06-14 |
Magnetic core inductor (MCI) structures for integrated voltage regulators
Grant 9,129,817 - Elsherbini , et al. September 8, 2 | 2015-09-08 |
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