Guzek; John S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Guzek; John S..The latest application filed is for "embedded semiconductive chips in reconstituted wafers, and systems containing same".

Company Profile

13.82.108

Guzek; John S. - Chandler AZ
- Chandler AZ US
Guzek; John S - Chandler AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Embedded Semiconductive Chips In Reconstituted Wafers, And Systems Containing Same App 20220172962 - Sankman; Robert L. ; et al.	2022-06-02
Packaged Semiconductor Die With Bumpless Die-package Interface For Bumpless Build-up Layer (bbul) Packages App 20220068861 - MALATKAR; Pramod ; et al.	2022-03-03
Embedded semiconductive chips in reconstituted wafers, and systems containing same Grant 11,257,688 - Sankman , et al. February 22, 2	2022-02-22
Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages Grant 11,201,128 - Malatkar , et al. December 14, 2	2021-12-14
Embedded Die On Interposer Packages App 20210134731 - GUZEK; John S.	2021-05-06
Embedded die on interposer packages Grant 10,930,596 - Guzek February 23, 2	2021-02-23
Localized High Density Substrate Routing App 20200395297 - STARKSTON; Robert ; et al.	2020-12-17
Localized high density substrate routing Grant 10,796,988 - Starkston , et al. October 6, 2	2020-10-06
Embedded Semiconductive Chips In Reconstituted Wafers, And Systems Containing Same App 20200273721 - Sankman; Robert L. ; et al.	2020-08-27
Embedded semiconductive chips in reconstituted wafers, and systems containing same Grant 10,651,051 - Sankman , et al.	2020-05-12
Semiconductor package having spacer layer Grant 10,636,769 - Teh , et al.	2020-04-28
Electro-magnetic interference (EMI) shielding techniques and configurations Grant 10,595,409 - Elsherbini , et al.	2020-03-17
Logic die and other components embedded in build-up layers Grant 10,453,799 - Kulkarni , et al. Oc	2019-10-22
Localized high density substrate routing Grant 10,366,951 - Starkston , et al. July 30, 2	2019-07-30
Embedded Die On Interposer Packages App 20190189564 - Guzek; John S.	2019-06-20
Semiconductor Package Having Spacer Layer App 20190006325 - TEH; Weng Hong ; et al.	2019-01-03
Package on package architecture and method for making Grant 10,170,409 - Ganesan , et al. J	2019-01-01
Localized High Density Substrate Routing App 20180350737 - Starkston; Robert ; et al.	2018-12-06
Semiconductor package having spacer layer Grant 10,083,936 - Teh , et al. September 25, 2	2018-09-25
Flexible Electronic Assembly Method App 20180263117 - Oster; Sasha N. ; et al.	2018-09-13
Microelectronic structures having laminated or embedded glass routing structures for high density packaging Grant 10,008,452 - Ma , et al. June 26, 2	2018-06-26
Microelectronic device and method of manufacturing same Grant 9,999,129 - Guzek , et al. June 12, 2	2018-06-12
Embedded Semiconductive Chips In Reconstituted Wafers, And Systems Containing Same App 20180033648 - Sankman; Robert L ; et al.	2018-02-01
Embedded memory and power management subpackage Grant 9,871,026 - Guzek , et al. January 16, 2	2018-01-16
Integrated Circuit Package Stack App 20180005989 - Jayaraman; Saikumar ; et al.	2018-01-04
Integrated circuit package stack Grant 9,859,253 - Jayaraman , et al. January 2, 2	2018-01-02
Embedded semiconductive chips in reconstituted wafers, and systems containing same Grant 9,847,234 - Sankman , et al. December 19, 2	2017-12-19
High density interconnection of microelectronic devices Grant 9,842,832 - Karhade , et al. December 12, 2	2017-12-12
Flexible electronic assembly method Grant 9,820,384 - Oster , et al. November 14, 2	2017-11-14
Localized High Density Substrate Routing App 20170287831 - Starkston; Robert ; et al.	2017-10-05
Electro-magnetic Interference (emi) Shielding Techniques And Configurations App 20170290155 - Elsherbini; Adel A. ; et al.	2017-10-05
Semiconductor package with embedded die and its methods of fabrication Grant 9,780,054 - Guzek , et al. October 3, 2	2017-10-03
Electro-magnetic interference (EMI) shielding techniques and configurations Grant 9,713,255 - Elsherbini , et al. July 18, 2	2017-07-18
Microelectronic Structures Having Laminated Or Embedded Glass Routing Structures For High Density Packaging App 20170200677 - Ma; Qing ; et al.	2017-07-13
BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility Grant 9,691,728 - Nickerson , et al. June 27, 2	2017-06-27
Method of making an electromagnetic interference shield for semiconductor chip packages Grant 9,691,711 - Mahajan , et al. June 27, 2	2017-06-27
Method of forming a microelectronic device package Grant 9,686,870 - Teh , et al. June 20, 2	2017-06-20
Localized high density substrate routing Grant 9,679,843 - Starkston , et al. June 13, 2	2017-06-13
Embedded semiconductive chips in reconstituted wafers, and systems containing same Grant 9,646,851 - Sankman , et al. May 9, 2	2017-05-09
Logic Die And Other Components Embedded In Build-up Layers App 20170125351 - Kulkarni; Deepak V. ; et al.	2017-05-04
Microelectronic structures having laminated or embedded glass routing structures for high density packaging Grant 9,642,248 - Ma , et al. May 2, 2	2017-05-02
Bumpless die-package interface for bumpless build-up layer (BBUL) Grant 9,576,909 - Teh , et al. February 21, 2	2017-02-21
Method of forming a substrate core with embedded capacitor and structures formed thereby Grant 9,572,258 - Srinivasan , et al. February 14, 2	2017-02-14
Multi-die Package Structures App 20170025392 - Teh; Weng Hong ; et al.	2017-01-26
Flexible computing fabric Grant 9,526,285 - Aleksov , et al. December 27, 2	2016-12-27
Bumpless build-up layer package including an integrated heat spreader Grant 9,520,376 - Teh , et al. December 13, 2	2016-12-13
Logic die and other components embedded in build-up layers Grant 9,496,211 - Kulkarni , et al. November 15, 2	2016-11-15
Multi die package having a die and a spacer layer in a recess Grant 9,490,196 - Teh , et al. November 8, 2	2016-11-08
High Density Interconnection Of Microelectronic Devices App 20160300824 - Karhade; Omkar G. ; et al.	2016-10-13
Package On Package Architecture And Method For Making App 20160284642 - GANESAN; Sanka ; et al.	2016-09-29
Bumpless Die-package Interface For Bumpless Build-up Layer (bbul) App 20160233166 - TEH; Weng Hong ; et al.	2016-08-11
Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same Grant 9,406,618 - Guzek , et al. August 2, 2	2016-08-02
High density interconnection of microelectronic devices Grant 9,397,071 - Karhade , et al. July 19, 2	2016-07-19
Embedded Semiconductive Chips In Reconstituted Wafers, And Systems Containing Same App 20160196988 - Sankman; Robert L. ; et al.	2016-07-07
Embedded Memory And Power Management Subpackage App 20160197065 - Guzek; John S. ; et al.	2016-07-07
Localized High Density Substrate Routing App 20160197037 - Starkston; Robert ; et al.	2016-07-07
Methods Of Forming Panel Embedded Die Structures App 20160190027 - Manepalli; Rahul N. ; et al.	2016-06-30
Wearable Imaging Sensor With Wireless Remote Communications App 20160183604 - Pillarisetty; Ravi ; et al.	2016-06-30
Method Of Making An Electromagnetic Interference Shield For Semiconductor Chip Packages App 20160181207 - Mahajan; Ravindranath V. ; et al.	2016-06-23
Wearable imaging sensor for communications Grant 9,374,509 - Pillarisetty , et al. June 21, 2	2016-06-21
Electromagnetic interference shield for semiconductor chip packages Grant 9,368,455 - Mahajan , et al. June 14, 2	2016-06-14
Packaged Semiconductor Die with Bumpless Die-Package Interface for Bumpless Build-Up Layer (BBUL) Packages App 20160133590 - MALATKAR; Pramod ; et al.	2016-05-12
Method of forming molded panel embedded die structure Grant 9,312,233 - Manepalli , et al. April 12, 2	2016-04-12
Embedded memory and power management subpackage Grant 9,287,248 - Guzek , et al. March 15, 2	2016-03-15
Localized high density substrate routing Grant 9,269,701 - Starkston , et al. February 23, 2	2016-02-23
Forming functionalized carrier structures with coreless packages Grant 9,257,380 - Nalla , et al. February 9, 2	2016-02-09
Bumpless Build-up Layer Package Including An Integrated Heat Spreader App 20160027757 - Teh; Weng Hong ; et al.	2016-01-28
Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages Grant 9,224,674 - Malatkar , et al. December 29, 2	2015-12-29
Same Layer Microelectronic Circuit Patterning Using Hybrid Laser Projection Patterning (lpp) And Semi-additive Patterning (sap) App 20150342037 - Guzek; John S. ; et al.	2015-11-26
Localized High Density Substrate Routing App 20150340353 - Starkston; Robert ; et al.	2015-11-26
Bumpless build-up layer package including an integrated heat spreader Grant 9,153,552 - Teh , et al. October 6, 2	2015-10-06
Electromagnetic Interference Shield For Semiconductor Chip Packages App 20150279789 - Mahajan; Ravindranath V. ; et al.	2015-10-01
Localized high density substrate routing Grant 9,136,236 - Starkston , et al. September 15, 2	2015-09-15
Electro-magnetic Interference (emi) Shielding Techniques And Configurations App 20150237713 - Elsherbini; Adel A. ; et al.	2015-08-20
Flexible Microelectronic Assembly And Method App 20150187681 - Mahajan; Ravi V. ; et al.	2015-07-02
Forming Functionalized Carrier Structures With Coreless Packages App 20150179559 - Nalla; Ravi K. ; et al.	2015-06-25
Bbul Top Side Substrate Layer Enabling Dual Sided Silicon Interconnect And Stacking Flexibility App 20150171044 - NICKERSON; Robert M. ; et al.	2015-06-18
Embedded Memory And Power Management Subpackage App 20150171065 - Guzek; John S. ; et al.	2015-06-18
Flexible Electronic Assembly And Method App 20150163921 - Oster; Sasha ; et al.	2015-06-11
High Density Interconnection Of Microelectronic Devices App 20150163904 - Karhade; Omkar G. ; et al.	2015-06-11
Microelectronic Structures Having Laminated Or Embedded Glass Routing Structures For High Density Packaging App 20150156869 - Ma; Qing ; et al.	2015-06-04
Embedded Semiconductive Chips In Reconstituted Wafers, And Systems Containing Same App 20150145138 - Sankman; Robert L. ; et al.	2015-05-28
Secondary Device Integration Into Coreless Microelectronic Device Packages App 20150135526 - TEH; WENG HONG ; et al.	2015-05-21
Bumpless Build-up Layer Package Including An Integrated Heat Spreader App 20150104907 - Teh; Weng Hong ; et al.	2015-04-16
Microelectronic structures having laminated or embedded glass routing structures for high density packaging Grant 9,001,520 - Ma , et al. April 7, 2	2015-04-07
Forming functionalized carrier structures with coreless packages Grant 8,987,065 - Nailla , et al. March 24, 2	2015-03-24
Embedded semiconductive chips in reconstituted wafers, and systems containing same Grant 8,969,140 - Sankman , et al. March 3, 2	2015-03-03
Semiconductor Package With Embedded Die And Its Methods Of Fabrication App 20150050781 - Guzek; John S. ; et al.	2015-02-19
Passivation layer for flexible display Grant 8,941,128 - Pillarisetty , et al. January 27, 2	2015-01-27
Secondary device integration into coreless microelectronic device packages Grant 8,937,382 - Teh , et al. January 20, 2	2015-01-20
Methods Of Forming Molded Panel Embedded Die Structures App 20150003000 - MANEPALLI; Rahul N. ; et al.	2015-01-01
Bumpless build-up layer package including an integrated heat spreader Grant 8,912,670 - Teh , et al. December 16, 2	2014-12-16
System-in-package using embedded-die coreless substrates, and processes of forming same Grant 8,891,246 - Guzek , et al. November 18, 2	2014-11-18
Die-stacking Using Through-silicon Vias On Bumpless Build-up Layer Substrates Including Embedded-dice, And Processes Of Forming Same App 20140327149 - Guzek; John S. ; et al.	2014-11-06
Method of stiffening coreless package substrate Grant 8,860,205 - Muthukumar , et al. October 14, 2	2014-10-14
Die-stacking Using Through-silicon Vias On Bumpless Build-up Layer Substrates Including Embedded-dice, And Processes Of Forming Same App 20140295621 - Guzek; John S. ; et al.	2014-10-02
Magnetic Contacts For Electronics Applications App 20140205851 - MAHAJAN; Ravindranath V. ; et al.	2014-07-24
Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same Grant 8,786,066 - Guzek , et al. July 22, 2	2014-07-22
Flexible Computing Fabric App 20140165269 - ALEKSOV; ALEKSANDAR ; et al.	2014-06-19
Wearable Imaging Sensor For Communications App 20140168355 - Pillarisetty; Ravi ; et al.	2014-06-19
Passivation Layer For Flexible Display App 20140138713 - Pillarisetty; Ravi ; et al.	2014-05-22
Logic Die And Other Components Embedded In Build-up Layers App 20140138845 - Kulkarni; Deepak V. ; et al.	2014-05-22
Localized High Density Substrate Routing App 20140091474 - Starkston; Robert ; et al.	2014-04-03
System In Package With Embedded Rf Die In Coreless Substrate App 20140091440 - NAIR; Vijay K. ; et al.	2014-04-03
Bumpless Build-up Layer Package Including An Integrated Heat Spreader App 20140091445 - Teh; Weng Hong ; et al.	2014-04-03
Forming Functionalized Carrier Structures With Coreless Packages App 20140084467 - Nalla; Ravi K. ; et al.	2014-03-27
Microelectronic Structures Having Laminated Or Embedded Glass Routing Structures For High Density Packaging App 20140085846 - Ma; Qing ; et al.	2014-03-27
Forming functionalized carrier structures with coreless packages Grant 08618652 -	2013-12-31
Forming functionalized carrier structures with coreless packages Grant 8,618,652 - Nalla , et al. December 31, 2	2013-12-31
Embedded Semiconductive Chips In Reconstituted Wafers, And Systems Containing Same App 20130328207 - Sankman; Robert L. ; et al.	2013-12-12
Package-on-package Interconnect Stiffener App 20130292838 - Ganesan; Sanka ; et al.	2013-11-07
Multi Die Package Structures App 20130277865 - Teh; Weng Hong ; et al.	2013-10-24
Packaged Semiconductor Die With Bumpless Die-package Interface For Bumpless Build-up Layer (bbul) Packages App 20130270715 - Malatkar; Pramod ; et al.	2013-10-17
Embedded semiconductive chips in reconstituted wafers, and systems containing same Grant 8,535,989 - Sankman , et al. September 17, 2	2013-09-17
Package-on-package interconnect stiffener Grant 8,513,792 - Ganesan , et al. August 20, 2	2013-08-20
Secondary Device Integration Into Coreless Microelectronic Device Packages App 20120326271 - Teh; Weng Hong ; et al.	2012-12-27
Magnetic microelectronic device attachment Grant 8,313,958 - Swaminathan , et al. November 20, 2	2012-11-20
Mold compounds in improved embedded-die coreless substrates, and processes of forming same Grant 8,264,849 - Guzek September 11, 2	2012-09-11
Encapsulated Die, Microelectronic Package Containing Same, And Method Of Manufacturing Said Microelectronic Package App 20120112336 - Guzek; John S. ; et al.	2012-05-10
Die-stacking Using Through-silicon Vias On Bumpless Build-up Layer Substrates Including Embedded-dice, And Processes Of Forming Same App 20120074581 - Guzek; John S. ; et al.	2012-03-29
Package on package using a bump-less build up layer (BBUL) package Grant 8,093,704 - Palmer , et al. January 10, 2	2012-01-10
Microelectronic Package And Method Of Manufacturing Same App 20110318850 - Guzek; John S. ; et al.	2011-12-29
Mold Compounds In Improved Embedded-die Coreless Substrates, And Processes Of Forming Same App 20110317383 - Guzek; John S.	2011-12-29
Magnetic Microelectronic Device Attachment App 20110281375 - Swaminathan; Rajasekaran ; et al.	2011-11-17
Microelectronic package and method of manufacturing same Grant 8,035,218 - Guzek , et al. October 11, 2	2011-10-11
Embedded Semiconductive Chips In Reconstituted Wafers, And Systems Containing Same App 20110241215 - Sankman; Robert L. ; et al.	2011-10-06
System-in-package Using Embedded-die Coreless Substrates, And Processes Of Forming Same App 20110228464 - Guzek; John S. ; et al.	2011-09-22
Microelectronic device and method of manufacturing same App 20110108947 - Guzek; John S. ; et al.	2011-05-12
Microelectronic package and method of manufacturing same App 20110101516 - Guzek; John S. ; et al.	2011-05-05
Method of stiffening coreless package substrate Grant 7,851,269 - Muthukumar , et al. December 14, 2	2010-12-14
Method Of Stiffening Coreless Package Substrate App 20100301492 - Muthukumar; Sriram ; et al.	2010-12-02
Package-on-package interconnect stiffener App 20100258927 - Ganesan; Sanka ; et al.	2010-10-14
Method of stiffening coreless package substrate App 20100207265 - Muthukumar; Sriram ; et al.	2010-08-19
Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same Grant 7,636,231 - Guzek , et al. December 22, 2	2009-12-22
Package On Package Using A Bump-less Build Up Layer (bbul) Package App 20090294942 - Palmer; Eric C. ; et al.	2009-12-03
Microelectronic Package And Method Of Forming Same App 20090072382 - Guzek; John S.	2009-03-19
Organic Substrates With Embedded Thin-film Capacitors, Methods Of Making Same, And Systems Containing Same App 20080174938 - Guzek; John S. ; et al.	2008-07-24
Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same Grant 7,372,126 - Guzek , et al. May 13, 2	2008-05-13
Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same Grant 7,288,459 - Guzek , et al. October 30, 2	2007-10-30
Forming a substrate core with embedded capacitor and structures formed thereby Grant 7,224,571 - Srinivasan , et al. May 29, 2	2007-05-29
Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same App 20060220175 - Guzek; John S. ; et al.	2006-10-05
Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same App 20060223226 - Guzek; John S. ; et al.	2006-10-05
Forming a substrate core with embedded capacitor and structures formed thereby App 20060143886 - Srinivasan; Sriram ; et al.	2006-07-06
Forming a substrate core with embedded capacitor and structures formed thereby App 20060143887 - Srinivasan; Sriram ; et al.	2006-07-06
Forming a substrate core with embedded capacitor and structures formed thereby App 20060146476 - Srinivasan; Sriram ; et al.	2006-07-06
Integrated circuit package with low modulus layer and capacitor/interposer Grant 7,042,077 - Walk , et al. May 9, 2	2006-05-09
Integrated circuit package with low modulus layer and capacitor/interposer App 20050230841 - Walk, Michael J. ; et al.	2005-10-20