MAHAJAN; Ravindranath V.
Patent Applications and Registrations
Patent applications and USPTO patent grants for MAHAJAN; Ravindranath V..The latest application filed is for "nested interposer with through-silicon via bridge die".
Company Profile
24.35.68
- MAHAJAN; Ravindranath V. - Chandler AZ
- Mahajan; Ravindranath V - Chandler AZ
- Mahajan; Ravindranath V. - Tempe AZ US
Patent Activity
| Patent | Date |
|---|---|
| Nested Interposer With Through-silicon Via Bridge Die App 20220278032 - PIETAMBARAM; Srinivas V. ; et al. | 2022-09-01 |
| Multi-chip packages and sinterable paste for use with thermal interface materials Grant 11,404,349 - Raravikar , et al. August 2, 2 | 2022-08-02 |
| Stacked Die Cavity Package App 20220238402 - MODI; Mitul ; et al. | 2022-07-28 |
| Patch On Interposer Architecture For Low Cost Optical Co-packaging App 20220196943 - LI; Xiaoqian ; et al. | 2022-06-23 |
| High Bandwidth Optical Interconnection Architectures App 20220155539 - PIETAMBARAM; Srinivas V. ; et al. | 2022-05-19 |
| Stacked die cavity package Grant 11,328,968 - Modi , et al. May 10, 2 | 2022-05-10 |
| Distributed Semiconductor Die And Package Architecture App 20220139896 - GOMES; Wilfred ; et al. | 2022-05-05 |
| Enabling Long Interconnect Bridges App 20220130763 - Mahajan; Ravindranath V. ; et al. | 2022-04-28 |
| Dual-sided Co-packaged Optics For High Bandwidth Networking Applications App 20220085001 - POTHUKUCHI; Suresh V. ; et al. | 2022-03-17 |
| Distributed semiconductor die and package architecture Grant 11,257,804 - Gomes , et al. February 22, 2 | 2022-02-22 |
| Enabling long interconnect bridges Grant 11,222,847 - Mahajan , et al. January 11, 2 | 2022-01-11 |
| Dual-sided co-packaged optics for high bandwidth networking applications Grant 11,217,573 - Pothukuchi , et al. January 4, 2 | 2022-01-04 |
| Dual-sided Co-packaged Optics For High Bandwidth Networking Applications App 20210280566 - POTHUKUCHI; Suresh V. ; et al. | 2021-09-09 |
| Embedded Bridge With Through-silicon Vias App 20210272881 - VAIDYA; Aditya S. ; et al. | 2021-09-02 |
| Embedded bridge with through-silicon Vias Grant 11,049,798 - Vaidya , et al. June 29, 2 | 2021-06-29 |
| Full Package Vapor Chamber With Ihs App 20210195798 - NEAL; Nicholas ; et al. | 2021-06-24 |
| Solid State Thermoelectric Cooler In Silicon Backend Layers For Fast Cooling In Turbo Scenarios App 20210125897 - VALAVALA; Krishna Vasanth ; et al. | 2021-04-29 |
| Projecting contacts and method for making the same Grant 10,978,423 - Kim , et al. April 13, 2 | 2021-04-13 |
| Ultrathin Bridge And Multi-die Ultrafine Pitch Patch Architecture And Method Of Making App 20210043570 - GANESAN; Sanka ; et al. | 2021-02-11 |
| Multi-die Ultrafine Pitch Patch Architecture And Method Of Making App 20210035911 - GANESAN; Sanka ; et al. | 2021-02-04 |
| Method to enable interposer to interposer connection Grant 10,804,117 - Raorane , et al. October 13, 2 | 2020-10-13 |
| Distributed Semiconductor Die And Package Architecture App 20200312833 - GOMES; WILFRED ; et al. | 2020-10-01 |
| Structures For Conducting Heat With A Packaged Device And Method Of Providing Same App 20200258759 - A1 | 2020-08-13 |
| Interconnect Architecture With Silicon Interposer And Emib App 20200211969 - HOSSAIN; MD Altaf ; et al. | 2020-07-02 |
| Distributed semiconductor die and package architecture Grant 10,685,947 - Gomes , et al. | 2020-06-16 |
| Stacked Die Cavity Package App 20200185289 - MODI; Mitul ; et al. | 2020-06-11 |
| Active Silicon Bridge App 20200144186 - THOMAS; Thomas P. ; et al. | 2020-05-07 |
| Hybrid Technology 3-d Die Stacking App 20200066640 - SARKAR; Arnab ; et al. | 2020-02-27 |
| Multiple Die Package Using An Embedded Bridge Connecting Dies App 20190363049 - MEKONNEN; Yidnekachew S. ; et al. | 2019-11-28 |
| Heat management system Grant 10,468,331 - Chang , et al. No | 2019-11-05 |
| Embedded Bridge With Through-silicon Vias App 20190326198 - Vaidya; Aditya S. ; et al. | 2019-10-24 |
| Enabling Long Interconnect Bridges App 20190318993 - Mahajan; Ravindranath V. ; et al. | 2019-10-17 |
| Method To Enable Interposer To Interposer Connection App 20190304809 - Raorane; Digvijay Ashokkumar ; et al. | 2019-10-03 |
| Recessed Semiconductor Die In A Die Stack To Accomodate A Component App 20190287956 - Raorane; Digvijay A. ; et al. | 2019-09-19 |
| Multi-chip Packages And Sinterable Paste For Use With Thermal Interface Materials App 20190267306 - RARAVIKAR; Nachiket R. ; et al. | 2019-08-29 |
| Embedded bridge with through-silicon vias Grant 10,373,893 - Vaidya , et al. | 2019-08-06 |
| Localized high density substrate routing Grant 10,366,951 - Starkston , et al. July 30, 2 | 2019-07-30 |
| Distributed Semiconductor Die And Package Architecture App 20190221556 - GOMES; WILFRED ; et al. | 2019-07-18 |
| Heat Management System App 20190221499 - Chang; Je-young ; et al. | 2019-07-18 |
| Bridge Hub Tiling Architecture App 20190206798 - COLLINS; ANDREW P. ; et al. | 2019-07-04 |
| Embedded Bridge With Through-silicon Vias App 20190006264 - Vaidya; Aditya S. ; et al. | 2019-01-03 |
| Projecting Contacts And Method For Making The Same App 20180366438 - Kim; Dae-Woo ; et al. | 2018-12-20 |
| Localized High Density Substrate Routing App 20180350737 - Starkston; Robert ; et al. | 2018-12-06 |
| Self-cooled Laser Integrated Device And Substrate Architecture App 20180329240 - RAGHUNATHAN; Vivek ; et al. | 2018-11-15 |
| Flexible Electronic Assembly Method App 20180263117 - Oster; Sasha N. ; et al. | 2018-09-13 |
| Integrated circuit package with embedded bridge Grant 10,068,852 - Mahajan , et al. September 4, 2 | 2018-09-04 |
| Magnetic intermetallic compound interconnect Grant 9,847,308 - Swaminathan , et al. December 19, 2 | 2017-12-19 |
| Integrated Circuit Package With Embedded Bridge App 20170301625 - Mahajan; Ravindranath V. ; et al. | 2017-10-19 |
| Localized High Density Substrate Routing App 20170287831 - Starkston; Robert ; et al. | 2017-10-05 |
| Adaptive exoskeleton, control system and methods using the same Grant 9,775,763 - Aleksov , et al. October 3, 2 | 2017-10-03 |
| Lateral Expansion Apparatus for Mechanical Testing of Stretchable Electronics App 20170268972 - SUBRAMANIAN; Vijay Krishnan ; et al. | 2017-09-21 |
| Inflatable Bladder Based Mechanical Testing for Stretchable Electronics App 20170269017 - KLEIN; Steven A. ; et al. | 2017-09-21 |
| Integrated circuit package with embedded bridge Grant 9,716,067 - Mahajan , et al. July 25, 2 | 2017-07-25 |
| Method of making an electromagnetic interference shield for semiconductor chip packages Grant 9,691,711 - Mahajan , et al. June 27, 2 | 2017-06-27 |
| Methods for high precision microelectronic die integration Grant 9,685,421 - Aleksov , et al. June 20, 2 | 2017-06-20 |
| Localized high density substrate routing Grant 9,679,843 - Starkston , et al. June 13, 2 | 2017-06-13 |
| Photovoltaic window Grant 9,548,410 - Aleksov , et al. January 17, 2 | 2017-01-17 |
| Magnetic Intermetallic Compound Interconnect App 20160379951 - SWAMINATHAN; RAJASEKARAN ; et al. | 2016-12-29 |
| Flexible computing fabric Grant 9,526,285 - Aleksov , et al. December 27, 2 | 2016-12-27 |
| Localized High Density Substrate Routing App 20160197037 - Starkston; Robert ; et al. | 2016-07-07 |
| Method Of Making An Electromagnetic Interference Shield For Semiconductor Chip Packages App 20160181207 - Mahajan; Ravindranath V. ; et al. | 2016-06-23 |
| Magnetic Intermetallic Compound Interconnect App 20160172320 - SWAMINATHAN; RAJASEKARAN ; et al. | 2016-06-16 |
| Electromagnetic interference shield for semiconductor chip packages Grant 9,368,455 - Mahajan , et al. June 14, 2 | 2016-06-14 |
| Integrated Circuit Package With Embedded Bridge App 20160155705 - Mahajan; Ravindranath V. ; et al. | 2016-06-02 |
| System and method for providing tactile feedback Grant 9,323,327 - Aleksov , et al. April 26, 2 | 2016-04-26 |
| Integrated circuit package with embedded bridge Grant 9,275,955 - Mahajan , et al. March 1, 2 | 2016-03-01 |
| Electromagnetic Interference Shield For Semiconductor Chip Packages App 20150279789 - Mahajan; Ravindranath V. ; et al. | 2015-10-01 |
| Methods For High Precision Microelectronic Die Integration App 20150262968 - Aleksov; Aleksandar ; et al. | 2015-09-17 |
| Die-to-die Bonding And Associated Package Configurations App 20150255411 - Karhade; Omkar G. ; et al. | 2015-09-10 |
| Wireless charging system Grant 9,118,188 - Doyle , et al. August 25, 2 | 2015-08-25 |
| Methods for high precision microelectronic die integration Grant 9,076,882 - Aleksov , et al. July 7, 2 | 2015-07-07 |
| Integrated Circuit Package With Embedded Bridge App 20150171015 - Mahajan; Ravindranath V. ; et al. | 2015-06-18 |
| Magnetic intermetallic compound interconnect Grant 8,939,347 - Swaminathan , et al. January 27, 2 | 2015-01-27 |
| Methods For High Precision Microelectronic Die Integration App 20140357020 - Aleksov; Aleksandar ; et al. | 2014-12-04 |
| Magnetic Contacts For Electronics Applications App 20140205851 - MAHAJAN; Ravindranath V. ; et al. | 2014-07-24 |
| System And Method For Providing Tactile Feedback App 20140176452 - ALEKSOV; ALEKSANDAR ; et al. | 2014-06-26 |
| Photovoltaic Window App 20140166080 - Aleksov; Aleksandar ; et al. | 2014-06-19 |
| Flexible Computing Fabric App 20140165269 - ALEKSOV; ALEKSANDAR ; et al. | 2014-06-19 |
| Adaptive Exoskeleton, Control System And Methods Using The Same App 20140171838 - ALEKSOV; ALEKSANDAR ; et al. | 2014-06-19 |
| Wireless Charging System App 20140167688 - Doyle; Brian S. ; et al. | 2014-06-19 |
| Magnetically sintered conductive via Grant 8,609,532 - Swaminathan , et al. December 17, 2 | 2013-12-17 |
| Magnetically Sintered Conductive Via App 20110291276 - Swaminathan; Rajasekaran ; et al. | 2011-12-01 |
| Magnetic Intermetallic Compound Interconnect App 20110266030 - Swaminathan; Rajasekaran ; et al. | 2011-11-03 |
| Electro-osmotic pumps and micro-channels Grant 6,981,849 - Kim , et al. January 3, 2 | 2006-01-03 |
| Electro-osmotic pumps and micro-channels App 20040120827 - Kim, Sarah E. ; et al. | 2004-06-24 |
| Thermal interface thickness control for a microprocessor Grant 6,043,560 - Haley , et al. March 28, 2 | 2000-03-28 |
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