Circuit board for power semiconductor module

Description

FIG. 1 is a front, top and left side perspective view of a circuit board for power semiconductor module showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is an enlarged right side view thereof; and,

FIG. 5 is an enlarged left side view thereof.

The even broken lines illustrate portions of the circuit board for power semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Claims

CLAIM The ornamental design for a circuit board for power semiconductor module, as shown and described.

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Inventors:	Shibata; Kotaro (Kyoto, JP), Sawada; Hideki (Kyoto, JP)
Applicant:	Name City State Country Type ROHM CO., LTD. Kyoto N/A JP
Assignee:	ROHM CO., LTD. (Kyoto, JP)
Appl. No.:	D/725,688
Filed:	February 26, 2020

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Foreign Application Priority Data

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Aug 29, 2019 [JP]			2019-019216

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106

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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Hamre, Schumann, Mueller & Larson, P.C.