U.S. patent number D934,190 [Application Number D/725,688] was granted by the patent office on 2021-10-26 for circuit board for power semiconductor module.
This patent grant is currently assigned to ROHM CO., LTD.. The grantee listed for this patent is ROHM CO., LTD.. Invention is credited to Hideki Sawada, Kotaro Shibata.
United States Patent |
D934,190 |
Shibata , et al. |
October 26, 2021 |
Circuit board for power semiconductor module
Claims
CLAIM The ornamental design for a circuit board for power
semiconductor module, as shown and described.
Inventors: |
Shibata; Kotaro (Kyoto,
JP), Sawada; Hideki (Kyoto, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
ROHM CO., LTD. |
Kyoto |
N/A |
JP |
|
|
Assignee: |
ROHM CO., LTD. (Kyoto,
JP)
|
Appl.
No.: |
D/725,688 |
Filed: |
February 26, 2020 |
Foreign Application Priority Data
|
|
|
|
|
Aug 29, 2019 [JP] |
|
|
2019-019216 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182
;257/678,684,690,691
;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253
;438/15,25,26,51,55,63,64,106 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1536191 |
|
Oct 2015 |
|
JP |
|
1536359 |
|
Oct 2015 |
|
JP |
|
1536360 |
|
Oct 2015 |
|
JP |
|
1585830 |
|
Sep 2017 |
|
JP |
|
1585831 |
|
Sep 2017 |
|
JP |
|
1585962 |
|
Sep 2017 |
|
JP |
|
1603793 |
|
May 2018 |
|
JP |
|
1603980 |
|
May 2018 |
|
JP |
|
1605558 |
|
Jun 2018 |
|
JP |
|
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Hamre, Schumann, Mueller &
Larson, P.C.
Description
FIG. 1 is a front, top and left side perspective view of a circuit
board for power semiconductor module showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is an enlarged right side view thereof; and,
FIG. 5 is an enlarged left side view thereof.
The even broken lines illustrate portions of the circuit board for
power semiconductor module that form no part of the claimed design.
The dash-dotted lines denote the boundary of the claim and form no
part of the claimed design.
* * * * *