Cover of seal cap for reaction chamber for semiconductor

Description

FIG. 1 is a rear, top and left side perspective view of a cover of seal cap for reaction chamber for semiconductor showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view thereof taken in the direction of line 8-8 in FIG. 2.

The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.

Claims

CLAIM We claim the ornamental design for a cover of seal cap for reaction chamber for semiconductor, as shown and described.

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Inventors:	Okajima; Yusaku (Toyama, JP), Saido; Shuhei (Toyama, JP), Yoshida; Hidenari (Toyama, JP), Sasaki; Takafumi (Toyama, JP)
Applicant:	Name City State Country Type KOKUSAI ELECTRIC CORPORATION Tokyo N/A JP
Assignee:	KOKUSAI ELECTRIC CORPORATION (Tokyo, JP)
Appl. No.:	D/670,537
Filed:	November 16, 2018

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Foreign Application Priority Data

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May 18, 2018 [JP]			JP2018-010931

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182,184 ;D15/144.1,144.2,199

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References Cited [Referenced By]

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U.S. Patent Documents

D616390	May 2010	Sato
D654883	February 2012	Honma
D654884	February 2012	Honma
D797067	September 2017	Zhang
D813181	March 2018	Okajima
D855027	July 2019	Okajima
D872037	January 2020	Okajima

Foreign Patent Documents

	1579504		Jun 2017		JP
	1598442		Feb 2018		JP

Primary Examiner: Colan; Gino
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery, L.L.P.

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