Cover of seal cap for reaction chamber of semiconductor

Description

FIG. 1 is a front, top, left side perspective view of a cover of seal cap for reaction chamber of semiconductor showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 6.

Claims

CLAIM The ornamental design for a cover of seal cap for reaction chamber of semiconductor, as shown and described.

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Inventors:	Okajima; Yusaku (Tokyo, JP), Saido; Shuhei (Tokyo, JP), Yoshida; Hidenari (Tokyo, JP)
Applicant:	Name City State Country Type Hitachi Kokusai Electric Inc. Tokyo N/A JP
Assignee:	KOKUSAI ELECTRIC CORPORATION (Tokyo, JP)
Appl. No.:	D/649,486
Filed:	May 30, 2018

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Foreign Application Priority Data

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Jan 22, 2018 [JP]			2018-001070

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182,184,162 ;D10/49,50

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References Cited [Referenced By]

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U.S. Patent Documents

5789810	August 1998	Gross
D642547	August 2011	Untersee
D720309	December 2014	Kaneko
D742339	November 2015	Takagi
D748594	February 2016	Takagi
D796458	September 2017	Jang
D797067	September 2017	Zhang
D813181	March 2018	Okajima et al.
D840981	February 2019	Forster
2017/0221790	August 2017	Tomie
2017/0229360	August 2017	Kothandapani

Foreign Patent Documents

	1598442		Feb 2018		JP

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery, LLP

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