Cover of seal cap for reaction chamber for semiconductor manufacturing

Description

FIG. 1 is a front, bottom and right side perspective view of a cover of seal cap for reaction chamber for semiconductor manufacturing showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 6; and,

FIG. 9 is a cross-sectional view take along line 9-9 in FIG. 7.

Claims

CLAIM We claim the ornamental design for a cover of seal cap for reaction chamber for semiconductor manufacturing, as shown (and described).

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Inventors:	Okajima; Yusaku (Toyama, JP), Yoshida; Hidenari (Toyama, JP), Saido; Shuhei (Toyama, JP), Sasaki; Takafumi (Toyama, JP)
Applicant:	Name City State Country Type Hitachi Kokusai Electric Inc. Tokyo N/A JP
Assignee:	KOKUSAI ELECTRIC CORPORATION (Tokyo, JP)
Appl. No.:	D/635,319
Filed:	January 30, 2018

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Foreign Application Priority Data

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Aug 9, 2017 [JP]			2017-017193

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/101,118,122,133,156,162,182,184,199

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References Cited [Referenced By]

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U.S. Patent Documents

D404370	January 1999	Kimura
D560284	January 2008	Nagakubo
D616390	May 2010	Sato
D717746	November 2014	Lau
D732480	June 2015	Makinen
D813181	March 2018	Okajima
2014/0302700	October 2014	Makinen

Foreign Patent Documents

	1579504		Jun 2017		JP

Other References

US. Appl. No. 29/591,907, filed Jan. 25, 2017 by Applicant Hitachi Kokusai Electric Inc., Inventors: Yusaku Okajima, Shuhei Saido and Mika Urushihara. cited by applicant.

Primary Examiner: Holland; Derrick E
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery, LLP

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