U.S. patent number D853,985 [Application Number D/605,564] was granted by the patent office on 2019-07-16 for headphone.
This patent grant is currently assigned to SONY CORPORATION. The grantee listed for this patent is Sony Corporation. Invention is credited to Takeshi Inoue, Tomohiro Ito, Daisuke Matsuo, Hisahiro Tanaka.
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United States Patent |
D853,985 |
Ito , et al. |
July 16, 2019 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Ito; Tomohiro (Tokyo,
JP), Inoue; Takeshi (Kanagawa, JP), Matsuo;
Daisuke (Saitama, JP), Tanaka; Hisahiro (Chiba,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Sony Corporation |
Tokyo |
N/A |
JP |
|
|
Assignee: |
SONY CORPORATION (Tokyo,
JP)
|
Appl.
No.: |
D/605,564 |
Filed: |
May 26, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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29519237 |
Mar 3, 2015 |
D789327 |
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29483330 |
May 19, 2015 |
D729776 |
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Foreign Application Priority Data
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Aug 29, 2013 [JP] |
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D2013-019941 |
Aug 29, 2013 [JP] |
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D2013-019942 |
Aug 29, 2013 [JP] |
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D2013-019943 |
Aug 30, 2013 [CN] |
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2013 3 0418953 |
Sep 3, 2014 [CN] |
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2014 3 0324792 |
Dec 9, 2014 [CN] |
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2014 3 0511146 |
Dec 26, 2014 [JP] |
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D2014-029472 |
Dec 26, 2014 [JP] |
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D2014-029473 |
Dec 26, 2014 [JP] |
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D2014-029474 |
Dec 26, 2014 [JP] |
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D2014-029475 |
Dec 26, 2014 [JP] |
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D2014-029476 |
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Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,251,252,253,256
;D29/112 ;2/209 ;181/129,130,135 ;381/380,381,374
;455/90.3,575.1,569.1 ;379/430,431 ;D8/349,354,355,383 ;D2/626.639
;24/327,321,336,487 ;52/220.1 ;248/311.2,205.2,406 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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302578398 |
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Sep 2013 |
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CN |
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D1404725 |
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Jan 2011 |
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JP |
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D1437170 |
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Apr 2012 |
|
JP |
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D1452156 |
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Oct 2012 |
|
JP |
|
Other References
Website, Amazon.com, "Panasonic RP-HC500 Noise-Canceling
Headphones,"
http://www.amazon.com/Panasonic-RP-HC500-Noise-Canceing-Discontinued-Manu-
facuturer/dp/B000OKH6ZI, product originally available Oct. 2, 2001.
cited by applicant .
Website, Oh My Gadget!, "Phillips introduced a `city` headphones
SHL5705 and SHL5505,"
http://omgdgt.com/2014/02/philips-introduced-a-city-headphones-shl5705-an-
d-shl5505/, posted Feb. 11, 2014. cited by applicant.
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Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Michael Best and Friedrich LLP
Description
FIG. 1 is a front, top, right perspective view of a first
embodiment of a headphone showing our new design;
FIG. 2 is a front, bottom, right perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a partially enlarged front, top, right perspective view
thereof along the lines 7-7 and 7'-7' of FIG. 1;
FIG. 8 is a front, top, right perspective view of a second
embodiment of a headphone showing our new design;
FIG. 9 is a front, bottom, right perspective view thereof;
FIG. 10 is a front elevational view thereof;
FIG. 11 is a rear elevational view thereof;
FIG. 12 is a right side elevational view thereof;
FIG. 13 is a top plan view thereof; and
FIG. 14 is a partially enlarged front, top, right perspective view
thereof along the lines 14-14 and 14'-14' of FIG. 8;
FIG. 15 is a front, top, right perspective view of a third
embodiment of a headphone showing our new design;
FIG. 16 is a front, bottom, right perspective view thereof;
FIG. 17 is a front elevational view thereof;
FIG. 18 is a rear elevational view thereof;
FIG. 19 is a right side elevational view thereof;
FIG. 20 is a top plan view thereof; and
FIG. 21 is a partially enlarged front, top, right perspective view
thereof along the lines 21-21 and 21'-21' of FIG. 17;
FIG. 22 is a front, top, right perspective view of a fourth
embodiment of a headphone showing our new design;
FIG. 23 is a front, bottom, right perspective view thereof;
FIG. 24 is a front elevational view thereof;
FIG. 25 is a rear elevational view thereof;
FIG. 26 is a right side elevational view thereof;
FIG. 27 is a top plan view thereof; and
FIG. 28 is a partially enlarged front, top, right perspective view
thereof along the lines 28-28 and 28'-28' of FIG. 24;
FIG. 29 is a front, top, right perspective view of a fifth
embodiment of a headphone showing our new design;
FIG. 30 is a front, bottom, right perspective view thereof;
FIG. 31 is a front elevational view thereof;
FIG. 32 is a rear elevational view thereof;
FIG. 33 is a right side elevational view thereof;
FIG. 34 is a top plan view thereof; and,
FIG. 35 is a partially enlarged front, top, right perspective view
thereof along the lines 35-35 and 35'-35' of FIG. 31; Broken lines
illustrate unclaimed portions of the earphone or headphone and form
no part of the claimed design. Dot-dash broken lines define the
boundaries of, but are not included in, the claimed design.
* * * * *
References