Earphone

Yashiro May 27, 2

Patent Grant D705757

U.S. patent number D705,757 [Application Number D/454,943] was granted by the patent office on 2014-05-27 for earphone. This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Sony Corporation. Invention is credited to Shogo Yashiro.


United States Patent D705,757
Yashiro May 27, 2014

Earphone

Claims

CLAIM The ornamental design for an earphone, as shown and described.
Inventors: Yashiro; Shogo (Tokyo, JP)
Applicant:
Name City State Country Type

Sony Corporation

Tokyo

N/A

JP
Assignee: Sony Corporation (Tokyo, JP)
Family ID: 50736905
Appl. No.: D/454,943
Filed: May 15, 2013

Foreign Application Priority Data

Dec 28, 2012 [JP] D2012-032190
Dec 28, 2012 [JP] D2012-032191
Dec 28, 2012 [JP] D2012-032192
Current U.S. Class: D14/223
Current CPC Class: H04R1/10 20130101
Current International Class: 1401
Field of Search: ;D14/205,223,188,192 ;181/129,130,135 ;379/430,431 ;381/370,375,380,381 ;455/90.3,575.2

References Cited [Referenced By]

U.S. Patent Documents
D177346 April 1956 Norris
D304944 December 1989 Behringer
D321881 November 1991 Hopewell
D350961 September 1994 Nakamura
D464638 October 2002 Huang
D469755 February 2003 Hlas et al.
D478573 August 2003 Wrisley et al.
D494575 August 2004 Wikel et al.
D501843 February 2005 Oas
D529901 October 2006 Ohta
D543972 June 2007 Taylor
D559837 January 2008 Nakano
D566099 April 2008 Komiyama
D587248 February 2009 Densho
D597534 August 2009 Christopher
D598431 August 2009 Densho
D601548 October 2009 Morisawa
D607880 January 2010 Chung et al.
D621817 August 2010 Brickstad
D634736 March 2011 Wikel et al.
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D652817 January 2012 Lee et al.
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D681602 May 2013 Koch et al.
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2012/0114160 May 2012 Lin
Foreign Patent Documents
D1423110 Sep 2011 JP
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC

Description



FIG. 1 is a front, top, right perspective view of a first embodiment of an earphone showing my new design;

FIG. 2 is a rear, top, left perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and

FIG. 8 is a bottom plan view thereof.

FIG. 9 is a front, top, right perspective view of a second embodiment of an earphone showing my new design;

FIG. 10 is a rear, top, left perspective view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a right side elevational view thereof;

FIG. 15 is a top plan view thereof; and

FIG. 16 is a bottom plan view thereof.

FIG. 17 is a front, top, right perspective view of a third embodiment of an earphone showing my new design;

FIG. 18 is a rear, top, left perspective view thereof;

FIG. 19 is a front elevational view thereof;

FIG. 20 is a rear elevational view thereof;

FIG. 21 is a left side elevational view thereof;

FIG. 22 is a right side elevational view thereof;

FIG. 23 is a top plan view thereof; and,

FIG. 24 is a bottom plan view thereof.

The portions indicated in broken lines are for illustrative purposes only and form no part of the claimed design. Dot-dash broken lines define the boundaries of, but are not included in, the claimed design.

* * * * *


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