U.S. patent number D705,757 [Application Number D/454,943] was granted by the patent office on 2014-05-27 for earphone.
This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Sony Corporation. Invention is credited to Shogo Yashiro.
United States Patent |
D705,757 |
Yashiro |
May 27, 2014 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and
described.
Inventors: |
Yashiro; Shogo (Tokyo,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Sony Corporation |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Family
ID: |
50736905 |
Appl.
No.: |
D/454,943 |
Filed: |
May 15, 2013 |
Foreign Application Priority Data
|
|
|
|
|
Dec 28, 2012 [JP] |
|
|
D2012-032190 |
Dec 28, 2012 [JP] |
|
|
D2012-032191 |
Dec 28, 2012 [JP] |
|
|
D2012-032192 |
|
Current U.S.
Class: |
D14/223 |
Current CPC
Class: |
H04R1/10 20130101 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,223,188,192
;181/129,130,135 ;379/430,431 ;381/370,375,380,381
;455/90.3,575.2 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer
PLLC
Description
FIG. 1 is a front, top, right perspective view of a first
embodiment of an earphone showing my new design;
FIG. 2 is a rear, top, left perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and
FIG. 8 is a bottom plan view thereof.
FIG. 9 is a front, top, right perspective view of a second
embodiment of an earphone showing my new design;
FIG. 10 is a rear, top, left perspective view thereof;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a rear elevational view thereof;
FIG. 13 is a left side elevational view thereof;
FIG. 14 is a right side elevational view thereof;
FIG. 15 is a top plan view thereof; and
FIG. 16 is a bottom plan view thereof.
FIG. 17 is a front, top, right perspective view of a third
embodiment of an earphone showing my new design;
FIG. 18 is a rear, top, left perspective view thereof;
FIG. 19 is a front elevational view thereof;
FIG. 20 is a rear elevational view thereof;
FIG. 21 is a left side elevational view thereof;
FIG. 22 is a right side elevational view thereof;
FIG. 23 is a top plan view thereof; and,
FIG. 24 is a bottom plan view thereof.
The portions indicated in broken lines are for illustrative
purposes only and form no part of the claimed design. Dot-dash
broken lines define the boundaries of, but are not included in, the
claimed design.
* * * * *