Earpiece
Chung , et al. January 12, 2
U.S. patent number D607,880 [Application Number D/337,121] was granted by the patent office on 2010-01-12 for earpiece. This patent grant is currently assigned to Sony Ericsson Mobile Communications AB. Invention is credited to Wenshan Chen, Koi Chin Chung.
| United States Patent | D607,880 |
| Chung , et al. | January 12, 2010 |
Earpiece
Claims
CLAIM The ornamental design for an earpiece, as shown and described.
| Inventors: | Chung; Koi Chin (Singapore, SG), Chen; Wenshan (Singapore, SG) |
|---|---|
| Assignee: | Sony Ericsson Mobile Communications
AB (Lund, SE) |
| Appl. No.: | D/337,121 |
| Filed: | May 15, 2009 |
Foreign Application Priority Data
| Nov 19, 2008 [EM] | 001042287-0003 | |||
| Current U.S. Class: | D14/223 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,206,223,249 ;181/129,130,135,160 ;379/430,431,433.01,420.01-420.04 ;381/380,381,360,361,374,375 ;455/575.1,90.1,90.2 |
References Cited [Referenced By]
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| D593537 | June 2009 | Arimoto |
Attorney, Agent or Firm: Renner, Otto, Boisselle & Sklar, LLP
Description
FIG. 1 is a perspective view of an earpiece showing our design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
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