U.S. patent number D337,589 [Application Number 07/797,278] was granted by the patent office on 1993-07-20 for earphone. This patent grant is currently assigned to Sony Corporation. Invention is credited to Joh Wada.
United States Patent | D337,589 |
Wada | July 20, 1993 |
Inventors: | Wada; Joh (Tokyo, JP) |
---|---|
Assignee: | Sony Corporation (Tokyo,
JP) |
Appl. No.: | 07/797,278 |
Filed: | November 25, 1991 |
Jun 17, 1991 [JP] | 3-18003 | |||
Current U.S. Class: | D14/223 |
Field of Search: | ;D14/204-206,223 ;D29/19 ;181/129 ;379/430 ;381/25,68,68.7,69.2,183,187 |
D311007 | October 1990 | Daido |
D314574 | February 1991 | Kato |
D316550 | April 1991 | Sogabe |
D318473 | July 1991 | Miyashita et al. |
D318670 | July 1991 | Taniguchi |
D326655 | June 1992 | Iribe |
4668842 | May 1987 | Yokoyama et al. |
4742887 | May 1988 | Yamagishi |
4965838 | October 1990 | Kamon et al. |
Radio Shack 1988 Catalog p. 44 Realistic Foam Earpads. . Evans 1988 Catalog p. 278 Ear bud headphone, item 10. . W. Bell & Co., 1990-91 Catalog .COPYRGT.1990 p. 200, Sony MDR-E434 Headphones, item 5.. |
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