Earphone

Densho February 24, 2

Patent Grant D587248

U.S. patent number D587,248 [Application Number D/300,198] was granted by the patent office on 2009-02-24 for earphone. This patent grant is currently assigned to Sony Corporation. Invention is credited to Keiko Densho.


United States Patent D587,248
Densho February 24, 2009

Earphone

Claims

CLAIM The ornamental design for an earphone, as shown and described.
Inventors: Densho; Keiko (Tokyo, JP)
Assignee: Sony Corporation (Tokyo, JP)
Appl. No.: D/300,198
Filed: February 29, 2008

Foreign Application Priority Data

Aug 31, 2007 [JP] D2007-023861
Current U.S. Class: D14/223
Current International Class: 1401
Field of Search: ;D14/205,206,223,242,243,188,192,240,249 ;181/128,129,130,135,137 ;381/381,370 ;379/430,431,444,433 ;D24/174 ;D21/405 ;D10/40

References Cited [Referenced By]

U.S. Patent Documents
D106823 November 1937 Sears
D135674 May 1943 Williams et al.
D304944 December 1989 Behringer
D314964 February 1991 Chung
D350133 August 1994 Kanno
D377796 February 1997 Hayashi
D382307 August 1997 Sharpe et al.
D396722 August 1998 Benedetti
D437314 February 2001 DeLeon
D440551 April 2001 Bolas et al.
D444141 June 2001 Koss et al.
D481374 October 2003 Lee
D510085 September 2005 Suzuki
D519981 May 2006 Lai
D525241 July 2006 Dyer
D533867 December 2006 Koizumi
Foreign Patent Documents
1305029 Jun 2007 JP
1305030 Jun 2007 JP
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer, PLLC

Description



FIG. 1 is a front perspective view of an earphone showing my new design, the undisclosed opposite perspective view is not part of the claimed design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a left side elevational view thereof.

The portions indicated in broken lines are for illustrative purposes only and form no part of the claimed design.

* * * * *


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