Headphone

Morimoto , et al. May 6, 2

Patent Grant D704161

U.S. patent number D704,161 [Application Number D/446,102] was granted by the patent office on 2014-05-06 for headphone. This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Sony Corporation. Invention is credited to So Morimoto, Shogo Yashiro.


United States Patent D704,161
Morimoto ,   et al. May 6, 2014

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Morimoto; So (Tokyo, JP), Yashiro; Shogo (Tokyo, JP)
Applicant:
Name City State Country Type

Sony Corporation

Tokyo

N/A

JP
Assignee: Sony Corporation (Tokyo, JP)
Family ID: 50553223
Appl. No.: D/446,102
Filed: February 20, 2013

Foreign Application Priority Data

Aug 23, 2012 [CN] 2012 3 0401461
Current U.S. Class: D14/205
Current CPC Class: H04R1/1066 20130101; H04R1/1008 20130101; H04R5/033 20130101; H04R5/0335 20130101
Current International Class: 1401
Field of Search: ;D14/205,206 ;181/129,130,135 ;379/430,431 ;381/380,381,370,374 ;D29/112 ;2/209

References Cited [Referenced By]

U.S. Patent Documents
D328074 July 1992 Yamazaki et al.
D337115 July 1993 Yamazaki et al.
D353817 December 1994 Wada
D373360 September 1996 Kanno
D377021 December 1996 Isono
D410466 June 1999 Mouri
6252970 June 2001 Poon et al.
6434250 August 2002 Tsuhako
D517045 March 2006 Komiyama
D519110 April 2006 Komiyama
D519497 April 2006 Komiyama
D584715 January 2009 Brennwald
D600674 September 2009 Brennwald
D603370 November 2009 Suzuki
D642554 August 2011 Schaal et al.
D656125 March 2012 Komiyama et al.
D661685 June 2012 Lee et al.
D666990 September 2012 Komiyama et al.
D669450 October 2012 Katsumata
D674372 January 2013 Kelly et al.
D674767 January 2013 Brunner et al.
D677243 March 2013 Kitayama et al.
D683717 June 2013 Kelly et al.
D686190 July 2013 Karacal et al.
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC

Description



FIG. 1 is a perspective view of a headphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and

FIG. 6 is a bottom plan view thereof.

FIG. 7 is a perspective view of a second embodiment of a headphone showing our new design;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a right side elevational view thereof;

FIG. 11 is a top plan view thereof; and,

FIG. 12 is a bottom plan view thereof.

Portions in broken lines are for illustrative purposes only and form no part of claimed design. Dot-dash broken lines define the boundaries of, but not included in, the claimed design.

* * * * *


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