U.S. patent number D704,161 [Application Number D/446,102] was granted by the patent office on 2014-05-06 for headphone.
This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Sony Corporation. Invention is credited to So Morimoto, Shogo Yashiro.
United States Patent |
D704,161 |
Morimoto , et al. |
May 6, 2014 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Morimoto; So (Tokyo,
JP), Yashiro; Shogo (Tokyo, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Sony Corporation |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Family
ID: |
50553223 |
Appl.
No.: |
D/446,102 |
Filed: |
February 20, 2013 |
Foreign Application Priority Data
|
|
|
|
|
Aug 23, 2012 [CN] |
|
|
2012 3 0401461 |
|
Current U.S.
Class: |
D14/205 |
Current CPC
Class: |
H04R1/1066 20130101;
H04R1/1008 20130101; H04R5/033 20130101; H04R5/0335 20130101 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,206
;181/129,130,135 ;379/430,431 ;381/380,381,370,374 ;D29/112
;2/209 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer
PLLC
Description
FIG. 1 is a perspective view of a headphone showing our new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof; and
FIG. 6 is a bottom plan view thereof.
FIG. 7 is a perspective view of a second embodiment of a headphone
showing our new design;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a rear elevational view thereof;
FIG. 10 is a right side elevational view thereof;
FIG. 11 is a top plan view thereof; and,
FIG. 12 is a bottom plan view thereof.
Portions in broken lines are for illustrative purposes only and
form no part of claimed design. Dot-dash broken lines define the
boundaries of, but not included in, the claimed design.
* * * * *