Headphone

Kitayama , et al. March 5, 2

Patent Grant D677243

U.S. patent number D677,243 [Application Number D/421,592] was granted by the patent office on 2013-03-05 for headphone. This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Emmanuelle Choteau, Sohei Kitayama. Invention is credited to Emmanuelle Choteau, Sohei Kitayama.


United States Patent D677,243
Kitayama ,   et al. March 5, 2013

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Kitayama; Sohei (Tokyo, JP), Choteau; Emmanuelle (Surrey, GB)
Applicant:
Name City State Country Type

Kitayama; Sohei
Choteau; Emmanuelle

Tokyo
Surrey

N/A
N/A

JP
GB
Assignee: Sony Corporation (Tokyo, JP)
Appl. No.: D/421,592
Filed: August 20, 2012

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29395889 Apr 18, 2012
29371971 Mar 9, 2012 D666990
29371443 Feb 28, 2011 D656125

Foreign Application Priority Data

Aug 26, 2010 [JP] D2010-020572
Aug 27, 2010 [CN] 2010 3 0508542
Aug 27, 2010 [CN] 2010 3 0508544
Oct 19, 2011 [JP] D2011-024000
Current U.S. Class: D14/205
Current International Class: 1401
Field of Search: ;D14/205 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;455/90.3,575.1

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Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC

Description



FIG. 1 is a perspective view of a first embodiment of a headphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and

FIG. 6 is a bottom plan view thereof.

FIG. 7 is a perspective view of a second embodiment of a headphone showing our new design;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a right side elevational view thereof;

FIG. 11 is a top plan view thereof; and,

FIG. 12 is a bottom plan view thereof.

* * * * *


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