Headphone
Hsieh , et al. August 30, 2
U.S. patent number D765,055 [Application Number D/521,148] was granted by the patent office on 2016-08-30 for headphone. This patent grant is currently assigned to 1MORE INC.. The grantee listed for this patent is 1MORE INC.. Invention is credited to Jiao Chen, Kuanhong Hsieh, Boqing Lin, Qingqing Zheng.
| United States Patent | D765,055 |
| Hsieh , et al. | August 30, 2016 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and described.
| Inventors: | Hsieh; Kuanhong (Guangdong, CN), Lin; Boqing (Shenzhen, CN), Chen; Jiao (Shenzhen, CN), Zheng; Qingqing (Shenzhen, CN) | ||||||||||
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| Applicant: |
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| Assignee: | 1MORE INC. (Shenzhen,
CN) |
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| Appl. No.: | D/521,148 | ||||||||||
| Filed: | March 20, 2015 |
Foreign Application Priority Data
| Nov 13, 2014 [CN] | 2014 3 0446759 | |||
| Current U.S. Class: | D14/205 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,188,192 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;381/380,381,374 ;455/90.3,575.1,569.1 |
References Cited [Referenced By]
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Attorney, Agent or Firm: Polsinelli PC
Description
FIG. 1 is a front elevational view of a headphone showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left-side elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a right side perspective view thereof.
The claimed invention is symmetrical, such that a left side perspective view of the headphone would be symmetrical to the view of FIG. 7.
The broken lines in the drawings form no part of the claimed design.
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