Headphone

Katsumata December 10, 2

Patent Grant D695261

U.S. patent number D695,261 [Application Number D/421,495] was granted by the patent office on 2013-12-10 for headphone. This patent grant is currently assigned to Sony Corporation. The grantee listed for this patent is Kenji Katsumata. Invention is credited to Kenji Katsumata.


United States Patent D695,261
Katsumata December 10, 2013

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Katsumata; Kenji (Tokyo, JP)
Applicant:
Name City State Country Type

Katsumata; Kenji

Tokyo

N/A

JP
Assignee: Sony Corporation (Tokyo, JP)
Appl. No.: D/421,495
Filed: August 1, 2012

Foreign Application Priority Data

Feb 2, 2012 [CN] 2012 3 0020981
Current U.S. Class: D14/205
Current International Class: 1401
Field of Search: ;D14/205,206 ;181/129,130,135 ;379/430,431 ;381/380,381 ;455/90.3,575.1 ;D29/112 ;2/209

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Foreign Patent Documents
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Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC

Description



FIG. 1 is a perspective view of a first embodiment of a headphone showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

FIG. 8 is a perspective view of a second embodiment of a headphone showing my new design;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a left side elevational view thereof;

FIG. 12 is a right side elevational view thereof;

FIG. 13 is a top plan view thereof; and

FIG. 14 is a bottom plan view thereof.

FIG. 15 is a perspective view of a third embodiment of a headphone showing my new design;

FIG. 16 is a front elevational view thereof;

FIG. 17 is a rear elevational view thereof;

FIG. 18 is a left side elevational view thereof;

FIG. 19 is a right side elevational view thereof;

FIG. 20 is a top plan view thereof; and

FIG. 21 is a bottom plan view thereof.

FIG. 22 is a perspective view of a fourth embodiment of a headphone showing my new design;

FIG. 23 is a front elevational view thereof;

FIG. 24 is a rear elevational view thereof;

FIG. 25 is a left side elevational view thereof;

FIG. 26 is a right side elevational view thereof;

FIG. 27 is a top plan view thereof; and,

FIG. 28 is a bottom plan view thereof.

Portions shown as broken lines are for illustrative purposes only and form no part of the claimed design. Dot-dash broken lines define the boundaries of, but not included in, the claimed design.

* * * * *


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