Earphone

Description

FIG. 1 is a front perspective view of an earphone showing my new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side elevational view thereof; and,

FIG. 8 is a left side elevational view thereof.

Claims

CLAIM The ornamental design for an earphone, as shown.

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Inventors:	Densho; Keiko (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/300,199
Filed:	February 29, 2008

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Foreign Application Priority Data

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Aug 31, 2007 [JP]			D2007-023857

Current U.S. Class:	D14/223
Current International Class:	1401
Field of Search:	;D14/205,206,223,240,249 ;181/128,129,130,135,137 ;381/381 ;379/430,433 ;D24/174

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References Cited [Referenced By]

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U.S. Patent Documents

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Foreign Patent Documents

	D1305029		Jun 2006		JP
	D1305030		Jun 2007		JP

Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer, PLLC