Power device package
Prajuckamol , et al. May 10, 2
U.S. patent number D755,741 [Application Number D/517,863] was granted by the patent office on 2016-05-10 for power device package. This patent grant is currently assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC. The grantee listed for this patent is Semiconductor Components Industries, LLC. Invention is credited to Chee Hiong Chew, Atapol Prajuckamol, Yushuang Yao.
| United States Patent | D755,741 |
| Prajuckamol , et al. | May 10, 2016 |
Power device package
Claims
CLAIM The ornamental design for a power device package, as shown and described.
| Inventors: | Prajuckamol; Atapol (Klaeng, TH), Chew; Chee Hiong (Seremban, MY), Yao; Yushuang (Seremban, MY) | ||||||||||
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| Applicant: |
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| Assignee: | SEMICONDUCTOR COMPONENTS
INDUSTRIES, LLC (Phoenix, AZ) |
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| Appl. No.: | D/517,863 | ||||||||||
| Filed: | February 18, 2015 |
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/110,182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106 |
References Cited [Referenced By]
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| D710319 | August 2014 | Chen |
Description
FIG. 1 is a top perspective view of a power device package showing my new design;
FIG. 2 is another top perspective view thereof;
FIG. 3 is a bottom perspective view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevation view thereof;
FIG. 7 is a right side elevation view thereof;
FIG. 8 is a back elevation view thereof; and,
FIG. 9 is a front elevation view thereof.
The broken lines shown in the drawings represent portions of the power device package that form no part of the claimed design.
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