CHEW; Chee Hiong
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHEW; Chee Hiong.The latest application filed is for "silicon-on-insulator die support structures and related methods".
Company Profile
49.51.75
- CHEW; Chee Hiong - Seremban MY
- Chew, Chee Hiong - Nigeri Sembilan MY
- Chew, Chee Hiong - Negeri Sembilan MY
Patent Activity
| Patent | Date |
|---|---|
| Silicon-on-insulator Die Support Structures And Related Methods App 20220301876 - SEDDON; Michael J. ; et al. | 2022-09-22 |
| Fin frame assemblies Grant 11,452,225 - Prajuckamol , et al. September 20, 2 | 2022-09-20 |
| Power Modules And Related Methods App 20220293499 - ZHOU; Jinchang ; et al. | 2022-09-15 |
| Substrate structures and methods of manufacture Grant 11,437,304 - Lin , et al. September 6, 2 | 2022-09-06 |
| Reinforced Semiconductor Die And Related Methods App 20220254734 - CHEW; Chee Hiong ; et al. | 2022-08-11 |
| Semiconductor Packages With Die Including Cavities And Related Methods App 20220246434 - SEDDON; Michael J. ; et al. | 2022-08-04 |
| Semiconductor packages with thin die and related methods Grant 11,404,276 - Carney , et al. August 2, 2 | 2022-08-02 |
| Die sidewall coatings and related methods Grant 11,404,277 - Carney , et al. August 2, 2 | 2022-08-02 |
| Backmetal Removal Methods App 20220238342 - SEDDON; Michael J. ; et al. | 2022-07-28 |
| Semiconductor Package With Wettable Flank And Related Methods App 20220208658 - LER; Hui Min ; et al. | 2022-06-30 |
| Spacer With Pattern Layout For Dual Side Cooling Power Module App 20220208635 - LIU; Yong ; et al. | 2022-06-30 |
| Quad leadframe packages and related methods Grant 11,373,939 - Zhou , et al. June 28, 2 | 2022-06-28 |
| Press-fit pin for semiconductor packages and related methods Grant 11,374,373 - Chew , et al. June 28, 2 | 2022-06-28 |
| Multiple Substrate Package Systems And Related Methods App 20220199502 - PRAJUCKAMOL; Atapol ; et al. | 2022-06-23 |
| Silicon-on-insulator die support structures and related methods Grant 11,361,970 - Seddon , et al. June 14, 2 | 2022-06-14 |
| Reinforced semiconductor die and related methods Grant 11,348,878 - Tolentino , et al. May 31, 2 | 2022-05-31 |
| Backmetal removal methods Grant 11,348,796 - Seddon , et al. May 31, 2 | 2022-05-31 |
| Semiconductor package system and related methods Grant 11,342,237 - Yao , et al. May 24, 2 | 2022-05-24 |
| Semiconductor packages with die including cavities and related methods Grant 11,342,189 - Seddon , et al. May 24, 2 | 2022-05-24 |
| Semiconductor Package App 20220159853 - PRAJUCKAMOL; Atapol ; et al. | 2022-05-19 |
| Method for forming a semiconductor package Grant 11,272,625 - Prajuckamol , et al. March 8, 2 | 2022-03-08 |
| Semiconductor device assemblies including low-stress spacer Grant 11,217,506 - Prajuckamol , et al. January 4, 2 | 2022-01-04 |
| Power Module Package Casing With Protrusion Supports App 20210343620 - YAO; Yushuang ; et al. | 2021-11-04 |
| Fin Frame Assemblies App 20210219448 - PRAJUCKAMOL; Atapol ; et al. | 2021-07-15 |
| Semiconductor Device Assemblies Including Low-stress Spacer App 20210193551 - PRAJUCKAMOL; Atapol ; et al. | 2021-06-24 |
| Semiconductor baseplates Grant 10,971,428 - Prajuckamol , et al. April 6, 2 | 2021-04-06 |
| Fin frame assemblies Grant 10,966,335 - Prajuckamol , et al. March 30, 2 | 2021-03-30 |
| Connecting Clip Design For Pressure Sintering App 20210090975 - PRAJUCKAMOL; Atapol ; et al. | 2021-03-25 |
| Semiconductor Package System And Related Methods App 20210050272 - YAO; Yushuang ; et al. | 2021-02-18 |
| Molded wafer level packaging Grant 10,916,485 - Wang , et al. February 9, 2 | 2021-02-09 |
| Low Stress Asymmetric Dual Side Module App 20210035956 - CHEW; Chee Hiong ; et al. | 2021-02-04 |
| Low Stress Asymmetric Dual Side Module App 20210035892 - CHEW; Chee Hiong ; et al. | 2021-02-04 |
| Polymer Resin And Compression Mold Chip Scale Package App 20210028133 - LIN; Yusheng ; et al. | 2021-01-28 |
| Method of making single reflow power pin connections Grant 10,897,821 - Yao , et al. January 19, 2 | 2021-01-19 |
| Pre-stacking Mechanical Strength Enhancement Of Power Device Structures App 20210013176 - LIN; Yusheng ; et al. | 2021-01-14 |
| Semiconductor Baseplates App 20200402887 - PRAJUCKAMOL; Atapol ; et al. | 2020-12-24 |
| Package structure with multiple substrates Grant 10,861,767 - Prajuckamol , et al. December 8, 2 | 2020-12-08 |
| Connecting clip design for pressure sintering Grant 10,861,775 - Prajuckamol , et al. December 8, 2 | 2020-12-08 |
| Semiconductor Package With Guide Pin App 20200373231 - CHEW; Chee Hiong ; et al. | 2020-11-26 |
| Leadless Semiconductor Packages, Leadframes Therefor, And Methods Of Making App 20200365494 - TRUHITTE; Darrell D. ; et al. | 2020-11-19 |
| Semiconductor Packages With Die Including Cavities And Related Methods App 20200365408 - SEDDON; Michael J. ; et al. | 2020-11-19 |
| Semiconductor package system and related methods Grant 10,825,748 - Yao , et al. November 3, 2 | 2020-11-03 |
| Polymer resin and compression mold chip scale package Grant 10,825,786 - Lin , et al. November 3, 2 | 2020-11-03 |
| Fin Frame Assemblies App 20200344905 - PRAJUCKAMOL; Atapol ; et al. | 2020-10-29 |
| Semiconductor Devices And Methods Of Making The Same App 20200312749 - KHOR; Swee Har ; et al. | 2020-10-01 |
| Reinforced Semiconductor Die And Related Methods App 20200294935 - TOLENTINO; Erik Nino ; et al. | 2020-09-17 |
| Semiconductor Package and Related Methods App 20200286865 - CHEW; Chee Hiong ; et al. | 2020-09-10 |
| Backmetal Removal Methods App 20200286736 - SEDDON; Michael J. ; et al. | 2020-09-10 |
| Semiconductor Packages With Thin Die And Related Methods App 20200286735 - CARNEY; Francis J. ; et al. | 2020-09-10 |
| Die Sidewall Coatings And Related Methods App 20200279747 - CARNEY; Francis J. ; et al. | 2020-09-03 |
| Press-fit Pin For Semiconductor Packages And Related Methods App 20200274310 - CHEW; Chee Hiong ; et al. | 2020-08-27 |
| Leadless semiconductor packages, leadframes therefor, and methods of making Grant 10,756,006 - Truhitte , et al. A | 2020-08-25 |
| Silicon-on-insulator Die Support Structures And Related Methods App 20200258751 - A1 | 2020-08-13 |
| Die Support Structures And Related Methods App 20200258750 - A1 | 2020-08-13 |
| Semiconductor devices and methods of making the same Grant 10,727,170 - Khor , et al. | 2020-07-28 |
| Flexible press fit pins for semiconductor packages and related methods Grant 10,720,725 - Yao , et al. | 2020-07-21 |
| Reinforced semiconductor die and related methods Grant 10,700,018 - Tolentino , et al. | 2020-06-30 |
| Press-fit pin for semiconductor packages and related methods Grant 10,693,270 - Chew , et al. | 2020-06-23 |
| Semiconductor Package With Elastic Coupler And Related Methods App 20200194322 - LIN; Yusheng ; et al. | 2020-06-18 |
| Flexible Press Fit Pins For Semiconductor Packages And Related Methods App 20200176907 - YAO; Yushuang ; et al. | 2020-06-04 |
| Reinforced Semiconductor Die And Related Methods App 20200144200 - TOLENTINO; Erik Nino ; et al. | 2020-05-07 |
| Molded Wafer Level Packaging App 20200126880 - WANG; Soon Wei ; et al. | 2020-04-23 |
| Connecting Clip Design For Pressure Sintering App 20200105648 - PRAJUCKAMOL; Atapol ; et al. | 2020-04-02 |
| Semiconductor package with elastic coupler and related methods Grant 10,607,903 - Lin , et al. | 2020-03-31 |
| Power Modules And Related Methods App 20200098671 - ZHOU; Jinchang ; et al. | 2020-03-26 |
| Molded wafer level packaging Grant 10,559,510 - Wang , et al. Feb | 2020-02-11 |
| Flexible press fit pins for semiconductor packages and related methods Grant 10,559,905 - Yao , et al. Feb | 2020-02-11 |
| Package Structure With Multiple Substrates App 20190348342 - PRAJUCKAMOL; Atapol ; et al. | 2019-11-14 |
| Semiconductor Package With Elastic Coupler And Related Methods App 20190252275 - LIN; Yusheng ; et al. | 2019-08-15 |
| Polymer Resin And Compression Mold Chip Scale Package App 20190221532 - LIN; Yusheng ; et al. | 2019-07-18 |
| Semiconductor package with elastic coupler and related methods Grant 10,319,652 - Lin , et al. | 2019-06-11 |
| Flexible Press Fit Pins For Semiconductor Packages And Related Methods App 20190173215 - YAO; Yushuang ; et al. | 2019-06-06 |
| Polymer resin and compression mold chip scale package Grant 10,283,466 - Lin , et al. | 2019-05-07 |
| Leadless Semiconductor Packages, Leadframes Therefor, And Methods Of Making App 20190122967 - TRUHITTE; Darrell D. ; et al. | 2019-04-25 |
| Single Reflow Power Pin Connections App 20190116669 - YAO; Yushuang ; et al. | 2019-04-18 |
| Single reflow power pin connections Grant 10,231,340 - Yao , et al. | 2019-03-12 |
| Flexible press fit pins for semiconductor packages and related methods Grant 10,224,655 - Yao , et al. | 2019-03-05 |
| Molded Wafer Level Packaging App 20190067143 - WANG; Soon Wei ; et al. | 2019-02-28 |
| Leadless semiconductor packages, leadframes therefor, and methods of making Grant 10,199,311 - Truhitte , et al. Fe | 2019-02-05 |
| Clip and related methods Grant 10,121,763 - Chew , et al. November 6, 2 | 2018-11-06 |
| Method For Forming A Semiconductor Package App 20180228041 - PRAJUCKAMOL; Atapol ; et al. | 2018-08-09 |
| Embedded Stacked Die Packages And Related Methods App 20180211939 - LIN; Yusheng ; et al. | 2018-07-26 |
| Clip And Related Methods App 20180197836 - CHEW; Chee Hiong ; et al. | 2018-07-12 |
| Semiconductor package and method therefor Grant 9,967,986 - Prajuckamol , et al. May 8, 2 | 2018-05-08 |
| Embedded stacked die packages and related methods Grant 9,941,257 - Lin , et al. April 10, 2 | 2018-04-10 |
| Long-lasting Wettable Flanks App 20180090421 - THEN; Nam Khong ; et al. | 2018-03-29 |
| Clip and related methods Grant 9,911,712 - Chew , et al. March 6, 2 | 2018-03-06 |
| Embedded Stacked Die Packages And Related Methods App 20180033777 - LIN; Yusheng ; et al. | 2018-02-01 |
| Semiconductor Packages With Sub-terminals And Related Methods App 20170365518 - Prajuckamol; Atapol ; et al. | 2017-12-21 |
| Polymer Resin And Compression Mold Chip Scale Package App 20170345779 - LIN; Yusheng ; et al. | 2017-11-30 |
| Single Reflow Power Pin Connections App 20170347456 - YAO; Yushuang ; et al. | 2017-11-30 |
| Semiconductor Package With Elastic Coupler And Related Methods App 20170294362 - LIN; Yusheng ; et al. | 2017-10-12 |
| Die support for enlarging die size Grant 9,748,163 - Wang , et al. August 29, 2 | 2017-08-29 |
| Semiconductor package with elastic coupler and related methods Grant 9,691,732 - Lin , et al. June 27, 2 | 2017-06-27 |
| Semiconductor Package System And Related Methods App 20170170084 - YAO; Yushuang ; et al. | 2017-06-15 |
| Flexible Press Fit Pins For Semiconductor Packages And Related Methods App 20170170582 - YAO; Yushuang ; et al. | 2017-06-15 |
| Semiconductor Package System And Related Methods App 20170170083 - Yao; Yushuang ; et al. | 2017-06-15 |
| Embedded stacked die packages and related methods Grant 9,679,878 - Lin , et al. June 13, 2 | 2017-06-13 |
| Substrate Structures And Methods Of Manufacture App 20170162481 - LIN; Yusheng ; et al. | 2017-06-08 |
| Leadless Semiconductor Packages, Leadframes Therefor, And Methods Of Making App 20170133302 - TRUHITTE; Darrell D. ; et al. | 2017-05-11 |
| Clip And Related Methods App 20170117211 - CHEW; Chee Hiong ; et al. | 2017-04-27 |
| Press-fit Pin For Semiconductor Packages And Related Methods App 20170110843 - CHEW; Chee Hiong ; et al. | 2017-04-20 |
| Flexible press fit pins for semiconductor packages and related methods Grant 9,620,877 - Yao , et al. April 11, 2 | 2017-04-11 |
| Semiconductor Device And Method Of Forming An Alignment Structure In Backside Of A Semiconductor Die App 20170084545 - SEDDON; Michael J. ; et al. | 2017-03-23 |
| Semiconductor Devices And Methods Of Making The Same App 20170062310 - KHOR; Swee Har ; et al. | 2017-03-02 |
| Press-fit pin for semiconductor packages and related methods Grant 9,570,832 - Chew , et al. February 14, 2 | 2017-02-14 |
| Semiconductor Package With Elastic Coupler And Related Methods App 20160343683 - LIN; Yusheng ; et al. | 2016-11-24 |
| Press-fit Pin For Semiconductor Packages And Related Methods App 20160276772 - CHEW; Chee Hiong ; et al. | 2016-09-22 |
| Semiconductor package with elastic coupler and related methods Grant 9,431,311 - Lin , et al. August 30, 2 | 2016-08-30 |
| Semiconductor Package With Elastic Coupler And Related Methods App 20160247735 - Lin; Yusheng ; et al. | 2016-08-25 |
| Semiconductor Packages With Sub-terminals And Related Methods App 20160240452 - Prajuckamol; Atapol ; et al. | 2016-08-18 |
| Power device package Grant D755,741 - Prajuckamol , et al. May 10, 2 | 2016-05-10 |
| Power device package Grant D755,742 - Prajuckamol , et al. May 10, 2 | 2016-05-10 |
| Flexible Press Fit Pins For Semiconductor Packages And Related Methods App 20150364847 - YAO; Yushuang ; et al. | 2015-12-17 |
| Semiconductor Package And Method Therefor App 20150189772 - PRAJUCKAMOL; Atapol ; et al. | 2015-07-02 |
| Electronic device including a packaging substrate having a trench Grant 8,519,521 - Krishnan , et al. August 27, 2 | 2013-08-27 |
| Electronic Device Including A Packaging Substrate Having A Trench App 20120306066 - Krishnan; Shutesh ; et al. | 2012-12-06 |
| Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads Grant 8,268,676 - Krishnan , et al. September 18, 2 | 2012-09-18 |
| Electronic Device Including A Packaging Substrate Having A Trench App 20110115061 - Krishnan; Shutesh ; et al. | 2011-05-19 |
| Circuit component and method of manufacture Grant 7,736,951 - Prajuckamol , et al. June 15, 2 | 2010-06-15 |
| Circuit Component And Method Of Manufacture App 20080224278 - Prajuckamol; Atapol ; et al. | 2008-09-18 |
| Solder clad lead frame for assembly of semiconductor devices and method App 20020066945 - Chew, Chee Hiong | 2002-06-06 |
| Method of manufacturing a semiconductor component and semiconductor component thereof App 20020066962 - Embong, Saat Shukri ; et al. | 2002-06-06 |
| Lead Frame For Assembly For Thin Small Outline Plastic Encapsulated Packages App 20020066943 - Tan, Aik Chong ; et al. | 2002-06-06 |
| Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe Grant 5,973,388 - Chew , et al. October 26, 1 | 1999-10-26 |
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