Yao; Yushuang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yao; Yushuang.The latest application filed is for "semiconductor package system and related methods".
Company Profile
12.23.29
- Yao; Yushuang - Shenzhen CN
- YAO; Yushuang - Seremban MY
Patent Activity
| Patent | Date |
|---|---|
| Fin frame assemblies Grant 11,452,225 - Prajuckamol , et al. September 20, 2 | 2022-09-20 |
| Semiconductor Package System And Related Methods App 20220246486 - YAO; Yushuang ; et al. | 2022-08-04 |
| Power Module App 20220208666 - YANG; Qing ; et al. | 2022-06-30 |
| Semiconductor package system and related methods Grant 11,342,237 - Yao , et al. May 24, 2 | 2022-05-24 |
| Power Module Package Baseplate With Step Recess Design App 20220157696 - YAO; Yushuang ; et al. | 2022-05-19 |
| Semiconductor Package App 20220159853 - PRAJUCKAMOL; Atapol ; et al. | 2022-05-19 |
| Power Module App 20220130740 - YANG; Qing ; et al. | 2022-04-28 |
| Power module Grant 11,315,859 - Yang , et al. April 26, 2 | 2022-04-26 |
| Method for forming a semiconductor package Grant 11,272,625 - Prajuckamol , et al. March 8, 2 | 2022-03-08 |
| Power Module Package Casing With Protrusion Supports App 20210343620 - YAO; Yushuang ; et al. | 2021-11-04 |
| Housings For Semiconductor Packages And Related Methods App 20210265248 - YAO; Yushuang ; et al. | 2021-08-26 |
| Power module housing Grant 11,081,828 - Kim , et al. August 3, 2 | 2021-08-03 |
| Fin Frame Assemblies App 20210219448 - PRAJUCKAMOL; Atapol ; et al. | 2021-07-15 |
| Press-fit pin case Grant D922,329 - Kim , et al. June 15, 2 | 2021-06-15 |
| Semiconductor baseplates Grant 10,971,428 - Prajuckamol , et al. April 6, 2 | 2021-04-06 |
| Fin frame assemblies Grant 10,966,335 - Prajuckamol , et al. March 30, 2 | 2021-03-30 |
| Connecting Clip Design For Pressure Sintering App 20210090975 - PRAJUCKAMOL; Atapol ; et al. | 2021-03-25 |
| Semiconductor Package System And Related Methods App 20210050272 - YAO; Yushuang ; et al. | 2021-02-18 |
| Method of making single reflow power pin connections Grant 10,897,821 - Yao , et al. January 19, 2 | 2021-01-19 |
| Semiconductor Baseplates App 20200402887 - PRAJUCKAMOL; Atapol ; et al. | 2020-12-24 |
| Package structure with multiple substrates Grant 10,861,767 - Prajuckamol , et al. December 8, 2 | 2020-12-08 |
| Connecting clip design for pressure sintering Grant 10,861,775 - Prajuckamol , et al. December 8, 2 | 2020-12-08 |
| Semiconductor Package With Guide Pin App 20200373231 - CHEW; Chee Hiong ; et al. | 2020-11-26 |
| Power Module Housing App 20200358221 - KIM; Jihwan ; et al. | 2020-11-12 |
| Semiconductor package system and related methods Grant 10,825,748 - Yao , et al. November 3, 2 | 2020-11-03 |
| Fin Frame Assemblies App 20200344905 - PRAJUCKAMOL; Atapol ; et al. | 2020-10-29 |
| Flexible press fit pins for semiconductor packages and related methods Grant 10,720,725 - Yao , et al. | 2020-07-21 |
| Flexible Press Fit Pins For Semiconductor Packages And Related Methods App 20200176907 - YAO; Yushuang ; et al. | 2020-06-04 |
| Connecting Clip Design For Pressure Sintering App 20200105648 - PRAJUCKAMOL; Atapol ; et al. | 2020-04-02 |
| Flexible press fit pins for semiconductor packages and related methods Grant 10,559,905 - Yao , et al. Feb | 2020-02-11 |
| Package Structure With Multiple Substrates App 20190348342 - PRAJUCKAMOL; Atapol ; et al. | 2019-11-14 |
| Semiconductor package and related methods Grant 10,319,659 - Prajuckamol , et al. | 2019-06-11 |
| Flexible Press Fit Pins For Semiconductor Packages And Related Methods App 20190173215 - YAO; Yushuang ; et al. | 2019-06-06 |
| Single Reflow Power Pin Connections App 20190116669 - YAO; Yushuang ; et al. | 2019-04-18 |
| Semiconductor Package And Related Methods App 20190115275 - PRAJUCKAMOL; Atapol ; et al. | 2019-04-18 |
| Single reflow power pin connections Grant 10,231,340 - Yao , et al. | 2019-03-12 |
| Flexible press fit pins for semiconductor packages and related methods Grant 10,224,655 - Yao , et al. | 2019-03-05 |
| Clip and related methods Grant 10,121,763 - Chew , et al. November 6, 2 | 2018-11-06 |
| Method For Forming A Semiconductor Package App 20180228041 - PRAJUCKAMOL; Atapol ; et al. | 2018-08-09 |
| Clip And Related Methods App 20180197836 - CHEW; Chee Hiong ; et al. | 2018-07-12 |
| Semiconductor package and method therefor Grant 9,967,986 - Prajuckamol , et al. May 8, 2 | 2018-05-08 |
| Clip and related methods Grant 9,911,712 - Chew , et al. March 6, 2 | 2018-03-06 |
| Single Reflow Power Pin Connections App 20170347456 - YAO; Yushuang ; et al. | 2017-11-30 |
| Flexible Press Fit Pins For Semiconductor Packages And Related Methods App 20170170582 - YAO; Yushuang ; et al. | 2017-06-15 |
| Semiconductor Package System And Related Methods App 20170170084 - YAO; Yushuang ; et al. | 2017-06-15 |
| Semiconductor Package System And Related Methods App 20170170083 - Yao; Yushuang ; et al. | 2017-06-15 |
| Clip And Related Methods App 20170117211 - CHEW; Chee Hiong ; et al. | 2017-04-27 |
| Flexible press fit pins for semiconductor packages and related methods Grant 9,620,877 - Yao , et al. April 11, 2 | 2017-04-11 |
| Power device package Grant D755,742 - Prajuckamol , et al. May 10, 2 | 2016-05-10 |
| Power device package Grant D755,741 - Prajuckamol , et al. May 10, 2 | 2016-05-10 |
| Flexible Press Fit Pins For Semiconductor Packages And Related Methods App 20150364847 - YAO; Yushuang ; et al. | 2015-12-17 |
| Semiconductor Package And Method Therefor App 20150189772 - PRAJUCKAMOL; Atapol ; et al. | 2015-07-02 |
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