Patent applications and USPTO patent grants for CompTake Technology Inc..The latest application filed is for "solid state disk module and heat sink device thereof".
Patent | Date |
---|---|
Packaging tray for hard disk drive Grant 10,937,463 - Chen , et al. March 2, 2 | 2021-03-02 |
Solid state disk module and heat sink device thereof Grant 10,383,252 - Chen , et al. A | 2019-08-13 |
Solid State Disk Module And Heat Sink Device Thereof App 20190215983 - CHEN; Wei-Hau ;   et al. | 2019-07-11 |
Hard disk and housing thereof Grant 9,541,967 - Chen , et al. January 10, 2 | 2017-01-10 |
Housing of solid state drive Grant D714,789 - Chen , et al. October 7, 2 | 2014-10-07 |
Heat Dissipation Unit Used In Memory Device App 20140202675 - CHEN; Wei-Hau ;   et al. | 2014-07-24 |
Housing Structure For Solid-state Drive App 20140111069 - CHEN; Wei-Hau ;   et al. | 2014-04-24 |
Casing Of Solid State Disk And Solid State Disk Having The Same App 20140063724 - CHEN; Wei-Hau ;   et al. | 2014-03-06 |
Casing Of Solid State Disk And Solid State Disk Having The Same App 20140063725 - CHEN; Wei-Hau ;   et al. | 2014-03-06 |
Heat dissipating module of memory Grant D689,829 - Chen , et al. September 17, 2 | 2013-09-17 |
Structure of anti tamper case for solid state disk Grant 8,531,845 - Chen , et al. September 10, 2 | 2013-09-10 |
Slidingly-engaged heat-dissipating assembly for memory and memory device having the same Grant 8,411,443 - Chen , et al. April 2, 2 | 2013-04-02 |
Structure Of Anti Tamper Case For Solid State Disk App 20120250271 - Chen; Wei-Hau ;   et al. | 2012-10-04 |
Slidingly-engaged Heat-dissipating Assembly For Memory And Memory Device Having The Same App 20120188707 - CHEN; Wei-Hau ;   et al. | 2012-07-26 |
Heat-dissipating device for memory Grant D626,520 - Chen , et al. November 2, 2 | 2010-11-02 |
Heat-dissipating device for memory Grant D626,521 - Chen , et al. November 2, 2 | 2010-11-02 |
Heat sink for read only memory device Grant D610,557 - Chen , et al. February 23, 2 | 2010-02-23 |
Heat dispensing unit for memory chip App 20100038055 - Chen; Wei-Hau ;   et al. | 2010-02-18 |
Heat dispensing unit for memory chip App 20100038054 - Chen; Wei-Hau ;   et al. | 2010-02-18 |
Cooling device for CPU Grant 7,661,461 - Chen February 16, 2 | 2010-02-16 |
Heat sink for read only memory device Grant D609,199 - Chen , et al. February 2, 2 | 2010-02-02 |
Heat dispensing unit for memory chip App 20090294099 - Chen; Wei-Hau ;   et al. | 2009-12-03 |
Heat sink for chips App 20090288803 - Chen; Wei-Hau ;   et al. | 2009-11-26 |
Heat sink for chips App 20090288802 - Chen; Wei-Hau ;   et al. | 2009-11-26 |
Heat sink for chips App 20090288804 - Chen; Wei-Hau ;   et al. | 2009-11-26 |
Heat sink for chips App 20090290308 - Chen; Wei-Hau ;   et al. | 2009-11-26 |
Heat sink memory chip App 20090277607 - Chen; Wei-Hau ;   et al. | 2009-11-12 |
Cooling device for memory chips Grant 7,612,992 - Chen November 3, 2 | 2009-11-03 |
Heat dissipating fan Grant D598,089 - Chen August 11, 2 | 2009-08-11 |
Heat dissipating fan Grant D595,399 - Chen June 30, 2 | 2009-06-30 |
Auxiliary cooling device for memory chips Grant 7,471,514 - Chen December 30, 2 | 2008-12-30 |
Cooling device for memory chips Grant 7,408,781 - Chen August 5, 2 | 2008-08-05 |
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