U.S. patent application number 12/155852 was filed with the patent office on 2009-11-26 for heat sink for chips.
This patent application is currently assigned to CompTake Technology Inc.. Invention is credited to Wei-Hau Chen, Steven Yen.
Application Number | 20090288802 12/155852 |
Document ID | / |
Family ID | 41341216 |
Filed Date | 2009-11-26 |
United States Patent
Application |
20090288802 |
Kind Code |
A1 |
Chen; Wei-Hau ; et
al. |
November 26, 2009 |
Heat sink for chips
Abstract
A heat sink includes a first heat dispensing unit including
multiple heat dispensing plates between which chips are clamped. A
base board is connected on a top of the first heat dispensing unit
and a second heat dispensing unit is fixed on a top of the base
board. The base board is connected to the first heat dispensing
unit by two clamping members. The second heat dispensing unit can
be a fan, a water-cooling unit or an aluminum extruding member.
Inventors: |
Chen; Wei-Hau; (Taipei
County, TW) ; Yen; Steven; (Taipei County,
TW) |
Correspondence
Address: |
Wei-Hau Chen
P.O.Box 44-2049
Taipei
10668
TW
|
Assignee: |
CompTake Technology Inc.
|
Family ID: |
41341216 |
Appl. No.: |
12/155852 |
Filed: |
June 11, 2008 |
Current U.S.
Class: |
165/80.2 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 23/473 20130101; H01L 2924/0002 20130101; H01L 23/3677
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/80.2 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 21, 2008 |
TW |
097208854 |
Claims
1. A heat sink comprising: a first heat dispensing unit including
multiple heat dispensing plates which are adapted to clamp chips
therebetween; a base board having a contact surface defined in an
underside of the base board, the contact surface being in contact
with a top of the first heat dispensing unit, a second heat
dispensing unit fixed on a top of the base board, and two clamping
members connecting the base board to the first heat dispensing
unit.
2. The heat sink as claimed in claim 1, wherein each heat
dispensing plate of the first heat dispensing unit includes
recesses defined in two ends thereof and the clamp members connect
two ends of the base board and the recesses of the first heat
dispensing unit.
3. The heat sink as claimed in claim 1, wherein the base board
includes a hole defined therethrough and the second heat dispensing
unit is located corresponding to the hole.
4. The heat sink as claimed in claim 1, the second heat dispensing
unit is a fan.
6. The heat sink as claimed in claim 1, the second heat dispensing
units is a water-cooling unit.
7. The heat sink as claimed in claim 1, the second heat dispensing
unit is an aluminum extruding member.
8. The heat sink as claimed in claim 7, wherein the base board is
integrally connected with the aluminum extruding member.
9. The heat sink as claimed in claim 7, wherein the base board is
integrally connected with the clamping members which are connected
on two ends of the base board, an opening is defined through the
base board and the aluminum extruding member extends through the
opening.
10. The heat sink as claimed in claim 1, wherein each clamping
member includes a top part and a connection part extends from a
side of the top part, a hook part extends from a distal end of the
connection part, the top part is fixed to the baser board and the
hook part is engaged with the recesses of the first heat dispensing
unit.
Description
BACKGROUND OF THE INVENTION
[0001] (1) Field of the Invention
[0002] The present invention relates to a heat sink for removing
heat from chips and the chips are connected with first heat
dispensing units and the second dispensing units are connected to
the first heat dispensing units by clamping members.
[0003] (2) Description of the Prior Art
[0004] The chips used in electronic devices such as computers
generate a significant heat during high speed operation and the
heat may damage the chips and slow down the speed that the CPU
operates. A conventional way to remove heat from the chip is to
provide two heat dispensing plates between which the chip is
clamped, the heat generated from the chip is conducted to the heat
dispensing plates and escapes to the air via the heat dispensing
plates.
[0005] However, the latest chips generate much heat with higher
temperature than those made by old technology so that the
conventional heat dispensing plates cannot remove the heat
efficiently. This is because the area that heat is transferred from
the chip is insufficient and the conventional heat dispensing
plates can only remove a certain amount of heat because of limited
heat dispensing area. Extra heat removing units are needed and
because the limited space available in the computers so that how to
provide a high efficiency heat removing units is an important
problem.
[0006] The present invention intends to provide a heat sink for
chips and includes two heat dispensing units, one of the heat
dispensing units clamps the chips and the other heat dispensing
unit is connected on the first heat dispensing unit by using a base
board and two clamping members. The heat from the chips that is
conducted to the first heat dispensing unit is removed by from the
first heat dispensing units via the second heat dispensing
units.
SUMMARY OF THE INVENTION
[0007] The present invention relates to a heat sink which comprises
a first heat dispensing unit composed of multiple heat dispensing
plates between which the chips are clamped. A base board has a
contact surface defined in an underside of the base board and the
contact surface is in contact with a top of the first heat
dispensing unit. A second heat dispensing unit is fixed on a top of
the base board. Two clamping members connect the base board to the
first heat dispensing unit.
[0008] The present invention will become more obvious from the
following description when taken in connection with the
accompanying drawings which show, for purposes of illustration
only, a preferred embodiment in accordance with the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is an exploded view to show the chips and the heat
sink of the present invention;
[0010] FIG. 2 is a perspective view to show the connection of the
chips and the heat sink of the present invention;
[0011] FIG. 3 is an exploded view to show the chips and a second
embodiment of the present invention;
[0012] FIG. 4 is a perspective view to show the connection of the
chips and the heat sink in FIG. 3 of the present invention;
[0013] FIG. 5 is an exploded view to show the chips and a third
embodiment of the heat sink of the present invention;
[0014] FIG. 6 is an exploded view to show the chips and a fourth
embodiment of the heat sink of the present invention;
[0015] FIG. 7 is a perspective view to show the connection of the
chips and the heat sink in FIG. 6 of the present invention;
[0016] FIG. 8 is an exploded view to show the chips and a fifth
embodiment of the heat sink of the present invention, and
[0017] FIG. 9 is an exploded view to show the chips and a sixth
embodiment of the heat sink of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0018] Referring to FIGS. 1 and 2, the heat sink 10 for chips 5 of
the present invention comprises multiple first heat dispensing
units 3, a base board 1, two second heat dispensing units 4 and two
clamping members 2. The first heat dispensing units 3 each include
multiple heat dispensing plates between which the chips 5 are
clamped. The base board 1 has a contact surface 11 defined in an
underside of the base board 1 and the contact surface 11 is shaped
to match with the top of the first heating dispensing units 3. Two
holes 12 are defined through the base board 1 and a plurality of
threaded holes 13 are located around the holes 12. The contact
surface 11 is in contact with the top of the first heat dispensing
unit 3 and two first connection holes 14 are defined through two
ends of the base board 1. The second heat dispensing units 4 are
fixed on a top of the base board 1 by extending bolts through
passages 41 in the second heat dispensing units 4 and connected to
the threaded holes 13 in the base board 1. The second heat
dispensing units 4 are located corresponding to the holes 12. The
two clamping members 2 connect the base board 1 to the first heat
dispensing units 3.
[0019] Each heat dispensing plate of the first heat dispensing unit
3 includes recesses 31 defined in two ends thereof and each
clamping member 2 includes a horizontal part 21, a connection part
22 extending from a side thereof and a hook part 23 which extends
from a distal end of the connection part 22. The horizontal part 21
of each clamping member 2 has a second connection hole 24 so that
when clamping the base board 1 to the first heat dispensing units
3, the hook parts 23 are hooked to the recesses 31 of the heat
dispensing plates and bolts extend through the second and first
connection holes 24, 14 to fix the clamping members 2 to the base
board 1.
[0020] The heat generated from the chips 5 is conducted to the heat
dispensing plates of the first heat dispensing unit 3 and then
brought out from the first dispensing unit 3 by the second heat
dispensing units 4 via the holes 12. In this embodiment, the second
heat dispensing units 4 are fans.
[0021] As shown in FIGS. 3 and 4, which show the second embodiment
of the heat sink 10 of the present invention, wherein the base
board 1 does not have the holes 12 as shown in FIG. 1 and the
second heat dispensing unit 4 is a water-cooling unit.
[0022] As shown in FIG. 5, the third embodiment of the heat sink 10
of the present invention is disclosed wherein the second heat
dispensing unit 4 is an aluminum extruding member which include the
base board 1 on the underside of the aluminum extruding member. The
aluminum extruding member includes multiple fins extending
therefrom so as to increase area that releases the heat.
[0023] FIGS. 6 and 7 show a fourth embodiment of the heat sink 10
of the present invention is disclosed wherein the base board 1 and
the clamping members 2 are integrally formed as a one piece.
Accordingly, the first and second connection holes as shown in the
first embodiment can be omitted.
[0024] FIG. 8 show a fifth embodiment of the heat sink 10 of the
present invention and the fifth embodiment is similar to the fourth
embodiment, that is to say, the base board 1 and the clamping
members 2 are integrally formed as a one piece. The second heat
dispensing unit 4 is the water-cooling unit and no holes are needed
in the base board 1.
[0025] FIG. 9 show a sixth embodiment of the heat sink 10 of the
present invention, wherein the base board 1 and the clamping
members 2 are integrally formed as a one piece, and the second heat
dispensing unit 4 is the aluminum extruding member. The base board
1 includes an opening 15 through which the fins of the aluminum
extruding member extend.
[0026] While we have shown and described the embodiment in
accordance with the present invention, it should be clear to those
skilled in the art that further embodiments may be made without
departing from the scope of the present invention.
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