Heat dissipating module of memory

Description

FIG. 1 is a perspective view of a heat dissipating module of memory showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and

FIG. 8 is the other perspective view showing the heat dissipating module of memory; and,

FIG. 9 is a perspective view of the heat dissipating module of memory for reference.

The broken lines shown represent unclaimed subject matter and form no part of the claimed design.

Claims

CLAIM The ornamental design for a heat dissipating module of memory, as shown and described.

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Inventors:	Chen; Wei-Hau (New Taipei, TW), Ku; Chia-Yuan (New Taipei, TW), Chen; Li-Hsu (New Taipei, TW), Chen; Hsin-An (New Taipei, TW)
Applicant:	Name City State Country Type CompTake Technology Inc. New Taipei N/A TW
Assignee:	CompTake Technology Inc. (New Taipei, TW)
Appl. No.:	D/441,181
Filed:	January 2, 2013

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Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.26,104.33,122,151,185 ;257/706,707,718-722 ;361/679.54,695,697,700,702,704,707,709,710,711,715,719

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References Cited [Referenced By]

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U.S. Patent Documents

6377460	April 2002	Pohl et al.
7215551	May 2007	Wang et al.
7221569	May 2007	Tsai
7312996	December 2007	Chang
7391613	June 2008	Lai et al.
7447024	November 2008	Chou
7457122	November 2008	Lai et al.
D597966	August 2009	Shih
7606035	October 2009	Park et al.
D609199	February 2010	Chen et al.
7738252	June 2010	Schuette et al.
7768785	August 2010	Ni et al.
7839643	November 2010	Yu
D657756	April 2012	Mueller
8411443	April 2013	Chen et al.
2003/0026076	February 2003	Wei
2009/0122481	May 2009	Chang et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Shih; Chun-Ming HDLS IPR Services