U.S. patent number D689,829 [Application Number D/441,181] was granted by the patent office on 2013-09-17 for heat dissipating module of memory.
This patent grant is currently assigned to CompTake Technology Inc.. The grantee listed for this patent is CompTake Technology Inc.. Invention is credited to Hsin-An Chen, Li-Hsu Chen, Wei-Hau Chen, Chia-Yuan Ku.
United States Patent |
D689,829 |
Chen , et al. |
September 17, 2013 |
Heat dissipating module of memory
Claims
CLAIM The ornamental design for a heat dissipating module of
memory, as shown and described.
Inventors: |
Chen; Wei-Hau (New Taipei,
TW), Ku; Chia-Yuan (New Taipei, TW), Chen;
Li-Hsu (New Taipei, TW), Chen; Hsin-An (New
Taipei, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
CompTake Technology Inc. |
New Taipei |
N/A |
TW |
|
|
Assignee: |
CompTake Technology Inc. (New
Taipei, TW)
|
Appl.
No.: |
D/441,181 |
Filed: |
January 2, 2013 |
Current U.S.
Class: |
D13/179 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/179
;165/80.3,104.26,104.33,122,151,185 ;257/706,707,718-722
;361/679.54,695,697,700,702,704,707,709,710,711,715,719 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Shih; Chun-Ming HDLS IPR
Services
Description
FIG. 1 is a perspective view of a heat dissipating module of memory
showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and
FIG. 8 is the other perspective view showing the heat dissipating
module of memory; and,
FIG. 9 is a perspective view of the heat dissipating module of
memory for reference.
The broken lines shown represent unclaimed subject matter and form
no part of the claimed design.
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