Heat sink for chips

Abstract

A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The clamping members each have a first portion fixed to the base board and a second board which is removably connected to the first portion. The second portion is connected to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

Description

BACKGROUND OF THE INVENTION

[0001] (1) Field of the Invention

[0002] The present invention relates to a heat sink for chips and two clamping members connect a base board to first heat dispensing units clamping the chips and the second dispensing units are fixed to the base board.

[0003] (2) Description of the Prior Art

[0004] The chips used in electronic devices such as computers generate a significant heat during high speed operation and the heat may damage the chips and slow down the speed that the CPU operates. A conventional way to remove heat from the chip is to provide two heat dispensing plates between which the chip is clamped, the heat generated from the chip is conducted to the heat dispensing plates and escapes to the air via the heat dispensing plates.

[0005] However, the latest chips generate much heat with higher temperature than those made by old technology so that the conventional heat dispensing plates cannot remove the heat efficiently. This is because the area that heat is transferred from the chip is insufficient and the conventional heat dispensing plates can only remove a certain amount of heat because of limited heat dispensing area. Extra heat removing units are needed and because the limited space available in the computers so that how to provide a high efficiency heat removing units is an important problem.

[0006] The present invention intends to provide a heat sink for efficiently removing heat from the chips and includes a first heat dispensing unit clamping the chips and a second heat dispensing unit which is connected on the first heat dispensing unit by using a base board and two clamping members. The heat generated from the chips is conducted to the first heat dispensing unit and removed from the second heat dispensing units.

SUMMARY OF THE INVENTION

[0007] The present invention relates to a heat sink which comprises a first heat dispensing unit including multiple heat dispensing plates so as to clamp chips therebetween. A base board has a contact surface defined in an underside of the base board and the contact surface is shaped to directly match with a top of the first heat dispensing unit. A second heat dispensing unit is fixed on a top of the base board. Two clamping members are connected to two ends of the base board and each of the clamping members includes a first portion and a second portion which is removably connected to the first portion. The first portion has two extensions extending therefrom and the second portion includes a handle and a frame which is connected to the handle. The extensions of the first portion are removably connected to the second portion. The two respective frames are connected to two ends of the first heat dispensing unit.

[0008] The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG. 1 is an exploded view to show the chips and the heat sink of the present invention;

[0010] FIG. 2 is a perspective view to show the connection of the chips and the heat sink of the present invention;

[0011] FIG. 3 is an exploded view to show the chips and a second embodiment of the present invention;

[0012] FIG. 4 is a perspective view to show the connection of the chips and the heat sink in FIG. 3 of the present invention;

[0013] FIG. 5 is an exploded view to show the chips and a third embodiment of the heat sink of the present invention, and

[0014] FIG. 6 is a perspective view to show the connection of the chips and the heat sink in FIG. 5 of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Referring to FIGS. 1 and 2, the heat sink 10 for removing heat from chips 5 of the present invention comprises multiple first heat dispensing units 3, a base board 1, two second heat dispensing units 4 and two clamping members 2.

[0016] The first heat dispensing units 3 each include multiple heat dispensing plates between which the chips 5 are clamped. Each heat dispensing plate of the first heat dispensing unit 3 includes protrusions 31 extending from two ends thereof. The base board 1 has a contact surface 11 defined in an underside of the base board 1 and the contact surface 11 is shaped to match with the top of the first heating dispensing units 3. Two holes 12 are defined through the base board 1 and a plurality of threaded holes 13 are located around the holes 12. The contact surface 11 is in contact with the top of the first heat dispensing unit 3 and two first connection holes 14 are defined through two ends of the base board 1. The second heat dispensing units 4 are fixed on a top of the base board 1 by extending bolts through passages 41 in the second heat dispensing units 4 and connected to the threaded holes 13 in the base board 1. The second heat dispensing units 4 are located corresponding to the holes 12. The two clamping members 2 connect the base board 1 to the first heat dispensing units 3.

[0017] The two clamping members 2 each include a first portion 21 and a second portion 22 which is removably connected to the first portion 21. The first portion 21 of each of the clamping members 2 includes a plate 211 which is fixed on each of the two ends of the base hoard 1 by extending bolts through holes 213 defined through the plate 211 and connected to connection holes 14 in the base board 1. Two extensions 212 extend from the plate 211 and two L-shaped insertions 214 extend from the two extensions 212 respectively. Each insertion 214 includes a hook part 215.

[0018] The second portion 22 of each of the clamping members 2 includes a handle 221 and a frame 222 which is connected to the handle 221 by a neck portion. A slot 223 is defined through the neck portion. The two insertions 214 can be inserted through the slot 223 and the hook parts 215 are engaged with a rear side of the neck portion. The two respective frames 222 are connected to the protrusions 31 on each end of the first heat dispensing unit 3.

[0019] The base board 1 includes two holes 12 defined therethrough and the second heat dispensing units 4 are located corresponding to the holes 12. Therefore, the heat generated from the chips 5 is conducted to the first heat dispensing unit 3 and sucked out by the second heat dispensing units 4. In this embodiment, the second heat dispensing units 4 are two fans.

[0020] FIGS. 3 and 4 show the second embodiment of the heat sink 10 of the present invention, wherein the base board 1 does not have the holes 12 as shown in FIG. 1 and the second heat dispensing unit 4 is a water-cooling unit.

[0021] As shown in FIG. 5, the third embodiment of the heat sink 10 of the present invention is disclosed, wherein the second heat dispensing unit 4 is an aluminum extruding member which include the base board 1 on the underside of the aluminum extruding member. The aluminum extruding member includes multiple fins extending therefrom so as to increase area that releases the heat.

[0022] While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims

1. A heat sink comprising: a first heat dispensing unit including multiple heat dispensing plates which are adapted to clamp chips therebetween; a base board having a contact surface defined in an underside of the base board, the contact surface being shaped to directly match with a top of the first heat dispensing unit, a second heat dispensing unit fixed on a top of the base board, and two clamping members connected to two ends of the base board and each of the clamping members including a first portion and a second portion which is removably connected to the first portion, the first portion having two extensions extending therefrom and the second portion including a handle and a frame which is connected to the handle, the extensions of the first portion removably connected to the second portion, the two respective frames connected to two ends of the first heat dispensing unit.

2. The heat sink as claimed in claim 1, wherein each heat dispensing plate of the first heat dispensing unit includes protrusions on two ends thereof, the respective frames of the clamping members are hooked to the protrusions.

3. The heat sink as claimed in claim 1, wherein the base board includes a hole defined therethrough and the second heat dispensing unit is located corresponding to the hole.

4. The heat sink as claimed in claim 1, wherein the first portion of each of the clamping members includes a plate which is fixed on the base hoard and the two extensions extend from the plate, two L-shaped insertions extend from the two extensions respectively and each insertion includes a hook part, the handle of each of the clamping members is connected to the frame by a neck portion through which a slot is defined, the two insertions are inserted through the slot and the hook parts are engaged with a rear side of the neck portion.

5. The heat sink as claimed in claim 1, the second heat dispensing unit is a fan.

6. The heat sink as claimed in claim 1, the second heat dispensing units is a water-cooling unit.

7. The heat sink as claimed in claim 1, the second heat dispensing unit is an aluminum extruding member.

8. The heat sink as claimed in claim 7, wherein the aluminum extruding member includes multiple fins formed thereto.