U.S. patent application number 12/230639 was filed with the patent office on 2010-02-18 for heat dispensing unit for memory chip.
This patent application is currently assigned to CompTake Technology Inc.. Invention is credited to Wei-Hau Chen, Steven Yen.
Application Number | 20100038054 12/230639 |
Document ID | / |
Family ID | 41680458 |
Filed Date | 2010-02-18 |
United States Patent
Application |
20100038054 |
Kind Code |
A1 |
Chen; Wei-Hau ; et
al. |
February 18, 2010 |
Heat dispensing unit for memory chip
Abstract
A heat dispensing unit includes two heat dispensing plates
between which the chip is clamped. Each heat dispensing plate
includes multiple ridges extending from an outside thereof and two
clamps clamp two ends of the two heat dispensing plates. Each clamp
includes two side plates and a flexible plate which is connected
between the two side plates, two protrusions extend from two
respective insides of the two side plates so as to be engaged with
two holes in the two heat dispensing plates to securely connect the
two heat dispensing plates. The clamps each have two hooks to hook
the notches in two ends of the chip.
Inventors: |
Chen; Wei-Hau; (Taipei
County, TW) ; Yen; Steven; (Taipei County,
TW) |
Correspondence
Address: |
Wei-Hau Chen
P.O. Box 44-2049
Taipei
10668
TW
|
Assignee: |
CompTake Technology Inc.
Steven Yen
|
Family ID: |
41680458 |
Appl. No.: |
12/230639 |
Filed: |
September 3, 2008 |
Current U.S.
Class: |
165/80.2 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 23/4093
20130101 |
Class at
Publication: |
165/80.2 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 18, 2008 |
TW |
097214762 |
Claims
1. A heat dispensing unit comprising: two heat dispensing plates
and a chip being clamped between the two heat dispensing plates,
each heat dispensing plate having multiple ridges extending from an
outside thereof and two holes defined through two ends thereof, and
Two clamps clamping the two ends of the two heat dispensing plates,
each clamp having two side plates and a flexible plate connected
between the two side plates, two protrusions extending from two
respective insides of the two side plates, the two protrusions
engaged with the holes of the two heat dispensing plates.
2. The heat dispensing unit as claimed in claim 1, wherein two
hooks extending from a lower edge of the flexible plate and hook
two notches defined in two ends of the chip.
3. The heat dispensing unit as claimed in claim 1, wherein a heat
conductive pad is applied to an inside of each of the heat
dispensing plates.
4. The heat dispensing unit as claimed in claim 1, wherein two heat
dispensing parts extend from a top of each of the heat dispensing
plates and the heat dispensing parts extend inward from the top of
each of the heat dispensing plates.
5. The heat dispensing unit as claimed in claim 1, wherein each of
the heat dispensing plates is an aluminum extruding plate.
Description
BACKGROUND OF THE INVENTION
[0001] (1) Field of the Invention
[0002] The present invention relates to a heat dispensing unit for
removing heat from memory chips and the heat dispensing unit
includes two clamps clamping tow ends of the heat dispensing
unit.
[0003] (2) Description of the Prior Art
[0004] A conventional heat dispensing unit 30 for memory chips is
shown in FIG. 4 and generally includes two heat conductive pads
301, two heat dispensing plates 302 and two clamps 303, wherein the
heat conductive pads 301 are attached to in sides of the two heat
dispensing plates 302 which have hooks 302a, engaging holes 302b
and engaging pieces 302c on a top thereof. When the two heat
dispensing plates 302 are combined, a space is defined therebetween
and the memory chip 2 is clamped. The engaging pieces 302c each
have a downward positioning plates 302d which are located
corresponding to the U-shaped restriction slots 304 on outsides of
the heat dispensing plates 302. A through hole 305 is located above
the restriction slot 304 and a guide slot 306 is located above the
through hole 305 so that when the two clamps 303 clamp the two heat
dispensing plates 302, the two clamps 303 are mounted onto the two
positioning plates 302d and the hoods 303a are engaged with the
through hole 305 via the guide slots 306 so that the two heat
dispensing plates 302 can clamp the memory chip 20. The heat
generated from the memory chip 2 is conducted to the heat
dispensing unit 30 and releases to air.
[0005] However, the conventional heat dispensing unit 30 includes a
complicated structure which includes hooks 303a, restriction slots
304, through holes 305 and guide slots 306. The complicated
structure makes the heat dispensing unit 30 to be expensive and
time consuming when manufacturing. Besides, the two clamps 303
clamp at the top edges of the two heat dispensing plates 302 so
that it is impossible to add extra heat dispensing plates 302 onto
the top edges.
[0006] The existed heat dispensing unit cannot efficiently dispense
the high temperature generated from the latest chips which operate
at very high speed and the low efficient heat dispensing unit
restricts the use of the high end CPU in computers.
[0007] The present invention intends to provide a heat dispensing
unit for memory chips wherein the heat dispensing plates are
securely connected to each other by two clamps clamping two ends of
the heat dispensing plates. The clamps further hook the notches of
the chip.
SUMMARY OF THE INVENTION
[0008] The present invention relates to a heat dispensing unit
which comprises two heat dispensing plates between which the chip
is clamped. Each heat dispensing plate has multiple ridges
extending from an outside thereof and two holes are defined through
two ends of each heat dispensing plate. Two clamps clamp the two
ends of the two heat dispensing plates. Each clamp having two side
plates and a flexible plate connected between the two side plates,
two protrusions extend from two respective insides of the two side
plates. The two protrusions are engaged with the holes of the two
heat dispensing plates.
[0009] The primary object of the present invention is to provide a
heat dispending unit for chips wherein the two heat dispensing
plates are securely connected to each other by two clamps from two
ends of the heat dispensing plates.
[0010] The present invention will become more obvious from the
following description when taken in connection with the
accompanying drawings which show, for purposes of illustration
only, a preferred embodiment in accordance with the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is an exploded view to show the heat dispensing unit
of the present invention;
[0012] FIG. 2 is a perspective view to show that the chip is
clamped between the two heat dispensing plates of the heat
dispensing unit of the present invention;
[0013] FIG. 3 is a perspective view to show the clamp for clamping
the two heat dispensing plates of the present invention, and
[0014] FIG. 4 is an exploded view to show the conventional heat
dispensing unit.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0015] Referring to FIGS. 1 to 3, the heat dispensing unit 1 of the
present invention comprises two heat dispensing plates 1 and each
heat dispensing plate 1 includes multiple parallel ridges 14
extending from an outside thereof. Each of the heat dispensing
plates 1 is an aluminum extruding plate. A heat conductive pad 13
is attached to the inside of each heat dispensing plate 1 and two
holes 12 are defined through two ends of each of the two heat
dispensing plates 1. The chip 2 that is clamped between the two
heat dispensing plates 1 includes circuit pieces 21 extending
therefrom which are in contact with the heat conductive pad 13. Two
notches are defined in two ends of the chip 2.
[0016] Two clamps 3 clamp the two ends of the two heat dispensing
plates 1 and each clamp 3 has two side plates 31 and a flexible
plate 32 connected between the two side plates 31. Two protrusions
34 extend from two respective insides of the two side plates 31 so
that the two protrusions 34 are engaged with the holes 12 of the
two heat dispensing plates 1 to connect the two heat dispensing
plates 1. Two hooks 33 extend from a lower edge of the flexible
plate 32 and hook the two notches defined in two ends of the chip
2. By this arrangement, the heat dispensing plates 1, the chip 2
and the two clamps 3 are securely connected to each other.
[0017] Two heat dispensing parts 15 extend from a top of each of
the heat dispensing plates 1 and the heat dispensing parts 15
extend inward from the top of each of the heat dispensing plates 1.
Each heat dispensing part 15 includes three fins so as to increase
the efficiency of removal of heat. The heat dispensing parts 15 of
the two heat dispensing plates 1 are located so that when the two
heat dispensing plates 1 are connected to each other by the clamps
3, the four heat dispensing part 15 are located head-to-tail to
form a row of fins.
[0018] The heat dispensing plates 1 include the ridges 14, the heat
conductive pad 13, the fins of the heat dispensing parts 15 to
effectively remove heat from the chip 2. The clamps 3 are easily
used and able to securely connect the heat dispensing plates 1 and
the chip 2 to ensure that the chip 2 is in contact with the heat
dispensing plates 1.
[0019] While we have shown and described the embodiment in
accordance with the present invention, it should be clear to those
skilled in the art that further embodiments may be made without
departing from the scope of the present invention.
* * * * *