U.S. patent application number 12/153735 was filed with the patent office on 2009-11-12 for heat sink memory chip.
This patent application is currently assigned to Comptake Technology Inc.. Invention is credited to Wei-Hau Chen, Steven Yen.
Application Number | 20090277607 12/153735 |
Document ID | / |
Family ID | 41265921 |
Filed Date | 2009-11-12 |
United States Patent
Application |
20090277607 |
Kind Code |
A1 |
Chen; Wei-Hau ; et
al. |
November 12, 2009 |
Heat sink memory chip
Abstract
A heat sink for chips includes two heat dispensing units and
each heat dispensing unit includes multiple fins between which
passages are defined. Each heat dispensing unit includes a flat
surface defined in an inside thereof and a heat conducting member
is connected to the flat surface. The chip is in contact between
the two heat conducting members so that the heat generated from the
chip is contacted to the heat conducting members and the fins and
escapes to the air.
Inventors: |
Chen; Wei-Hau; (Taipei
County, TW) ; Yen; Steven; (Taipei County,
TW) |
Correspondence
Address: |
Wei-Hau Chen
P.O. Box 44-2049
Taipei
10668
TW
|
Assignee: |
Comptake Technology Inc.
|
Family ID: |
41265921 |
Appl. No.: |
12/153735 |
Filed: |
May 23, 2008 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/4093 20130101; H01L 23/3672 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 12, 2008 |
TW |
097208194 |
Claims
1. A heat sink for chips, comprising: two heat dispensing units and
each heat dispensing unit including multiple fins, passages defined
between the multiple fins, a flat surface defined in an inside of
each heat dispensing unit and a heat conducting member connected to
the flat surface of each heat dispensing unit, the chip being in
contact between the two heat conducting members.
2. The heat sink as claimed in claim 1, wherein a clamp secures the
fins and the fins are parallel to each other.
Description
BACKGROUND OF THE INVENTION
[0001] (1) Field of the Invention
[0002] The present invention relates to a heat sink for providing a
larger heat dispensing area to the chips.
[0003] (2) Description of the Prior Art
[0004] The chips used in electronic devices such as computers
generate a significant heat during operation and the heat may
damage the chips so that how to remove the heat from the chips
becomes a serious problems. A conventional way to remove heat from
the chip is to provide two heat dispensing plates between which the
chip is clamped, the heat generated from the chip is conducted to
the heat dispensing plates and escapes to the air.
[0005] However, the latest chips generate much higher heat than
those made by old technology so that the conventional heat
dispensing plates cannot remove the heat efficiently. This is
because the area that heat is transferred from the chip is
insufficient and the conventional heat dispensing plates can only
remove a certain amount of heat because of limited heat dispensing
area.
[0006] The present invention intends to provide a heat sink for
chips and includes two heat dispensing units between which the chip
is clamped. Each heat dispensing unit includes multiple fins
between which passages are defined, so that heat can be efficiently
removed from the chip by the heat dispensing units.
SUMMARY OF THE INVENTION
[0007] The present invention relates to a heat sink for chips and
the heat sink comprises two heat dispensing units and each heat
dispensing unit includes multiple fins between which passages are
defined. A flat surface is defined in an inside of each heat
dispensing unit and a heat conducting member is connected to the
flat surface of each heat dispensing unit. The chip is in contact
between the two heat conducting members.
[0008] The primary object of the present invention is to provide a
heat sink which has a heat conducting member connected between the
chip and multiple fins so as to efficiently remove heat from the
chip.
[0009] The present invention will become more obvious from the
following description when taken in connection with the
accompanying drawings which show, for purposes of illustration
only, a preferred embodiment in accordance with the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is an exploded view to show the heat sink of the
present invention and a chip;
[0011] FIG. 2 is a perspective view to show the chip is clamped
between the heat dispensing units of the heat sink of the present
invention;
[0012] FIG. 3 shows an outside view of the heat unit of the heat
sink of the present invention;
[0013] FIG. 4 shows an inside view of the heat unit of the heat
sink of the present invention;
[0014] FIG. 5 is an exploded view to show another embodiment of the
heat sink of the present invention and a chip, and FIG. 6 is a
perspective view to show another chip is clamped between the heat
dispensing units of the heat sink shown in FIG. 5.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] Referring to FIGS. 1 to 4, the heat sink of the present
invention comprises two heat dispensing units 1 and each heat
dispensing unit 1 includes multiple fins 11 which are secured by a
clamp 111 so that the fins 11 are positioned to be parallel to each
other. Passages 13 are defined between the multiple fins 11. A flat
surface 12 is defined in an inside of each heat dispensing unit 1
and a heat conducting member 2 is connected to the flat surface 12
of each heat dispensing unit 1. The chip 3 such as a memory chip is
in contact between the two heat conducting members 2.
[0016] The chip 3 generates heat which is conducted to the heat
conducting members 2 which are directly connected with the fins 11
so that heat is then conducted to the fins 11 which provides
sufficient area to allow the heat to escape to the air. When
cooperated with a fan unit (not shown), the fan unit generates air
flows flowing through the passages 13 to quickly bring heat out
from the fins 11.
[0017] The present invention is simple and easily to use, the chip
3 is simply attached to the heat conducting members 2. Not like the
conventional heat sink, the chip and the heat sink has to be
connected to each other by clips.
[0018] Because each heat dispensing unit 1 has the flat surface 12
which is connected to the heat conducting member 2 so that the
contact area between the conducting members 2 and the chip 3 is
large enough to bring out heat efficiently.
[0019] FIGS. 5 and 6 show that the heat sink of the present
invention is used for removing heat from chips of a laptop (not
shown), wherein the chip 6 of the laptop is smaller than that used
for personal computers so that the heat sink can be made to be
smaller. The heat sink is composed of two heat dispensing units 4
and each heat dispensing unit 4 includes multiple fins 41 which are
secured by a clamp 411 so that the fins 41 are positioned to be
parallel to each other. Passages 43 are defined between the
multiple fins 41. A flat surface 42 is defined in an inside of each
heat dispensing unit 4 and a heat conducting member 5 is connected
to the flat surface 42 of each heat dispensing unit 4. The chip 6
such as a memory chip of a laptop is in contact between the two
heat conducting members 5.
[0020] While we have shown and described the embodiment in
accordance with the present invention, it should be clear to those
skilled in the art that further embodiments may be made without
departing from the scope of the present invention.
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