Heat dispensing unit for memory chip

Abstract

A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof and the two connection plates have a connection piece or a connection port so that when the two heat dispensing plates are connected to each other, the connection pieces are connected to the connection ports.

Description

BACKGROUND OF THE INVENTION

[0001] (1) Field of the Invention

[0002] The present invention relates to a heat dispensing unit for removing heat from memory chips.

[0003] (2) Description of the Prior Art

[0004] A conventional heat dispensing unit 30 for memory chips is shown in FIG. 4 and generally includes two heat conductive pads 301, two heat dispensing plates 302 and two clamps 303, wherein the heat conductive pads 301 are attached to in sides of the two heat dispensing plates 302 which have hooks 302a, engaging holes 302b and engaging pieces 302c on a top thereof. When the two heat dispensing plates 302 are combined, a space is defined therebetween and the memory chip 2 is clamped. The engaging pieces 302c each have a downward positioning plates 302d which are located corresponding to the U-shaped restriction slots 304 on outsides of the heat dispensing plates 302. A through hole 305 is located above the restriction slot 304 and a guide slot 306 is located above the through hole 305 so that when the two clamps 303 clamp the two heat dispensing plates 302, the two clamps 303 are mounted onto the two positioning plates 302d and the hoods 303a are engaged with the through hole 305 via the guide slots 306 so that the two heat dispensing plates 302 can clamp the memory chip 20. The heat generated from the memory chip 2 is conducted to the heat dispensing unit 30 and releases to air.

[0005] However, the conventional heat dispensing unit 30 includes a complicated structure which includes hooks 303a, restriction slots 304, through holes 305 and guide slots 306. The complicated structure makes the heat dispensing unit 30 to be expensive and time consuming when manufacturing. Besides, the two clamps 303 clamp at the top edges of the two heat dispensing plates 302 so that it is impossible to add extra heat dispensing plates 302 onto the top edges.

[0006] The existed heat dispensing unit cannot efficiently dispense the high temperature generated from the latest chips which operate at very high speed and the low efficient heat dispensing unit restricts the use of the high end CPU in computers.

[0007] The present invention intends to provide a heat dispensing unit for memory chips wherein the heat dispensing plates are easily manufactured and can be quickly connected to each other.

SUMMARY OF THE INVENTION

[0008] The present invention relates to a heat dispensing unit which comprises two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof. The two connection plates of one of the two heat dispensing plates have a connection piece and the two connection plates of the other one of the two heat dispensing plates have a connection port defined therein. Each of the connection pieces has a contacting portion which is engaged with an inside of the connection port corresponding thereto when the connection pieces are connected to the connection ports.

[0009] The primary object of the present invention is to provide a heat dispending unit for chips and the two heat dispensing plates are easily connected to each other without using clamps.

[0010] Another object of the present invention is to provide a heat dispending unit for chips wherein the gap between the two heat dispensing plates is covered by two flanges on two respective tops of the two heat dispensing plates.

[0011] The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG. 1 is an exploded view to show the heat dispensing unit of the present invention;

[0013] FIG. 2 is a perspective view to show the heat dispensing unit of the present invention;

[0014] FIG. 2A is an enlarged view to show the connection of the connection piece and the connection ports of the heat dispensing unit of FIG. 2;

[0015] FIG. 3 is a perspective view to show the heat dispensing unit of the present invention, wherein the chip is clamped between the two heat dispensing plates of the present invention, and

[0016] FIG. 4 is an exploded view to show the conventional heat dispensing unit.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Referring to FIGS. 1, 2, 2A and 3, the heat dispensing unit 1 of the present invention comprises two heat dispensing plates 1 and each heat dispensing plate 1 has a heat conductive pad 15 attached to the inside thereof so that the chip 2 (FIG. 3) that is clamped between the two heat dispensing plates 1 has sufficient contact area for removing heat therefrom.

[0018] Each heat dispensing plate 1 has two connection plates 11 bending from two ends thereof and the two connection plates 11 of one of the two heat dispensing plates have a connection piece 12 extending therefrom and the two connection plates 11 of the other one of the two heat dispensing plates 1 have a connection port 13 defined therein. In this embodiment, the connection piece 12 is a plate split from the connection plate 11 and the connection port 13 is a rectangular hole defined through the connection plate 11. Each of the connection pieces 12 has a contacting portion 121 which is engaged with an inside of the connection port 13 corresponding thereto when the connection pieces 12 are connected to the connection ports 13.

[0019] Two guide units 14 are connected to each of the two heat dispensing plates 1 and each guide unit 14 is composed of a first bending plate 14a which is located beside the connection piece 12 and a second bending plate 14b which is located beside the connection port 13. The first and second bending plates 14a, 14b are arranged such that when the two heat dispensing plates 1 are connected to each other, the first and second bending plates 14a, 14b are overlapped to each other. The guide units 14 guide the two heat dispensing plates 1 to be connected correctly so that the connection pieces 12 are easily engaged with the connection ports 13. Once the connection pieces 12 are engaged with the connection ports 13, no extra clamps are needed to hold the two heat dispensing plates 1.

[0020] Each of the heat dispensing plates 1 further includes a flange 16 extending from a top thereof so as to cover a gap between the two heat dispensing plates 1. The flanges 16 avoid dust from entering the gap between the two heat dispensing plates 1.

[0021] While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims

1. A heat dispensing unit comprising: two heat dispensing plates and a chip being clamped between the two heat dispensing plates, each heat dispensing plate having two connection plates bending from two ends thereof, the two connection plates of one of the two heat dispensing plates having a connection piece and the two connection plates of the other one of the two heat dispensing plates having a connection port defined therein, each of the connection pieces having a contacting portion which is engaged with an inside of the connection port corresponding thereto when the connection pieces are connected to the connection ports.

2. The heat dispensing unit as claimed in claim 1, wherein two guide units are connected to each of the two heat dispensing plates and each guide unit is composed of a first bending plate which is located beside the connection piece and a second bending plate which is located beside the connection port, the first and second bending plates are overlapped to each other when the two heat dispensing plates are connected to each other.

3. The heat dispensing unit as claimed in claim 1, wherein the connection piece is a plate split from the connection plate.

4. The heat dispensing unit as claimed in claim 1, wherein the connection port is a rectangular hole defined through the connection plate.

5. The heat dispensing unit as claimed in claim 1, wherein each of the heat dispensing plates includes a flange extending from a top thereof so as to cover a gap between the two heat dispensing plates.