Heat-dissipating device for memory

Chen , et al. November 2, 2

Patent Grant D626521

U.S. patent number D626,521 [Application Number D/358,136] was granted by the patent office on 2010-11-02 for heat-dissipating device for memory. This patent grant is currently assigned to CompTake Technology Inc.. Invention is credited to Shih-Her Chen, Wei-Hau Chen, Cheng-Hsien Kuo.


United States Patent D626,521
Chen ,   et al. November 2, 2010

Heat-dissipating device for memory

Claims

CLAIM The ornamental design for an heat-dissipating device for memory, as shown and described.
Inventors: Chen; Wei-Hau (Taishan Shiang, TW), Kuo; Cheng-Hsien (Taishan Shiang, TW), Chen; Shih-Her (Taishan Shiang, TW)
Assignee: CompTake Technology Inc. (Taipei County, TW)
Appl. No.: D/358,136
Filed: March 23, 2010

Current U.S. Class: D13/179
Current International Class: 1303
Field of Search: ;D13/179 ;165/80.2,80.3,104.33,151,122,185 ;361/704,709

References Cited [Referenced By]

U.S. Patent Documents
6297966 October 2001 Lee et al.
6672379 January 2004 Wang et al.
6765799 July 2004 Huang
D496006 September 2004 Tsai et al.
6842342 January 2005 Lin
6880621 April 2005 Wang
D531965 November 2006 Stathakis
7190595 March 2007 Chang
7457122 November 2008 Lai et al.
D610557 February 2010 Chen et al.
7721790 May 2010 Sung
7733653 June 2010 Horng
2003/0026076 February 2003 Wei
2007/0084584 April 2007 Hashimoto
2007/0235162 October 2007 Lin
2008/0011453 January 2008 Liang
2008/0179043 July 2008 Ho
2008/0264613 October 2008 Chu
2009/0288803 November 2009 Chen et al.
2009/0294099 December 2009 Chen et al.
2010/0038054 February 2010 Chen et al.
2010/0038055 February 2010 Chen et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Muncy, Geissler, Olds & Lowe, PLLC

Description



FIG. 1 is a perspective view of an heat-dissipating device for memory showing my new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is an application diagram thereof; and,

FIG. 9 is an another application diagram thereof.

The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.

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