loadpatents
Patent applications and USPTO patent grants for Kuo; Cheng-Hsien.The latest application filed is for "structure of anti tamper case for solid state disk".
Patent | Date |
---|---|
Structure of anti tamper case for solid state disk Grant 8,531,845 - Chen , et al. September 10, 2 | 2013-09-10 |
Slidingly-engaged heat-dissipating assembly for memory and memory device having the same Grant 8,411,443 - Chen , et al. April 2, 2 | 2013-04-02 |
Structure Of Anti Tamper Case For Solid State Disk App 20120250271 - Chen; Wei-Hau ;   et al. | 2012-10-04 |
Slidingly-engaged Heat-dissipating Assembly For Memory And Memory Device Having The Same App 20120188707 - CHEN; Wei-Hau ;   et al. | 2012-07-26 |
Heat-dissipating device for memory Grant D659,110 - Chen , et al. May 8, 2 | 2012-05-08 |
Heat-dissipating device for memory Grant D626,520 - Chen , et al. November 2, 2 | 2010-11-02 |
Heat-dissipating device for memory Grant D626,521 - Chen , et al. November 2, 2 | 2010-11-02 |
Molding Apparatus And Molding Process App 20080143008 - KUO; CHENG-HSIEN ;   et al. | 2008-06-19 |
Memory card Grant 7,230,279 - Kuo , et al. June 12, 2 | 2007-06-12 |
Memory card structure and manufacturing method thereof Grant 7,205,644 - Kuo , et al. April 17, 2 | 2007-04-17 |
Memory card structure Grant 7,193,304 - Kuo , et al. March 20, 2 | 2007-03-20 |
Memory Card Structure And Manufacturing Method Thereof App 20060077749 - Kuo; Cheng-Hsien ;   et al. | 2006-04-13 |
Memory Card Structure And Manufacturing Method Thereof App 20060076662 - Kuo; Cheng-Hsien ;   et al. | 2006-04-13 |
Memory Card And Method Of Fabricating The Same App 20060071313 - Kuo; Cheng-Hsien ;   et al. | 2006-04-06 |
Molding apparatus and molding process App 20050017392 - Kuo, Cheng-Hsien ;   et al. | 2005-01-27 |
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