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name:-0.0084288120269775
name:-0.0052180290222168
name:-0.00063586235046387
Kuo; Cheng-Hsien Patent Filings

Kuo; Cheng-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuo; Cheng-Hsien.The latest application filed is for "structure of anti tamper case for solid state disk".

Company Profile
0.10.7
  • Kuo; Cheng-Hsien - New Taipei N/A TW
  • Kuo; Cheng-Hsien - New Taipei City TW
  • Kuo; Cheng-Hsien - Taishan Shiang TW
  • KUO; CHENG-HSIEN - Taipei Hsien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Structure of anti tamper case for solid state disk
Grant 8,531,845 - Chen , et al. September 10, 2
2013-09-10
Slidingly-engaged heat-dissipating assembly for memory and memory device having the same
Grant 8,411,443 - Chen , et al. April 2, 2
2013-04-02
Structure Of Anti Tamper Case For Solid State Disk
App 20120250271 - Chen; Wei-Hau ;   et al.
2012-10-04
Slidingly-engaged Heat-dissipating Assembly For Memory And Memory Device Having The Same
App 20120188707 - CHEN; Wei-Hau ;   et al.
2012-07-26
Heat-dissipating device for memory
Grant D659,110 - Chen , et al. May 8, 2
2012-05-08
Heat-dissipating device for memory
Grant D626,520 - Chen , et al. November 2, 2
2010-11-02
Heat-dissipating device for memory
Grant D626,521 - Chen , et al. November 2, 2
2010-11-02
Molding Apparatus And Molding Process
App 20080143008 - KUO; CHENG-HSIEN ;   et al.
2008-06-19
Memory card
Grant 7,230,279 - Kuo , et al. June 12, 2
2007-06-12
Memory card structure and manufacturing method thereof
Grant 7,205,644 - Kuo , et al. April 17, 2
2007-04-17
Memory card structure
Grant 7,193,304 - Kuo , et al. March 20, 2
2007-03-20
Memory Card Structure And Manufacturing Method Thereof
App 20060077749 - Kuo; Cheng-Hsien ;   et al.
2006-04-13
Memory Card Structure And Manufacturing Method Thereof
App 20060076662 - Kuo; Cheng-Hsien ;   et al.
2006-04-13
Memory Card And Method Of Fabricating The Same
App 20060071313 - Kuo; Cheng-Hsien ;   et al.
2006-04-06
Molding apparatus and molding process
App 20050017392 - Kuo, Cheng-Hsien ;   et al.
2005-01-27

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