Heat-dissipating device for memory

Chen , et al. May 8, 2

Patent Grant D659110

U.S. patent number D659,110 [Application Number D/358,133] was granted by the patent office on 2012-05-08 for heat-dissipating device for memory. This patent grant is currently assigned to ComTake Technology, Inc.. Invention is credited to Wei-Hau Chen, Cheng-Hsien Kuo.


United States Patent D659,110
Chen ,   et al. May 8, 2012

Heat-dissipating device for memory

Claims

CLAIM The ornamental design for an heat-dissipating device for memory, as shown and described.
Inventors: Chen; Wei-Hau (Taishan Shiang, TW), Kuo; Cheng-Hsien (Taishan Shiang, TW)
Assignee: ComTake Technology, Inc. (Taipei County, TW)
Appl. No.: D/358,133
Filed: March 23, 2010

Current U.S. Class: D13/179
Current International Class: 1303
Field of Search: ;D13/179 ;D6/492,511 ;165/80.2,80.3 ;257/719 ;361/697,704,709

References Cited [Referenced By]

U.S. Patent Documents
6297966 October 2001 Lee et al.
6672379 January 2004 Wang et al.
6765799 July 2004 Huang
D496006 September 2004 Tsai et al.
6842342 January 2005 Lin
D531965 November 2006 Stathakis
7190595 March 2007 Chang
7457122 November 2008 Lai et al.
D610557 February 2010 Chen et al.
7721790 May 2010 Sung
7733653 June 2010 Horng
2003/0026076 February 2003 Wei
2007/0084584 April 2007 Hashimoto
2008/0011453 January 2008 Liang
2008/0179043 July 2008 Ho
2008/0264613 October 2008 Chu
2009/0294099 December 2009 Chen et al.
2010/0038055 February 2010 Chen et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Muncy, Geissler, Olds & Lowe, PLLC

Description



FIG. 1 is a perspective view of a heat-dissipating device for memory showing my new design wherein a portion of the device is shown separately for ease of illustration;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is an exploded perspective view of the heat dissipating device thereof; and,

FIG. 9 is a perspective view of the heat dissipating, device thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

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