U.S. patent number D496,006 [Application Number D/167,276] was granted by the patent office on 2004-09-14 for heat sink.
This patent grant is currently assigned to DaTech Technology Co., Ltd.. Invention is credited to Ping Tsang Ho, Ching-Feng Tsai.
United States Patent |
D496,006 |
Tsai , et al. |
September 14, 2004 |
Heat sink
Claims
The ornamental design for a heat sink, as shown and described.
Inventors: |
Tsai; Ching-Feng (Taipei,
TW), Ho; Ping Tsang (Taipei, TW) |
Assignee: |
DaTech Technology Co., Ltd.
(Taipei Hsien, TW)
|
Appl.
No.: |
D/167,276 |
Filed: |
September 12, 2002 |
Foreign Application Priority Data
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Aug 16, 2002 [TW] |
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91304506 |
Aug 27, 2002 [TW] |
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91213373 U |
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Current U.S.
Class: |
D13/179 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/179
;165/80.3,104.14,104.33,121,122,180,185 ;174/16.3,52.4
;206/713,714,715,716,727,728 ;297/706,707,718,719,720,722,727,686
;361/271,274.3,697,702,704,709,710,711 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Hyder; Philip S.
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Troxell Law Office PLLC
Description
FIG. 1 is a perspective view of a heat sink, in accordance with the
present invention, the enlarged detail is shown for ease of
illustration;
FIG. 2 is a front elevational view thereof, the enlarged detail is
shown for ease of illustration;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof, the enlarged detail is shown for
ease of illustration; and,
FIG. 7 is a bottom plane view thereof.
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