Heat dispensing unit for memory chip

Abstract

A heat dispensing unit includes two heat dispensing plates between which the memory chip is clamped. Each heat dispensing plate has a plurality of bending plates which split from an inside of each of the heat dispensing plates and each bending plate has an insertion and a hole. When connecting the two heat dispensing plates, the first insertions on one of the two heat dispensing plates are engaged with the first holes of the other heat dispending plate. The heat dispensing plates have a flange on a top thereof so as to cover the gap between the two heat dispensing plates.

Description

BACKGROUND OF THE INVENTION

[0001] (1) Field of the Invention

[0002] The present invention relates to a heat dispensing unit for removing heat from memory chips and having a flange for preventing dust from entering the unit.

[0003] (2) Description of the Prior Art

[0004] A conventional heat dispensing unit 30 for memory chips is shown in FIG. 5 and generally includes two heat conductive pads 301, two heat dispensing plates 302 and two clamps 303, wherein the heat conductive pads 301 are attached to in sides of the two heat dispensing plates 302 which have hooks 302a, engaging holes 302b and engaging pieces 302c on a top thereof. When the two heat dispensing plates 302 are combined, a space is defined therebetween and the memory chip 20 is clamped. The engaging pieces 302c each have a downward positioning plates 302d which are located corresponding to the U-shaped restriction slots 304 on outsides of the heat dispensing plates 302. A through hole 305 is located above the restriction slot 304 and a guide slot 306 is located above the through hole 305 so that when the two clamps 303 clamp the two heat dispensing plates 302, the two clamps 303 are mounted onto the two positioning plates 302d and the hoods 303a are engaged with the through hole 305 via the guide slots 306 so that the two heat dispensing plates 302 can clamp the memory chip 20. The heat generated from the memory chip 20 is conducted to the heat dispensing unit 30 and releases to air.

[0005] However, the conventional heat dispensing unit 30 includes a complicated structure which includes hooks 303a, restriction slots 304, through holes 305 and guide slots 306. The complicated structure makes the heat dispensing unit 30 to be expensive and time consuming when manufacturing. Besides, there is a gap between the two heat dispensing plates so that dust easily enters into the space and is accumulated on the surface of the heat dispensing unit and reduces the efficiency of the heat dispensing unit.

[0006] The present invention intends to provide a heat dispensing unit for memory chips wherein the heat dispensing plates are easily manufactured and can be quickly connected to each other.

SUMMARY OF THE INVENTION

[0007] The present invention relates to a heat dispensing unit which comprises two heat dispensing plates between which the memory chip is clamped. Each heat dispensing plate has a plurality of bending plates which split from an inside of each of the heat dispensing plates and each bending plate has a first insertion and a first hole. The first insertions on one of the two heat dispensing plates are engaged with the first holes of the other heat dispending plate so connect the two heat dispensing plates.

[0008] The primary object of the present invention is to provide a heat dispending unit for memory chips and the two heat dispensing plates are easily connected to each other and the gap between the two heat dispensing plates are covered by two flanges on two respective tops of the two heat dispensing plates.

[0009] The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG. 1 is an exploded view to show the heat dispensing unit of the present invention;

[0011] FIG. 2 is a perspective view to show the heat dispensing unit of the present invention;

[0012] FIG. 3 is a perspective view to show the heat dispensing unit of the present invention, wherein a part of the unit is removed for clarity purpose;

[0013] FIG. 3A shows an enlarged view of the first hole and the first insertion of the heat dispensing unit of the present invention;

[0014] FIG. 4 is a perspective view to show a memory chip is clamped between the two heat dispensing plates of the heat dispensing unit of the present invention, and

[0015] FIG. 5 is an exploded view to show the conventional heat dispensing unit.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Referring to FIGS. 1, 2, 3, 3A and 4, the heat dispensing unit 1 of the present invention comprises two heat dispensing plates 10 and each have a heat conductive pad 15 attached to the inside thereof. A plurality of bending plates 11 split from the inside of each of the heat dispensing plates 10 and do not contact the heat conductive pad 15. Each bending plate 11 has a first insertion 111 and a first hole 112. The first insertions 111 are formed by splitting material from the bending plates 11 and define the first holes 112. Each heat dispensing plate 10 includes a flange 12 being from a top thereof so as to cover a gap between the two heat dispensing plates 10. Each of the flanges 12 includes a second insertion 13 and a second hole 14.

[0017] When connecting the two heat dispensing plates 10 to each other, the first insertions 111 on one of the two heat dispensing plates 10 are engaged with the first holes 112 of the other heat dispending plate 10, and the second insertion 13 are engaged with the second holes 14.

[0018] A memory chip 20 is clamped between the two heat dispensing plates 10 and in contact with the heat conductive pads 15.

[0019] The heat dispensing unit 1 includes flanges 12 which cover the gap between the two heat dispensing plates 10 so as to prevent dust from entering the gap and accumulating on the memory chip 20 and/or the heat dispensing pads 15. The heat dispensing unit 1 does not have complicated structure and can be easily manufactured and assembled. No extra clamps are needed for the heat dispensing unit 1 of the present invention and save a significant assembly time required.

[0020] While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims

1. A heat dispensing unit comprising: two heat dispensing plates and each having a plurality of bending plates which split from an inside of each of the heat dispensing plates, each bending plate having a first insertion and a first hole, the first insertions on one of the two heat dispensing plates being engaged with the first holes of the other heat dispending plate, and a memory chip clamped between the two heat dispensing plates.

2. The heat dispensing unit as claimed in claim 1, wherein the first insertions are formed by splitting material from the bending plates and define the first holes.

3. The heat dispensing unit as claimed in claim 1, wherein each heat dispending plate includes a heat conductive pad attached to the inside thereof.

4. The heat dispensing unit as claimed in claim 1, wherein each heat dispensing plate includes a flange being from a top thereof so as to cover a gap between the two heat dispensing plates.

5. The heat dispensing unit as claimed in claim 4, wherein each of the flanges includes a second insertion and a second hole.