U.S. patent application number 12/155853 was filed with the patent office on 2009-11-26 for heat sink for chips.
This patent application is currently assigned to CompTake Technology Inc.. Invention is credited to Wei-Hau Chen, Steven Yen.
Application Number | 20090288803 12/155853 |
Document ID | / |
Family ID | 41341217 |
Filed Date | 2009-11-26 |
United States Patent
Application |
20090288803 |
Kind Code |
A1 |
Chen; Wei-Hau ; et
al. |
November 26, 2009 |
Heat sink for chips
Abstract
A heat sink includes a first heat dispensing unit including
multiple heat dispensing plates between which chips are clamped. A
base board is connected on a top of the first heat dispensing unit
and two engaging portions are connected to two ends of the base
board. A second heat dispensing unit is fixed on a top of the base
board. Two clamps connect the base board to the first heat
dispensing unit. The second heat dispensing unit can be a fan, a
water-cooling unit or an aluminum extruding member.
Inventors: |
Chen; Wei-Hau; (Taipei
County, TW) ; Yen; Steven; (Taipei County,
TW) |
Correspondence
Address: |
Wei-Hau Chen
P.O.Box 44-2049
Taipei
10668
TW
|
Assignee: |
CompTake Technology Inc.
|
Family ID: |
41341217 |
Appl. No.: |
12/155853 |
Filed: |
June 11, 2008 |
Current U.S.
Class: |
165/80.2 |
Current CPC
Class: |
H01L 23/473 20130101;
H01L 2924/0002 20130101; H01L 23/467 20130101; H01L 23/3677
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/80.2 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 21, 2008 |
TW |
097208853 |
Claims
1. A heat sink comprising: a first heat dispensing unit including
multiple heat dispensing plates which are adapted to clamp chips
therebetween; a base board having a contact surface defined in an
underside of the base board, the contact surface being in contact
with a top of the first heat dispensing unit and two engaging
portions connected to two ends of the base board, a second heat
dispensing unit fixed on a top of the base board, and two clamps
connecting the base board to the first heat dispensing unit.
2. The heat sink as claimed in claim 1, wherein each heat
dispensing plate of the first heat dispensing unit includes
recesses defined in two ends thereof and the clamps are engaged
with the engaging portions of the base board and the recesses of
the first heat dispensing unit.
3. The heat sink as claimed in claim 2, wherein the engaging
portions are slots.
4. The heat sink as claimed in claim 1, wherein the base board
includes a hole defined therethrough and the second heat dispensing
unit is located corresponding to the hole.
5. The heat sink as claimed in claim 1, the second heat dispensing
unit is a fan.
6. The heat sink as claimed in claim 1, the second heat dispensing
unit is a water-cooling unit.
7. The heat sink as claimed in claim 1, the second heat dispensing
unit is an aluminum extruding member.
8. The heat sink as claimed in claim 1, wherein each clamp includes
a horizontal part with two flexible parts extending from two ends
of the horizontal part, each flexible part includes an engaging
part extending therefrom, the horizontal part are engaged with the
recesses of the first heat dispensing unit and the engaging parts
are engaged with the engaging portions of the base board.
9. The heat sink as claimed in claim 8, wherein the horizontal
part, the two flexible parts and the engaging parts of each clamp
are rod-like pieces.
Description
BACKGROUND OF THE INVENTION
[0001] (1) Field of the Invention
[0002] The present invention relates to a heat sink for removing
heat from chips and the fans are connected to the heat dispensing
plates by clamps.
[0003] (2) Description of the Prior Art
[0004] The chips used in electronic devices such as computers
generate a significant heat during high speed operation and the
heat may damage the chips and slow down the speed that the CPU
operates. A conventional way to remove heat from the chip is to
provide two heat dispensing plates between which the chip is
clamped, the heat generated from the chip is conducted to the heat
dispensing plates and escapes to the air via the heat dispensing
plates.
[0005] However, the latest chips generate much heat with higher
temperature than those made by old technology so that the
conventional heat dispensing plates cannot remove the heat
efficiently. This is because the area that heat is transferred from
the chip is insufficient and the conventional heat dispensing
plates can only remove a certain amount of heat because of limited
heat dispensing area. Extra heat removing units are needed and
because the limited space available in the computers so that how to
provide a high efficiency heat removing units is an important
problem.
[0006] The present invention intends to provide a heat sink for
chips and includes two heat dispensing units, one of the heat
dispensing units clamps the chip between heat dispensing plates
thereof and the other heat dispensing unit is connected on a base
board which is connected to the first heat dispensing unit by using
two clamps. The heat from the chip that is conducted to the first
heat dispensing unit can be removed by the second heat dispensing
unit.
SUMMARY OF THE INVENTION
[0007] The present invention relates to a heat sink-which comprises
a first heat dispensing unit composed of multiple heat dispensing
plates between which the chips are clamped. A base board has a
contact surface defined in an underside of the base board and the
contact surface is in contact with a top of the first heat
dispensing unit. Two engaging portions are connected to two ends of
the base board. A second heat dispensing unit is fixed on a top of
the base board. Two clamps connect the base board to the first heat
dispensing unit.
[0008] The present invention will become more obvious from the
following description when taken in connection with the
accompanying drawings which show, for purposes of illustration
only, a preferred embodiment in accordance with the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is an exploded view to show the chips and the heat
sink of the present invention;
[0010] FIG. 2 is a perspective view to show the connection of the
chips and the heat sink of the present invention;.
[0011] FIG. 3 is an exploded view to show the chips and a second
embodiment of the heat sink of the present invention;
[0012] FIG. 4 is a perspective view to show the connection of the
chips and the heat sink in FIG. 3 of the present invention;
[0013] FIG. 5 is an exploded view to show the chips and a third
embodiment of the heat sink of the present invention;
[0014] FIG. 6 is a perspective view to show the connection of the
chips and the heat sink in FIG. 5 of the present invention, and
[0015] FIG. 7 shows a side view of the connection of the chips and
the heat sink in FIG. 5 of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0016] Referring to FIGS. 1 and 2, the heat sink 10 for chips 5 of
the present invention comprises first heat dispensing units 3, a
base board 1, two second heat dispensing units 4 and two clamps 2,
wherein the first heat dispensing units 3 each include multiple
heat dispensing plates between which the chips 5 are clamped. The
base board 1 has a contact surface 11 defined in an underside of
the base board 1 and two holes 12 are defined through the base
board 1. A plurality of threaded holes 13 are located around the
holes 12. The contact surface 11 is in contact with a top of the
first heat dispensing units 3 and two engaging portions 14 are
connected to two ends of the base board 1. The engaging portions 14
in this embodiment are slots. The second heat dispensing units 4
are fixed on a top of the base board 1 by extending bolts through
passages 41 in the fans and are connected to the threaded holes 13.
The second heat dispensing units 4 are located corresponding to the
holes 12. The two clamps 2 connect the base board 1 to the first
heat dispensing units 3.
[0017] Each heat dispensing plate of the first heat dispensing
units 3 includes recesses 31 defined in two ends thereof and the
clamps 2 are engaged with the engaging portions 14 of the base
board 1 and the recesses 31 of the first heat dispensing units
3.
[0018] Each clamp 2 includes a horizontal part 21 with two flexible
parts 22 extending from two ends of the horizontal part 21, each
flexible part 22 includes an engaging part 23 extending therefrom.
The horizontal parts 21 are engaged with the recesses 31 of the
first heat dispensing units 3 and the engaging parts 23 are engaged
with the engaging portions 14 of the base board 1. In this
embodiment, the horizontal part 21, the two flexible parts 22 and
the engaging parts 23 are rod-like pieces.
[0019] The heat generated from the chips 5 is conducted to the heat
dispensing plates of the first heat dispensing units 3 and then
brought out from the first dispensing units 3 by the fans of the
second heat dispensing units 4 via the holes 12.
[0020] As shown in FIGS. 3 and 4, which show the second embodiment
of the heat sink 10 of the present invention, wherein the base
board 1 does not have the holes 12 as shown in FIG. 1 and the
second heat dispensing unit 4 is a water-cooling units.
[0021] As shown in FIGS. 5 to 7, which show the third embodiment of
the heat sink 10 of the present invention, wherein the second heat
dispensing unit 4 is an aluminum extruding member which includes
the base board 1 integrally formed on the underside of the aluminum
extruding member. The aluminum extruding member includes multiple
fins extending therefrom and the engaging portions are slots
defined between the fins so that the engaging parts 23 of the
clamps 2 are engaged with the slots.
[0022] While we have shown and described the embodiment in
accordance with the present invention, it should be clear to those
skilled in the art that further embodiments may be made without
departing from the scope of the present invention.
* * * * *