U.S. patent number D853,342 [Application Number D/615,042] was granted by the patent office on 2019-07-09 for high-performance semiconductor module.
This patent grant is currently assigned to Infineon Technologies AG. The grantee listed for this patent is Infineon Technologies AG. Invention is credited to Thomas Auer, Andras Bertalan, Jens Krugmann, Christoph Messelke.
![](/patent/grant/D0853342/USD0853342-20190709-D00000.png)
![](/patent/grant/D0853342/USD0853342-20190709-D00001.png)
![](/patent/grant/D0853342/USD0853342-20190709-D00002.png)
![](/patent/grant/D0853342/USD0853342-20190709-D00003.png)
![](/patent/grant/D0853342/USD0853342-20190709-D00004.png)
![](/patent/grant/D0853342/USD0853342-20190709-D00005.png)
United States Patent |
D853,342 |
Auer , et al. |
July 9, 2019 |
High-performance semiconductor module
Claims
CLAIM The ornamental design for a high-performance semiconductor
module, as shown and described.
Inventors: |
Auer; Thomas (Warstein,
DE), Bertalan; Andras (Warstein-Allagen,
DE), Krugmann; Jens (Paderborn, DE),
Messelke; Christoph (Arnsberg, DE) |
Applicant: |
Name |
City |
State |
Country |
Type |
Infineon Technologies AG |
Neubiberg |
N/A |
DE |
|
|
Assignee: |
Infineon Technologies AG
(Neubiberg, DE)
|
Appl.
No.: |
D/615,042 |
Filed: |
August 25, 2017 |
Foreign Application Priority Data
|
|
|
|
|
Feb 28, 2017 [EM] |
|
|
003772235-0003 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182
;257/678,684,690,691
;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253
;438/15,25,26,51,55,63,64,106 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Murphy, Bilak & Homiller,
PLLC
Description
FIG. 1 is a top, front and right side perspective view of a
high-performance semiconductor module showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front side elevational view thereof;
FIG. 4 is a right side elevational view thereof; and,
FIG. 5 is a top plan view thereof.
The broken line portions of the figure drawings are included to
show portions of the article that form no part of the claimed
design.
All surfaces not shown form no part of the claimed design.
* * * * *