U.S. patent number D804,435 [Application Number D/491,391] was granted by the patent office on 2017-12-05 for flap in an adhesive tape for semiconductor manufacturing.
This patent grant is currently assigned to Hitachi Chemical Company, Ltd.. The grantee listed for this patent is HITACHI CHEMICAL COMPANY, LTD.. Invention is credited to Rie Katou, Shinya Katou, Kouji Komorida, Michio Mashino, Takayuki Matsuzaki, Tatsuya Sakuta, Kouhei Taniguchi.
United States Patent |
D804,435 |
Taniguchi , et al. |
December 5, 2017 |
Flap in an adhesive tape for semiconductor manufacturing
Claims
CLAIM The ornamental design for a flap in an adhesive tape for
semiconductor manufacturing, as shown and described.
Inventors: |
Taniguchi; Kouhei (Ichihara,
JP), Matsuzaki; Takayuki (Ichihara, JP),
Katou; Shinya (Ichihara, JP), Komorida; Kouji
(Ichihara, JP), Mashino; Michio (Ichihara,
JP), Sakuta; Tatsuya (Ichihara, JP), Katou;
Rie (Ichihara, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
HITACHI CHEMICAL COMPANY, LTD. |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Hitachi Chemical Company, Ltd.
(Tokyo, JP)
|
Appl.
No.: |
D/491,391 |
Filed: |
May 20, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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29413518 |
Feb 16, 2012 |
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29389787 |
Apr 3, 2012 |
D656910 |
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Foreign Application Priority Data
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Oct 15, 2010 [JP] |
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D2010-024764 |
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Current U.S.
Class: |
D13/180 |
Current International
Class: |
1303 |
Field of
Search: |
;D10/71,75 ;D19/69
;D24/189 ;D13/182 ;33/494,758,562,759 ;101/288 ;206/390 ;40/638,641
;428/43,343,345,353,114,455 ;D7/585 ;D20/22,42 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Other References
Office Action dated Jan. 18, 2013, in Design U.S. Appl. No.
29/413,539. cited by applicant.
|
Primary Examiner: Murphy; Austin
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery,
LLP
Description
FIG. 1 is a top plan view of a flap in an adhesive tape for
semiconductor manufacturing incorporating our new design;
FIG. 2 is a bottom plan view of the flap of FIG. 1;
FIG. 3 is a cross-sectional view taken at line 3-3 in FIG. 1;
FIG. 4 is an enlarged view of portion 4-4, 4-4 in FIG. 1; and,
FIG. 5 is a perspective view of the flap in use.
The broken lines are included for the purpose of illustrating
environmental structure and form no part of the claimed design.
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